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Tessolve Semiconductor Design Engineer Interview Questions and Answers

Updated 3 Sep 2024

Tessolve Semiconductor Design Engineer Interview Experiences

2 interviews found

Design Engineer Interview Questions & Answers

user image Juhi Singh Padole

posted on 3 Sep 2024

Interview experience
1
Bad
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(1 Question)

  • Q1. Tell me about yourself
  • Ans. 

    I am a passionate and experienced Design Engineer with a strong background in mechanical engineering.

    • Graduated with a degree in Mechanical Engineering from XYZ University

    • Worked for 5 years at ABC Company designing innovative products

    • Proficient in CAD software such as SolidWorks and AutoCAD

    • Strong problem-solving skills and attention to detail

    • Passionate about staying updated on the latest design trends and technologies

  • Answered by AI
Round 2 - One-on-one 

(1 Question)

  • Q1. Past experience
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Aptitude Test 

Basic Electronics,Quants,Verilog and code output

Round 2 - Technical 

(2 Questions)

  • Q1. Universal gates ,flip flops..
  • Q2. Basic c programming, verilog code

Design Engineer Interview Questions Asked at Other Companies

Q1. Stress Strain curve, What will happen if you use petrol in diesel ... read more
Q2. what is the difference between lathe and milling machine?
Q3. What is design considerations to mske while designing a Part?
Q4. Which are the operations performed on sheet metal to increase the ... read more
Q5. WHAT IS GD&T IN MECHANICAL? DESCRIBLE ALL IN DETAILS .

Interview questions from similar companies

Interview Preparation Tips

Round: Resume Shortlist
Experience: This is the most crucial part. For me about getting job, my resume serves at least 70% of achievement. Resume should be most precise to the company you apply.
Tips: Don't bluff. But market yourself with what you have. Show each and every achievement of yours as if its a great one. Play with words to get the effect. Resume should be in such a way that just by seeing it, interviewer should know how unique you are.

Round: Technical Interview
Experience: They have mostly asked basic questions from Control systems, networks, analog devices.
Tips: Be strong in basics. Its not one night prepeartion. Just try to be logical in the interview. Even though you don't know the answer, think logically and show them how you thinking goes.

Round: HR Interview
Experience: This is basically just for nominal.
Tips: But every word you say counts. Mainly in this round. Show your interest clearly. Be friendly. But don't ne open about everything

General Tips: Try your best. Just don't stick for single company. Prepare in general. By the way, I got this through internship.
College Name: NIT ROURKELA
Motivation: Its a core company of electronics, which is good in the field of VLSI. Though right now, it seems to be a normal company. The experience is really worth to continue in this field.

Interview Questionnaire 

3 Questions

  • Q1. Why our company?
  • Ans. 

    Your company's innovative approach to design and engineering aligns with my passion for pushing boundaries and creating impactful solutions.

    • Your company's reputation for excellence in the industry

    • The opportunity to work with a talented and diverse team

    • The chance to work on challenging and exciting projects

    • The potential for professional growth and development

    • The company's commitment to sustainability and social responsi

  • Answered by AI
  • Q2. What can you offer to our company?
  • Ans. 

    I can offer my expertise in design engineering, strong problem-solving skills, and a passion for innovation.

    • Expertise in design engineering

    • Strong problem-solving skills

    • Passion for innovation

    • Ability to work collaboratively in a team environment

    • Experience with CAD software such as SolidWorks and AutoCAD

    • Familiarity with manufacturing processes and materials

    • Excellent communication and presentation skills

  • Answered by AI
  • Q3. You have a good CG why aren’t you going for higher studies?
  • Ans. 

    I believe that practical experience is equally important as higher studies in my field.

    • I have gained valuable experience through internships and projects

    • I am constantly learning and improving my skills through online courses and workshops

    • I am open to pursuing higher studies in the future if it aligns with my career goals

    • I believe that hands-on experience is crucial in the design engineering field

  • Answered by AI

Interview Preparation Tips

Round: Test
Experience: Two tests were there. One CAT type questions- maths, quant, verbal Another related to the department. Both were objective type.
Tips: Even without any CAT preparation, you can clear it quite easily. For the department related exam, a basic preparation of core subjects for placements is enough. Most of the questions were CV based. No negative marks, I think. So fill all the questions.

Round: Interview
Experience: It went on for about 20 mins. All were technical questions and most of them were from the things I’ve stated in my CV.
Tips: Write only what you’ve done in your CV, if not at least be prepared to defend everything. Otherwise if you are confident with your basics it should not be a big problem to clear this round.

