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I applied via Referral and was interviewed before Feb 2021. There were 2 interview rounds.
PCIe linkup involves several stages for establishing communication between devices.
Initialization of the link layer
Negotiation of link width and speed
Training sequence to optimize signal quality
Establishment of a data link layer connection
Configuration of the transaction layer
Exchange of transaction layer packets
Completion of the linkup process
Ensure data integrity through proper communication protocols and error checking mechanisms.
Use reliable communication protocols such as TCP/IP or UART
Implement error checking mechanisms such as CRC or checksums
Perform thorough testing and validation of the communication interface
Ensure proper synchronization between HW and SW
Implement retry mechanisms in case of communication failures
I applied via Company Website and was interviewed in Jan 2023. There were 2 interview rounds.
I applied via Referral and was interviewed before Jun 2023. There were 2 interview rounds.
FIFO full condition occurs when the FIFO buffer is completely filled with data.
Occurs when the number of items in the FIFO buffer reaches its maximum capacity
Further writes to the FIFO buffer are blocked until some data is read out
Can lead to data loss if not managed properly
Intel interview questions for designations
I applied via Approached by Company and was interviewed before Aug 2021. There was 1 interview round.
Design muxes and write code for Fibonacci series
Design a 2:1 mux using Verilog or VHDL
Implement the Fibonacci series using a for loop or recursion
Connect the output of the mux to select between the two Fibonacci numbers
Test the design with different inputs and verify the output
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posted on 29 Aug 2024
UVM (Universal Verification Methodology) basic principle is to provide a standardized methodology for verifying digital designs.
UVM is based on SystemVerilog and provides a framework for creating reusable verification environments
It promotes the use of object-oriented programming techniques for creating modular and scalable testbenches
UVM encourages the use of constrained-random stimulus generation and coverage-driven ...
posted on 29 Feb 2024
I applied via Campus Placement and was interviewed in Jan 2024. There was 1 interview round.
posted on 5 Apr 2024
I applied via Referral and was interviewed in Aug 2021. There was 1 interview round.
posted on 10 Feb 2024
I applied via Campus Placement and was interviewed in Jan 2024. There were 2 interview rounds.
Mcq questions based on aptitude(a bit ) and digital design, VLSI, Clock related questions
based on 4 interviews
1 Interview rounds
based on 12 reviews
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