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Tessolve Semiconductor Associate Engineer Interview Questions and Answers

Updated 18 Jan 2025

Tessolve Semiconductor Associate Engineer Interview Experiences

2 interviews found

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
No response

I applied via Company Website and was interviewed in Jul 2024. There were 2 interview rounds.

Round 1 - Aptitude Test 

Aptitude level is easy to medium

Round 2 - Technical 

(4 Questions)

  • Q1. Questions on basic electronics concepts like semiconductors, transistors etc
  • Q2. How the current flow in transistors
  • Q3. Personal introduction
  • Q4. About my projects
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
No response

I applied via Company Website and was interviewed in Jul 2024. There were 2 interview rounds.

Round 1 - Aptitude Test 

This round is classified as easy to medium.

Round 2 - Technical 

(2 Questions)

  • Q1. How the current is flowed in the semiconductor
  • Q2. Questions on resistors,transistors etc

Associate Engineer Interview Questions Asked at Other Companies

asked in Nagarro
Q1. Count Ways To Reach The N-th StairsYou have been given a number o ... read more
asked in Nagarro
Q2. Trailing Zeros in FactorialYou are given an integer N, you need t ... read more
asked in Nagarro
Q3. Convert String You are given a string 'STR'. You have to convert ... read more
asked in Tata Steel
Q4. What are the test done during maintenance of a power transformer?
asked in Tata Steel
Q5. how to control the speed of an EOT crane without VFD?

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Questions about UVm
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(6 Questions)

  • Q1. Technical Questions on Previous company work role. Basic electrical. About PLC Troubleshooting.
  • Q2. On which plc's you work What idea about machines
  • Ans. 

    I have worked on Allen Bradley, Siemens, and Mitsubishi PLCs. I have a good understanding of machines and their operations.

    • I have experience working with Allen Bradley, Siemens, and Mitsubishi PLCs

    • I have a good understanding of how machines operate and their components

    • I am familiar with programming languages such as ladder logic and structured text

    • I have worked on various types of machines including conveyor systems, p

  • Answered by AI
  • Q3. About sensor,contractor, wiring
  • Q4. What is know about TPM
  • Ans. 

    TPM stands for Total Productive Maintenance, a system that aims to maximize equipment effectiveness and minimize downtime.

    • TPM involves all employees in the maintenance process

    • It focuses on proactive maintenance to prevent breakdowns

    • TPM aims to improve overall equipment effectiveness (OEE)

    • It includes regular cleaning, inspection, and lubrication of equipment

    • TPM also involves training employees on maintenance and safety

  • Answered by AI
  • Q5. About maintenance documentation
  • Q6. How you handle manpower

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident, and realistic. Add point in resume which you really work on it.

Skills evaluated in this interview

I applied via Walk-in and was interviewed in Jul 2022. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Technical 

(2 Questions)

  • Q1. About the what is written in resume
  • Q2. About electronic components

Interview Preparation Tips

Interview preparation tips for other job seekers - shud have better knowledge electronic field and PCB designing
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed in Mar 2023. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Properly align and format text in your resume. A recruiter will have to spend more time reading poorly aligned text, leading to high chances of rejection.
View all tips
Round 2 - Aptitude Test 

Aptitude and Logical Reasoning - 15MCQ's in 20min
Programming - 10MCQ's in 15min
Technical - 25MCQ's in 30min
Coding - 2qns in 45min

Round 3 - One-on-one 

(3 Questions)

  • Q1. SQL queries - Joins, specific data retrieval
  • Q2. OOP concepts with example code
  • Ans. 

    OOP concepts involve encapsulation, inheritance, and polymorphism in object-oriented programming.

    • Encapsulation: bundling data and methods that operate on the data into a single unit (class). Example: class Car { private String color; public void setColor(String c) { color = c; } }

    • Inheritance: creating new classes based on existing classes, inheriting their attributes and methods. Example: class SUV extends Car { privat...

  • Answered by AI
  • Q3. String questions, swapping two numbers
Round 4 - HR 

(1 Question)

  • Q1. Situation based questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident and showcase your strengths effectively.
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Questions about UVm
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Double-check your resume for any spelling mistakes. The recruiter may consider spelling mistakes as careless behavior or poor communication skills.
View all tips
Round 2 - Technical 

(6 Questions)

  • Q1. Technical Questions on Previous company work role. Basic electrical. About PLC Troubleshooting.
  • Q2. On which plc's you work What idea about machines
  • Ans. 

    I have worked on Allen Bradley, Siemens, and Mitsubishi PLCs. I have a good understanding of machines and their operations.

    • I have experience working with Allen Bradley, Siemens, and Mitsubishi PLCs

    • I have a good understanding of how machines operate and their components

    • I am familiar with programming languages such as ladder logic and structured text

    • I have worked on various types of machines including conveyor systems, p

  • Answered by AI
  • Q3. About sensor,contractor, wiring
  • Q4. What is know about TPM
  • Ans. 

    TPM stands for Total Productive Maintenance, a system that aims to maximize equipment effectiveness and minimize downtime.

    • TPM involves all employees in the maintenance process

    • It focuses on proactive maintenance to prevent breakdowns

    • TPM aims to improve overall equipment effectiveness (OEE)

    • It includes regular cleaning, inspection, and lubrication of equipment

    • TPM also involves training employees on maintenance and safety

  • Answered by AI
  • Q5. About maintenance documentation
  • Q6. How you handle manpower

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident, and realistic. Add point in resume which you really work on it.

Skills evaluated in this interview

I applied via Walk-in and was interviewed in Jul 2022. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Do not use an unprofessional email address such as cool_boy@email.com. It shows a lack of professionalism by the candidate.
View all tips
Round 2 - Technical 

(2 Questions)

  • Q1. About the what is written in resume
  • Q2. About electronic components

Interview Preparation Tips

Interview preparation tips for other job seekers - shud have better knowledge electronic field and PCB designing

I applied via campus placement at Gandhi Institute of Technology and Management, Visakhapatnam and was interviewed in Jun 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Be truthful in your resume. It is very easy to catch false or lies during the interview by asking basic questions.
View all tips
Round 2 - Aptitude Test 

Arithmetic Aptitude
Number Series
Profit and Loss
Data Interpretation

Round 3 - Technical 

(2 Questions)

  • Q1. Most of the questions are from JAVA, SQl and Python Situational based questions Hobbies
  • Q2. Garbage Collection in Java SQL queries
  • Ans. 

    Garbage collection in Java is an automatic process of freeing up memory by removing unused objects.

    • Java uses a mark-and-sweep algorithm for garbage collection

    • Objects that are no longer referenced by any part of the program are eligible for garbage collection

    • System.gc() can be used to suggest garbage collection, but it is not guaranteed to run immediately

    • Garbage collection can cause performance issues if not managed pro

  • Answered by AI

Interview Preparation Tips

Topics to prepare for Micron Technology Associate Software Engineer interview:
  • Java
  • SQL
  • Python
Interview preparation tips for other job seekers - Tough aptitude round
And
Coding Round
Should have good skills in Java and SQl.

Skills evaluated in this interview

Tessolve Semiconductor Interview FAQs

How many rounds are there in Tessolve Semiconductor Associate Engineer interview?
Tessolve Semiconductor interview process usually has 2 rounds. The most common rounds in the Tessolve Semiconductor interview process are Aptitude Test and Technical.

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Tessolve Semiconductor Associate Engineer Salary
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₹3.5 L/yr - ₹8.2 L/yr
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