Round: Interview
Experience: By the time I got till here, I already knew that I almost got placed. So it was very friendly and went on for about 10 minutes.

Skill Tips: Being a core design consultancy, more emphasis was on academic performance. I think a CGPA above 7.5 or 8 is very ideal. They looked deep into my internship and project. Various questions about what I had done there and how well I got practical exposure were tested.
College Name: IIT KHARAGPUR

Interview Questionnaire 

2 Questions

  • Q1. Previous experience and some technical questions in subjects
  • Q2. Package

Interview Preparation Tips

Round: Resume Shortlist
Experience: technical skill
tool knowledge
experience

Round: Test
Experience: tool test

I applied via Approached by Company and was interviewed in Nov 2017. There were 4 interview rounds.

Interview Preparation Tips

Round: Resume Shortlist
Experience: Design Engineer

Round: Test
Experience: Tool test in CATIA V5 Software

General Tips: Design basics,
CATIA V5 tool knowledge
Skills: Engineering Drawing, Mechanical Engineering, Design Engineering, Catia
Duration: <1 week

Interview Questionnaire 

1 Question

  • Q1. About project

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident and freely express
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed before Dec 2023. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. Whats is the gd&t?
  • Q2. What is position tolerance?

Interview Questionnaire 

1 Question

  • Q1. Tell me about your engineering project
  • Ans. 

    I designed a robotic arm for industrial automation.

    • Developed the mechanical design and kinematics of the robotic arm

    • Implemented control algorithms for precise movement and positioning

    • Collaborated with electrical engineers to integrate sensors and actuators

    • Conducted testing and optimization to ensure reliable and efficient operation

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - It was quite easy for freshers
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Recruitment Consulltant and was interviewed in Sep 2023. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Properly align and format text in your resume. A recruiter will have to spend more time reading poorly aligned text, leading to high chances of rejection.
View all Resume tips
Round 2 - Technical 

(4 Questions)

  • Q1. Types of Plastic?
  • Ans. 

    There are various types of plastics, each with unique properties and uses.

    • Common types include PET, PVC, HDPE, LDPE, PP, PS, and ABS

    • Plastics can be categorized as thermosetting or thermoplastic

    • Each type of plastic has different characteristics such as flexibility, durability, and heat resistance

  • Answered by AI
  • Q2. Plastic categories?
  • Q3. Diff b/w hot runner & cold runner?
  • Q4. Selection of material?
  • Ans. 

    Selection of material is based on factors like mechanical properties, cost, availability, and environmental impact.

    • Consider mechanical properties such as strength, stiffness, and toughness

    • Evaluate cost and availability of materials

    • Assess environmental impact and sustainability

    • Examples: steel for high strength applications, aluminum for lightweight designs, and plastics for cost-effective solutions

  • Answered by AI
Round 3 - Technical 

(2 Questions)

  • Q1. Describe Injection molding
  • Ans. 

    Injection molding is a manufacturing process for producing parts by injecting material into a mold.

    • Material is heated and injected into a mold cavity

    • The material cools and solidifies, taking the shape of the mold

    • Commonly used for producing plastic parts in mass production

    • Used in various industries such as automotive, electronics, and consumer goods

  • Answered by AI
  • Q2. Molding method?
  • Ans. 

    Various molding methods are used in design engineering to create products with different materials and shapes.

    • Injection molding: commonly used for mass production of plastic parts

    • Blow molding: used for hollow objects like bottles

    • Compression molding: suitable for materials like rubber and thermosetting plastics

    • Rotational molding: used for large, hollow products like tanks and playground equipment

  • Answered by AI

Interview Preparation Tips

Topics to prepare for L&T Technology Services Design Engineer interview:
  • Plastic Product Design
  • Plastic Injection Molding
Interview preparation tips for other job seekers - Read plastic & plastic molding related topics?
Contribute & help others!
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Tessolve Semiconductor Interview FAQs

How many rounds are there in Tessolve Semiconductor Design Engineer interview?
Tessolve Semiconductor interview process usually has 2-3 rounds. The most common rounds in the Tessolve Semiconductor interview process are One-on-one Round, Resume Shortlist and Aptitude Test.
How to prepare for Tessolve Semiconductor Design Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Tessolve Semiconductor. The most common topics and skills that interviewers at Tessolve Semiconductor expect are Perl, Wireless, Automotive, Product Engineering and CMOS.
What are the top questions asked in Tessolve Semiconductor Design Engineer interview?

Some of the top questions asked at the Tessolve Semiconductor Design Engineer interview -

  1. basic c programming, verilog c...read more
  2. Universal gates ,flip flop...read more

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Tessolve Semiconductor Design Engineer Interview Process

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