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Samsung Semiconductor Dft Design Engineer Interview Questions and Answers

Updated 9 Feb 2024

Samsung Semiconductor Dft Design Engineer Interview Experiences

1 interview found

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed before Feb 2023. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. Sta analysis setup and hold

Interview questions from similar companies

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(3 Questions)

  • Q1. Coverage improvement
  • Q2. Atpg flow and inputs
  • Q3. Have your faced any violations
  • Ans. 

    No violations faced

    • No, I have not faced any violations in my career

    • I always make sure to adhere to all rules and regulations in my work

    • I prioritize ethical conduct and compliance with industry standards

  • Answered by AI

I applied via Referral and was interviewed in Jun 2022. There was 1 interview round.

Round 1 - Technical 

(6 Questions)

  • Q1. 1st round with hiring manager.Discussion with hiring manager. Reason for switch. Then technical questions on how to debug and find failure flops in a chain. Basic loc,los, loes lock-up latch questions. Why...
  • Q2. 3 2 hour interviews were taken( Total 6 hours with 1 people in each round). Questions: how we can reduce test time. how serial chain patterns are solved. How T24 violations are debugged, how we can find wh...
  • Q3. How compression ratio can be tweaked, what are the factors ( how coverage, Patten count gets impacted).
  • Ans. 

    Compression ratio can be tweaked by adjusting the volume of the combustion chamber. This affects fuel efficiency and power output.

    • Compression ratio is the ratio of the volume of the combustion chamber at its largest to its smallest.

    • Increasing compression ratio can improve fuel efficiency and power output, but too high a ratio can cause engine knocking.

    • Factors that impact compression ratio include the size and shape of ...

  • Answered by AI
  • Q4. How have I observed hold violations and setup violations in my design. What I did after that, etc
  • Ans. 

    I have observed hold and setup violations in my design and took necessary actions.

    • I used static timing analysis (STA) to identify hold and setup violations.

    • I fixed hold violations by adding delay cells or increasing clock period.

    • I fixed setup violations by reducing delay or decreasing clock period.

    • I also checked for false paths and multi-cycle paths.

    • I re-ran STA after fixing violations to ensure timing closure.

    • I docume...

  • Answered by AI
  • Q5. Purpose of occ controllers. What scan enable signals( pipelined or nonpiplelined) will go to my occ controller, clock chain and why. Lock up latch purpose. If I have 5 negative edge triggered flops and 5 p...
  • Ans. 

    Explanation of purpose of occ controllers, scan enable signals, lock up latch and arrangement of negative and positive edge triggered flops.

    • The purpose of occ controllers is to manage the clock signals in a design and ensure proper timing.

    • Scan enable signals are used for testing and debugging purposes.

    • Pipelined signals are used for faster data transfer while non-pipelined signals are used for simpler designs.

    • Lock up la...

  • Answered by AI
  • Q6. How can we reset a tap controller without trst signals. How do you find coverage gaps.
  • Ans. 

    Resetting a tap controller without trst signals and finding coverage gaps.

    • For resetting a tap controller without trst signals, we can use a power-on reset circuit or a watchdog timer.

    • To find coverage gaps, we can use code coverage analysis tools like CodeSonar, Coverity, or LDRA.

    • We can also use dynamic analysis tools like Valgrind or Purify to find runtime errors and coverage gaps.

    • Manual testing and peer code reviews c...

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Read basics well, know about your architecture, clock mechanisms and compression ratio concepts. Be well versed with your work in current company.

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed before Jun 2023. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Good interview round
  • Q2. Full technical questions
  • Q3. What is dft basic
  • Ans. 

    DFT (Design for Testability) is a method used in electronics design to ensure that the product can be easily tested during manufacturing.

    • DFT involves designing the product in a way that makes it easy to test for faults or defects.

    • Techniques used in DFT include adding test points, scan chains, and built-in self-test features.

    • DFT helps reduce the time and cost of testing during manufacturing.

    • Example: Adding scan chains t...

  • Answered by AI
  • Q4. Write the verilog code
  • Ans. 

    Verilog code for Dft Design Engineer

    • Use Verilog syntax to describe digital circuits

    • Include modules, inputs, outputs, and logic gates in the code

    • Ensure proper indentation and formatting for readability

  • Answered by AI
  • Q5. Atpg, scan and simulation questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Do digital electronic and Dft concepts properly

Skills evaluated in this interview

Interview experience
3
Average
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Company Website and was interviewed in Apr 2024. There were 2 interview rounds.

Round 1 - One-on-one 

(2 Questions)

  • Q1. First round was with DFT Head. He seemed little arrogant. Asked me basic DFT questions like wrapper architecture, working and how flops will be handled in case of setup and hold.
  • Q2. He also asked me about work I have done
Round 2 - Technical 

(1 Question)

  • Q1. This was 3 hours back to back interview. In first round, All questions were on scan architecture, need of lockup latches, ATPG Basics, compression architecture etc. Second round was more on the challenges ...

Interview Preparation Tips

Interview preparation tips for other job seekers - Go very well prepared even on the topics you have not worked on.

Design Engineer Interview Questions & Answers

Molex user image govekar prajwal

posted on 8 Jul 2024

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(1 Question)

  • Q1. Introduction about ourselves
Round 2 - One-on-one 

(1 Question)

  • Q1. Personal interview ( personality test )
Interview experience
5
Excellent
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Internshala and was interviewed in Mar 2024. There was 1 interview round.

Round 1 - One-on-one 

(2 Questions)

  • Q1. Tell me about yourself
  • Q2. Questions based on experience and projects
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via Naukri.com and was interviewed in Apr 2024. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. Electronic related questions were asked PCB related
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Walk-in and was interviewed in Feb 2024. There were 3 interview rounds.

Round 1 - Aptitude Test 

Basic aptitude questions

Round 2 - Technical 

(1 Question)

  • Q1. Tech questions related to domain
Round 3 - HR 

(1 Question)

  • Q1. Genenral questions that are non technical
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via campus placement at Motilal Nehru Institute National Institute of Technology (NIT), Allahabad and was interviewed before Aug 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

Questions covering various aspects

Round 2 - Technical 

(2 Questions)

  • Q1. Design a mood 3 counter
  • Ans. 

    A mood 3 counter is a device that tracks and displays the user's mood on a scale of 1-3.

    • Design a simple interface with 3 buttons for the user to input their mood (happy, neutral, sad)

    • Include a display screen to show the current mood level

    • Implement a reset button to clear the mood counter

    • Consider adding a visual indicator such as colored LEDs for each mood level

  • Answered by AI
  • Q2. What are the three states
  • Ans. 

    The three states refer to the three fundamental states of matter: solid, liquid, and gas.

    • Solid: particles are closely packed together and have a fixed shape and volume (e.g. ice)

    • Liquid: particles are close together but can move past each other, taking the shape of their container (e.g. water)

    • Gas: particles are far apart and move freely, filling the entire space of their container (e.g. air)

  • Answered by AI

Skills evaluated in this interview

Samsung Semiconductor Interview FAQs

How many rounds are there in Samsung Semiconductor Dft Design Engineer interview?
Samsung Semiconductor interview process usually has 1 rounds. The most common rounds in the Samsung Semiconductor interview process are Technical.

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Samsung Semiconductor Dft Design Engineer Interview Process

based on 1 interview

Interview experience

4
  
Good
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