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Molex Design Engineer Interview Questions and Answers

Updated 8 Jul 2024

Molex Design Engineer Interview Experiences

3 interviews found

Design Engineer Interview Questions & Answers

user image govekar prajwal

posted on 8 Jul 2024

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(1 Question)

  • Q1. Introduction about ourselves
Round 2 - One-on-one 

(1 Question)

  • Q1. Personal interview ( personality test )
Round 1 - Technical 

(1 Question)

  • Q1. Basic questions about your working in last company

Interview Preparation Tips

Interview preparation tips for other job seekers - Know about basics very well...Prepare very well

Design Engineer Interview Questions Asked at Other Companies

Q1. Stress Strain curve, What will happen if you use petrol in diesel ... read more
Q2. what is the difference between lathe and milling machine?
Q3. What is design considerations to mske while designing a Part?
Q4. Which are the operations performed on sheet metal to increase the ... read more
Q5. WHAT IS GD&T IN MECHANICAL? DESCRIBLE ALL IN DETAILS .

I applied via Recruitment Consulltant and was interviewed before Aug 2021. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. What is aspect ratio?
  • Ans. 

    Aspect ratio is the ratio of an object's width to its height.

    • Aspect ratio is commonly used in design and engineering to maintain proportionality.

    • It is often expressed as a ratio, such as 16:9 for a widescreen TV.

    • Aspect ratio can affect the visual perception and usability of a product.

    • It is important to consider aspect ratio when designing graphics or layouts for different devices or mediums.

  • Answered by AI
  • Q2. How do you decide stackup?
  • Ans. 

    Stackup is decided based on the number of layers, signal integrity requirements, and manufacturing constraints.

    • Consider the number of layers required for the design

    • Evaluate signal integrity requirements and impedance control

    • Take into account manufacturing constraints such as minimum trace width and spacing

    • Balance cost and performance

    • Use simulation tools to optimize the stackup

    • Consult with PCB fabricators for their reco

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Need to improve skills on Highspeed concepts

Interview questions from similar companies

Design Engineer Interview Questions & Answers

Texas Instruments user image Sai Vihari Chaturvedula

posted on 28 Aug 2016

I applied via Campus Placement

Interview Preparation Tips

Round: Resume Shortlist
Experience: Resume is not given any due importance in selection for further rounds . But honesty is very important as it counts once you are selected for HR round .
Tips: Try to be one hundred percent honest . And put your projects and course work in the beginning. They don't care your POR s and extra curricular activities.

Round: Test
Experience: Hardware - Questions are mainly from ELECTRICAL CIRCUITS (RLC ckts) , Analog ckts. Amplifiers , Opamps , digital system design . Aptitude section is very easy . Hardware section is tough .I felt Signal processing was easier , indeed I got selected for that profile .
Tips: Prepare thoroughly these courses :- EMC , DIGITAL SYSTEMS, NETWORKS AND SYSTEMS,ANALOG & DIGITAL SIGNAL PROCESSING , ANALOG CKTS COURSES .THAT SHOULD BE ENOUGH .
Duration: 90 - Signal Processing minutes
Total Questions: 120 - Hardware and aptitude

Round: Group Discussion
Experience: No
Tips: No

Duration: 2
College Name: IIT Madras

Interview Preparation Tips

Round: Test
Experience: The selection procedure is a test followed by tech interview and an HR interview.
The test had two parts:
 Aptitude (common across all profiles)
 A tech. test (separate for each profile)

Round: Interview
Experience: The tech interview was the important one and the HR interview was just about knowing the student and vice-versa. The tech interview was more concentrated on the basics and more importance was given to the approach of solving the problem rather than solving the problem itself.
No CGPA cutoff.

Round: Interview
Experience: Not very important.

General Tips: The work is well structured and executed. There is a lot of opportunity for more technical learning. Interns are also included into the teams and this helps the intern on knowing about the things going around them and gets an overall view of how things work.
As a whole, the work is very good, and exceeds all the expectations of the students.
College Name: IIT Madras

Interview Preparation Tips

Round: Technical Interview
Experience: They asked me about my thesis and some device related questions as my thesis was on modelling of device. Questions were basic and were related to variation of device parameters with environmental factors and other parameters. Apart from that, several questions related to basic digital circuits were also asked concerning flip flops, latches, setup time and hold time. The technical interview went on for approximately 1 hour.

