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OCAP CHASSIS PARTS Product Design Engineer Interview Questions and Answers

Updated 7 Oct 2024

OCAP CHASSIS PARTS Product Design Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. First angle projection
  • Q2. What is Tolarenc grade
  • Ans. 

    Tolarenc grade is a measurement of the tolerance level in engineering and manufacturing processes.

    • Tolarenc grade is used to specify the allowable deviation from a specified dimension in a part or product.

    • It helps ensure that parts fit together properly and function as intended.

    • For example, a Tolarenc grade of ±0.005mm means that the actual dimension of a part can vary by up to 0.005mm from the specified dimension.

  • Answered by AI

Interview questions from similar companies

Interview experience
2
Poor
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
No response

I applied via Referral and was interviewed in Jan 2024. There were 2 interview rounds.

Round 1 - Tool test 

(2 Questions)

  • Q1. Tool test on catia v5
  • Ans. A tool test will be conducted on catia v5 either a part or surface design
  • Answered Anonymously
  • Q2. Model the given part from the 2d drawings
Round 2 - Technical 

(1 Question)

  • Q1. Fundamental questions regarding plastic design, gd&t, catia v5 and engineering drawing.

Interview Preparation Tips

Topics to prepare for Seoyon E-hwa Automotive Design Engineer interview:
  • Automotive plastic design using v5
  • Gd&t
  • Catia v5
Interview preparation tips for other job seekers - Commitment of 3 years been expected, in the selection process.
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Walk-in and was interviewed in Mar 2024. There were 3 interview rounds.

Round 1 - Aptitude Test 

Aptitude on basics of mechanical engineering

Round 2 - Group Discussion 

Topics on AI implementation in industry

Round 3 - HR 

(2 Questions)

  • Q1. How do you know about company
  • Ans. 

    Researched online, read company website, news articles, and reviews from current and former employees.

    • Researched online to gather information about the company

    • Visited company website to understand their products, services, and values

    • Read news articles related to the company to stay updated on recent developments

    • Looked at reviews from current and former employees to get insights into company culture

  • Answered by AI
  • Q2. Is it ok to shift
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
Not Selected

I applied via Approached by Company and was interviewed in Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Tool test + F2F technical interview
Round 3 - One-on-one 

(1 Question)

  • Q1. Managerial round with mix of HR

Interview Preparation Tips

Topics to prepare for Inteva Products Design Engineer interview:
  • Gd t
  • Sheet Metal
Interview preparation tips for other job seekers - Be careful what technical terms to add in the resume.. the questions will be based on those keywords

I applied via Recruitment Consulltant and was interviewed in May 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
Round 3 - Technical 

(1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
Round 4 - HR 

(1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR

OCAP CHASSIS PARTS Interview FAQs

How many rounds are there in OCAP CHASSIS PARTS Product Design Engineer interview?
OCAP CHASSIS PARTS interview process usually has 1 rounds. The most common rounds in the OCAP CHASSIS PARTS interview process are One-on-one Round.
What are the top questions asked in OCAP CHASSIS PARTS Product Design Engineer interview?

Some of the top questions asked at the OCAP CHASSIS PARTS Product Design Engineer interview -

  1. What is Tolarenc gr...read more
  2. First angle project...read more

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