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Inteva Products Design Engineer Interview Questions and Answers for Experienced

Updated 15 Jan 2023

Inteva Products Design Engineer Interview Experiences for Experienced

1 interview found

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
Not Selected

I applied via Approached by Company and was interviewed in Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Tool test + F2F technical interview
Round 3 - One-on-one 

(1 Question)

  • Q1. Managerial round with mix of HR

Interview Preparation Tips

Topics to prepare for Inteva Products Design Engineer interview:
  • Gd t
  • Sheet Metal
Interview preparation tips for other job seekers - Be careful what technical terms to add in the resume.. the questions will be based on those keywords

Interview questions from similar companies

I applied via Recruitment Consulltant and was interviewed before Oct 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Assignment 

I got the bracket model for remastering.

Round 3 - Technical 

(1 Question)

  • Q1. About GD&T, Mfg process, Materials
Round 4 - HR 

(1 Question)

  • Q1. About yourself, why do you want to join, reason for leaving

Interview Preparation Tips

Interview preparation tips for other job seekers - This is one of the best company as I remember.
This in not the prat of CTC-
Yearly Bonus 10% of CTC + Diwali Bonus 5k

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR

I applied via Referral and was interviewed before Sep 2020. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Please explain about your profile

Interview Preparation Tips

Interview preparation tips for other job seekers - First of all be free to attend the interview.
Be bold in your explanations.
Questions mainly fall from your profile explanation.

Try to tell what you have worked with.
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. What is tolerance and basic tolerance
  • Ans. 

    Tolerance refers to the allowable deviation from a specified dimension in engineering design.

    • Tolerance is the acceptable range of variation in a dimension or property of a part or product.

    • Basic tolerance is the general tolerance that is applied to all dimensions unless otherwise specified.

    • Tolerance helps ensure that parts fit together properly and function as intended.

    • Examples of tolerance include +/- 0.1mm for a machi...

  • Answered by AI
Round 1 - Technical 

(1 Question)

  • Q1. Short introduction, technical questions
Round 2 - HR 

(2 Questions)

  • Q1. What are your strengths and weaknesses?
  • Q2. Tell me about yourself.
Round 3 - HR 

(2 Questions)

  • Q1. Why should we hire you?
  • Q2. What are your strengths and weaknesses?

Interview Preparation Tips

Interview preparation tips for other job seekers - Should be technical strong, knowledge of Regulations etc.
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Seating regulations
  • Q2. Safety standards
Round 2 - HR 

(2 Questions)

  • Q1. Salary expectation
  • Q2. When can you join
Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-

I was interviewed before Apr 2023.

Round 1 - Technical 

(1 Question)

  • Q1. What is the Plastic defect
  • Ans. 

    Plastic defect is a flaw or imperfection in a plastic material that affects its quality and performance.

    • Plastic defects can include air bubbles, warping, sink marks, flow lines, and voids.

    • Air bubbles are trapped pockets of air within the plastic material.

    • Warping is the deformation or twisting of the plastic material.

    • Sink marks are depressions on the surface caused by uneven cooling.

    • Flow lines are visible lines or strea...

  • Answered by AI
Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Aptitude Test 

First round is aptitude test all type of questions asked like verbal, reasoning and Technical

Round 2 - Technical 

(2 Questions)

  • Q1. Explain stress, strain curve diagram with example?
  • Ans. 

    Stress-strain curve shows relationship between stress and strain in a material under tension.

    • Stress-strain curve is a graphical representation of how a material deforms under stress.

    • It typically consists of a linear elastic region, a yield point, plastic deformation, and ultimate failure.

    • Example: Steel has a high yield strength, so its stress-strain curve shows a steep initial slope.

    • Example: Rubber has a low yield stre...

  • Answered by AI
  • Q2. What is DOF? How many degrees of freedom from any object
  • Ans. 

    DOF stands for Degrees of Freedom. It refers to the number of independent parameters that define the configuration of an object.

    • DOF is the number of ways a rigid body can move in 3D space.

    • For a rigid body in 3D space, there are 6 degrees of freedom - 3 translational and 3 rotational.

    • Examples of DOF include linear motion along x, y, z axes and rotational motion around x, y, z axes.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Good Preparation is needed for Technical round

Interview Questionnaire 

2 Questions

  • Q1. Software tool test on simple component
  • Q2. You can use any tool to clear that.

Inteva Products Interview FAQs

How many rounds are there in Inteva Products Design Engineer interview for experienced candidates?
Inteva Products interview process for experienced candidates usually has 3 rounds. The most common rounds in the Inteva Products interview process for experienced candidates are Resume Shortlist, Technical and One-on-one Round.
What are the top questions asked in Inteva Products Design Engineer interview for experienced candidates?

Some of the top questions asked at the Inteva Products Design Engineer interview for experienced candidates -

  1. Tool test + F2F technical interv...read more
  2. Managerial round with mix of...read more

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Inteva Products Design Engineer Interview Process for Experienced

based on 1 interview

Interview experience

4
  
Good
View more
Inteva Products Design Engineer Salary
based on 54 salaries
₹3.5 L/yr - ₹11 L/yr
36% more than the average Design Engineer Salary in India
View more details

Inteva Products Design Engineer Reviews and Ratings

based on 8 reviews

3.7/5

Rating in categories

3.2

Skill development

4.1

Work-life balance

2.7

Salary

3.9

Job security

3.7

Company culture

2.3

Promotions

3.1

Work satisfaction

Explore 8 Reviews and Ratings
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