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I applied via LinkedIn and was interviewed in Sep 2021. There were 3 interview rounds.
SMT (Surface Mount Technology) is a process used in electronics manufacturing to mount electronic components onto the surface of a printed circuit board (PCB).
SMT involves placing electronic components onto the PCB using solder paste and a pick-and-place machine.
The solder paste is applied to the PCB using a stencil, and then the components are placed onto the paste.
The PCB is then heated in a reflow oven, causing the ...
Multiple AOI defects can occur due to various reasons and can be resolved by identifying the root cause and taking corrective actions.
AOI defects can include missing components, wrong polarity, tombstoning, bridging, etc.
Root causes can be incorrect programming, machine calibration, component placement, solder paste printing, etc.
Corrective actions can include reprogramming, recalibrating, adjusting placement parameter...
Multiple SPI defects can occur due to various reasons, leading to poor quality and reliability of the product.
SPI defects can be caused by issues with the solder paste, stencil design, or the reflow process.
To resolve the issue, it is important to identify the root cause and take corrective actions.
Improving the solder paste quality, optimizing the stencil design, and adjusting the reflow profile can help resolve the i...
SPI parameters are defined based on the specific requirements of the PCB and components being used.
SPI parameters include clock frequency, data format, and signal voltage levels.
The clock frequency should be set to the maximum frequency supported by the components.
Data format can be set to either MSB or LSB depending on the component requirements.
Signal voltage levels should be set to match the voltage levels of the co...
To modify stencil, fixture, palets, support block and BGA rework stencil, one needs to follow specific steps.
Stencil modification requires adjusting the aperture size and shape to improve paste deposition
Fixture modification involves changing the clamping mechanism to ensure proper alignment
Palet modification involves adjusting the tooling holes to fit the PCB
Support block modification requires changing the height to a...
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Logical reasoning and technical aptitude questions
A simple tic tac toe game design with a 3x3 grid and two players taking turns to place their marks.
Create a 3x3 grid to represent the game board
Allow two players to take turns placing their marks (X or O) on the grid
Check for a win condition after each move to determine the winner
Handle tie game if all spaces on the grid are filled without a winner
Designing a login page for a software application
Include fields for username and password
Implement password strength validation
Provide option for password reset
Incorporate CAPTCHA for security
Utilize HTTPS for secure communication
I applied via Campus Placement
60 questions to be done in 60 mins
Data structures are used to store and organize data efficiently in computer programs.
Data structures help in efficient searching, sorting, and manipulation of data.
Examples include arrays, linked lists, stacks, queues, trees, and graphs.
Applications include database management systems, file systems, and network protocols.
I applied via campus placement at Institute of Management Studies (IMS), Ghaziabad and was interviewed in Aug 2023. There were 3 interview rounds.
They asked basic programs, cloud computing, computer networking
To resize a win form according to screen size, use the Anchor property and the SizeChanged event.
Set the Anchor property of the form and its controls to adjust their position and size relative to the form's edges.
Handle the SizeChanged event of the form to update the size and position of the controls based on the new form size.
Use the Screen class to get the size of the screen and adjust the form size accordingly.
Consi...
I applied via Campus Placement and was interviewed in Feb 2023. There were 4 interview rounds.
It was basically mcq on dsa and os
I applied via Naukri.com and was interviewed in Mar 2022. There were 2 interview rounds.
good afternoon sir/madam
Firstof all thank you for giving me this opportunity to introduce myself.my name is shayamveer .I am basically from kasganj but currently staying in manesar
I did my diploma in electronics engineering from government polytechnic college bijnor u.p
I belongs to a joint family
My strength are I am self motivate and hard working and disciplined person.
My sort tern goal is t...
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