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Tessolve Semiconductor Design & Verification Engineer Interview Questions and Answers

Updated 31 Dec 2024

Tessolve Semiconductor Design & Verification Engineer Interview Experiences

4 interviews found

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
No response

I appeared for an interview in Dec 2024.

Round 1 - Technical 

(2 Questions)

  • Q1. Sv hvm questions on constraiants and assertions
  • Q2. Questions on resume projects
Round 2 - Technical 

(2 Questions)

  • Q1. Questions on protocols
  • Q2. Sv uvm questions
Round 3 - HR 

(2 Questions)

  • Q1. Salary and pckge discussion
  • Q2. Details on client interview
Round 4 - Client Interview 

(2 Questions)

  • Q1. Projects and challenges
  • Q2. Sv uvm basics
Interview experience
3
Average
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Naukri.com and was interviewed in Jul 2023. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(5 Questions)

  • Q1. SV, UVM, and interview questions related to AMBA protocol.
  • Q2. Logical questions based on constraint
  • Q3. Question based on SV oops
  • Q4. Question based on UVM tb
  • Q5. Question bases on assertions and coverage

Interview Preparation Tips

Interview preparation tips for other job seekers - SV, UVM, and some basic protocol.

Design & Verification Engineer Interview Questions Asked at Other Companies

asked in Frenus Tech
Q1. 1. XOR gate 2. How you compare two 4 bit numbers only using gates ... read more
Q2. Why $cast is used? Types of arrays
Q3. Explain setup time and hold time and what is the importance of se ... read more
Q4. What is mux? What are the use of select lines in mux?
asked in Samsung
Q5. how to call an interface signal at sequence level in uvm?
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Aptitude Test 

Aptitude+digital electronics+vhdl

Interview Preparation Tips

Interview preparation tips for other job seekers - Tough level questions
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Oct 2022. There were 2 interview rounds.

Round 1 - Aptitude Test 

A combination of Technical and Numerical aptitude. Questions on digital design, edc, vlsi.

Round 2 - One-on-one 

(3 Questions)

  • Q1. Questions on Digital Design
  • Q2. Questions on OOPS
  • Q3. Basic programming

Tessolve Semiconductor interview questions for designations

 Verification Engineer

 (1)

 Design Engineer

 (2)

 PCB Design Engineer

 (3)

 Mechanical Engg. Design

 (2)

 Digital Design Engineer

 (1)

 Post Silicon Validation Engineer

 (5)

 Test Engineer

 (7)

 Software Engineer

 (2)

Interview questions from similar companies

I applied via LinkedIn and was interviewed before Jun 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Medium level

Round 3 - Coding Test 

RTL design, test bench , Simulation.

Round 4 - Technical 

(1 Question)

  • Q1. VLSI ic design, CMOS, digital electronics concepts.

Interview Preparation Tips

Interview preparation tips for other job seekers - Particularly for interns, you need to through with concepts related to your experience like hdl languages verilog, sv, scripting language is an added advantage, verification methodology, any projects, AMBA Protocol,Axi....any thing you mentioned in your resume must be Crystal clear..
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Sep 2024. There were 2 interview rounds.

Round 1 - Aptitude Test 

Basic aptitude-10 question,digital moderate -Question,analog moderate -10 question,verilog and system verilog -10 question

Round 2 - One-on-one 

(3 Questions)

  • Q1. Latches and flip flop all characteristics equation and proof of the characteristics equation in flip flop.applications of flip flop
  • Q2. OOPS,INHERITANCE,VERILOG,BLOCKING - NON BLOCKING ASSIGNMENT OPERATOR and all the basic operations of verilog .
  • Q3. Discussion on work experience.

Interview Preparation Tips

Interview preparation tips for other job seekers - Be bonafide with your fundamentals core of digital circuits and design .

I applied via Company Website and was interviewed in Mar 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Had basic aptitude questions, verilog , c programming, digital electronics, analog electronics,computer architecture.

Round 3 - Technical 

(2 Questions)

  • Q1. Basic questions related to electronics
  • Q2. Question related to aptitude

Interview Preparation Tips

Interview preparation tips for other job seekers - As a fresher concentrate more on basics related to digital electronics,analog electronics, vlsi fundamentals, verilog
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. Project questions
  • Q2. Sv and uvm basics
Round 2 - One-on-one 

(2 Questions)

  • Q1. Pcie basic questions
  • Q2. SV and UVM basics
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
-

I applied via Referral and was interviewed in Apr 2024. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. Simple FSM given similar to mux and asked for testcases and assertions.
  • Q2. Coverage to write transitions of states.
  • Ans. 

    Coverage-driven verification techniques are used to ensure all possible state transitions are exercised.

    • Coverage metrics like state, transition, and toggle coverage can be used to track the completeness of state transitions.

    • Writing directed tests to cover specific state transitions can help achieve higher coverage.

    • Random stimulus generation can also be used to explore different state transitions.

    • Functional coverage can...

  • Answered by AI
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
-
Result
No response

I appeared for an interview before Jun 2023.

Round 1 - Technical 

(2 Questions)

  • Q1. Explain task and functions?
  • Ans. 

    Tasks and functions refer to the specific responsibilities and roles assigned to an individual within a job or project.

    • Tasks are specific actions or activities that need to be completed within a certain timeframe.

    • Functions are broader roles or responsibilities that encompass multiple tasks and contribute to the overall goal.

    • Examples of tasks include writing test cases, debugging code, and creating design specifications...

  • Answered by AI
  • Q2. What are blocking and non blocking assignments?
  • Ans. 

    Blocking assignments wait for the assigned value to be calculated before moving on to the next statement, while non-blocking assignments allow multiple assignments to occur simultaneously.

    • Blocking assignments use the = operator, while non-blocking assignments use the <= operator

    • Blocking assignments are executed sequentially in the order they appear in the code, while non-blocking assignments are executed concurrently

    • Bl...

  • Answered by AI

Skills evaluated in this interview

Tessolve Semiconductor Interview FAQs

How many rounds are there in Tessolve Semiconductor Design & Verification Engineer interview?
Tessolve Semiconductor interview process usually has 2-3 rounds. The most common rounds in the Tessolve Semiconductor interview process are Technical, Resume Shortlist and Aptitude Test.
How to prepare for Tessolve Semiconductor Design & Verification Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Tessolve Semiconductor. The most common topics and skills that interviewers at Tessolve Semiconductor expect are Debugging, Design Verification, Project Life Cycle, RTL and System Verilog.
What are the top questions asked in Tessolve Semiconductor Design & Verification Engineer interview?

Some of the top questions asked at the Tessolve Semiconductor Design & Verification Engineer interview -

  1. SV, UVM, and interview questions related to AMBA protoc...read more
  2. Question bases on assertions and cover...read more
  3. Sv hvm questions on constraiants and asserti...read more

Tell us how to improve this page.

Tessolve Semiconductor Design & Verification Engineer Interview Process

based on 4 interviews

Interview experience

4
  
Good
View more
Join Tessolve Semiconductor Bringing speed, accuracy, and efficiency to the silicon space.
Tessolve Semiconductor Design & Verification Engineer Salary
based on 30 salaries
₹5 L/yr - ₹17 L/yr
20% more than the average Design & Verification Engineer Salary in India
View more details

Tessolve Semiconductor Design & Verification Engineer Reviews and Ratings

based on 2 reviews

3.5/5

Rating in categories

2.0

Skill development

2.5

Work-life balance

2.5

Salary

1.5

Job security

3.5

Company culture

2.0

Promotions

2.5

Work satisfaction

Explore 2 Reviews and Ratings
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