Round: HR Interview
Experience: The HR round lasted for about 5 mins only. The HR person asked me whether I were interested in going for PhD or not and about my hobbies and interests. Overall, the interviewers are very friendly and asked basic questions only.
Tips: Prepare your CV well, have a good CPI, do your thesis sincerely, concentrate on your basics and you will stand a very good chance of getting selected.


General Tips: Do the courses thoroughly, make good course projects and start preparing for the placement session at least 1 month early.

Don’t ever mention to them that you are interested in higher studies even if you are applying. In case you don’t get a job at your targeted company, don’t lose hope and move on to the next one.

Concentrate on your preparation and the things that are of utmost importance, don’t get bogged down by pressure. Be optimistic and cheerful, because confidence really helps during interviews.

Final Tips :
1. Be confident and enthusiastic in your response to questions because you have to make them understand that you are interested in the profile.
2. Chalk out a plan to strengthen your strong points and address the weak ones.

College Name: IIT Kanpur
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Mar 2023. There were 3 interview rounds.

Round 1 - One-on-one 

(1 Question)

  • Q1. Explain functional and code coverage.
  • Ans. 

    Functional coverage ensures all functions are tested, while code coverage ensures all lines of code are executed.

    • Functional coverage focuses on testing the functionality of the design.

    • Code coverage ensures that all lines of code are executed during testing.

    • Functional coverage helps in identifying missing or incomplete functionality.

    • Code coverage helps in identifying untested code paths.

    • Example: Functional coverage may ...

  • Answered by AI
Round 2 - Technical 

(1 Question)

  • Q1. Questions on AHB protocol.
Round 3 - Technical 

(1 Question)

  • Q1. Digital design based questions.

Skills evaluated in this interview

I applied via Company Website and was interviewed in Dec 2021. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. Design exor,nand using 2:1 mux Design d latch using 2:1 mux Design frequency divide by 3 circuit
  • Ans. 

    Design exor, nand and d latch using 2:1 mux and frequency divide by 3 circuit

    • For exor using 2:1 mux, connect one input to select line and other to output of nand gate using 2:1 mux

    • For nand using 2:1 mux, connect one input to select line and other to inverted output of and gate using 2:1 mux

    • For d latch using 2:1 mux, connect data input to select line and connect inverted output to one input and output to other input

    • For ...

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare digital design concepts throughly amd resume.
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed before Aug 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

Questions covering various aspects

Round 2 - Technical 

(2 Questions)

  • Q1. Design a mood 3 counter
  • Ans. 

    A mood 3 counter is a device that tracks and displays the user's mood on a scale of 1-3.

    • Design a simple interface with 3 buttons for the user to input their mood (happy, neutral, sad)

    • Include a display screen to show the current mood level

    • Implement a reset button to clear the mood counter

    • Consider adding a visual indicator such as colored LEDs for each mood level

  • Answered by AI
  • Q2. What are the three states
  • Ans. 

    The three states refer to the three fundamental states of matter: solid, liquid, and gas.

    • Solid: particles are closely packed together and have a fixed shape and volume (e.g. ice)

    • Liquid: particles are close together but can move past each other, taking the shape of their container (e.g. water)

    • Gas: particles are far apart and move freely, filling the entire space of their container (e.g. air)

  • Answered by AI

Skills evaluated in this interview

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
Selected Selected

I applied via Campus Placement and was interviewed before Oct 2022. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all Resume tips
Round 2 - Aptitude Test 

Basics appt ...
graph
case study
basic maths

Round 3 - Technical 

(1 Question)

  • Q1. Digital design VLSI fabrication question STA
Round 4 - HR 

(1 Question)

  • Q1. Simple behavioral talk
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Molex Interview FAQs

How many rounds are there in Molex Design Engineer interview?
Molex interview process usually has 1-2 rounds. The most common rounds in the Molex interview process are Technical and One-on-one Round.
How to prepare for Molex Design Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Molex. The most common topics and skills that interviewers at Molex expect are Design Development, Design Engineering, Design Verification, ECN and NX.
What are the top questions asked in Molex Design Engineer interview?

Some of the top questions asked at the Molex Design Engineer interview -

  1. What is aspect rat...read more
  2. How do you decide stack...read more

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