Hardware Engineer

100+ Hardware Engineer Interview Questions and Answers

Updated 6 Jul 2025
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Asked in Qualcomm

4d ago

Q. How many ways can you arrange sets of colored balls in a line, where the first set is all red, the next is all blue, and the last is all green, and all balls within a set are identical?

Ans.

The number of ways to arrange sets of coloured balls in a line.

  • The number of ways to arrange the red balls is the factorial of the number of red balls.

  • The number of ways to arrange the blue balls is the factorial of the number of blue balls.

  • The number of ways to arrange the green balls is the factorial of the number of green balls.

  • To find the total number of arrangements, multiply the number of arrangements for each set.

Asked in Qualcomm

3d ago

Q. How do you implement the overlap-add method of convolution?

Ans.

Overlap-add method of convolution is implemented by dividing the input signal into overlapping segments and convolving each segment with a filter.

  • Divide the input signal into overlapping segments

  • Apply the filter to each segment

  • Add the convolved segments together to get the output signal

  • The length of each segment should be greater than or equal to the length of the filter

  • The overlap between adjacent segments should be greater than or equal to the length of the filter minus one

Hardware Engineer Interview Questions and Answers for Freshers

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Asked in Qualcomm

4d ago

Q. How do you obtain the bit-rate for quantization of a band-limited signal?

Ans.

The bit-rate for quantization of a band-limited signal can be obtained by considering the Nyquist-Shannon sampling theorem.

  • The Nyquist-Shannon sampling theorem states that in order to accurately represent a band-limited signal, the sampling rate must be at least twice the highest frequency component of the signal.

  • The bit-rate for quantization is determined by the number of bits used to represent each sample. It is typically calculated as the product of the sampling rate and t...read more

Asked in Qualcomm

2d ago

Q. How do you obtain the in-phase and quadrature components of a real pass-band signal?

Ans.

The in-phase and quadrature components of a real pass-band signal can be obtained using a complex mixer.

  • A complex mixer is used to convert the real pass-band signal to a complex baseband signal.

  • The in-phase component is obtained by multiplying the pass-band signal with a local oscillator signal in-phase with the carrier frequency.

  • The quadrature component is obtained by multiplying the pass-band signal with a local oscillator signal 90 degrees out of phase with the carrier fre...read more

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Asked in Qualcomm

4d ago

Q. How do you implement interpolation in the discrete-time domain?

Ans.

Interpolation in discrete-time domain involves estimating values between known data points.

  • Interpolation is used to fill in missing data or estimate values between known data points.

  • Common interpolation techniques include linear interpolation, polynomial interpolation, and spline interpolation.

  • Linear interpolation calculates values along a straight line between two known data points.

  • Polynomial interpolation uses a polynomial function to estimate values between data points.

  • Spl...read more

Asked in Qualcomm

1d ago

Q. How do you determine the Nyquist sampling frequency for an unevenly distributed band-limited signal?

Ans.

Nyquist sampling frequency for unevenly distributed band-limited signal.

  • Determine the highest frequency component in the signal

  • Use Nyquist theorem to calculate the minimum sampling frequency

  • Sampling frequency should be at least twice the highest frequency component

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5d ago

Q. Are you familiar with standards such as ISO, IEC, and CE in the context of process management and product development?

Ans.

Yes, I am familiar with ISO, IEC, and CE standards in process management and product development.

  • ISO (International Organization for Standardization) provides guidelines for quality management systems, e.g., ISO 9001.

  • IEC (International Electrotechnical Commission) focuses on electrical and electronic standards, ensuring safety and efficiency.

  • CE marking indicates conformity with health, safety, and environmental protection standards for products sold in the EU.

  • For example, ISO...read more

5d ago

Q. Are you knowledgeable about prototype development and testing for research and development (R&D), and if assigned responsibility, would you be able to take ownership to successfully complete the task?

Ans.

I have extensive experience in prototype development and testing, ensuring successful R&D outcomes through ownership and diligence.

  • Experience in designing prototypes for electronic devices, such as wearable health monitors.

  • Conducted rigorous testing phases, including stress testing and user feedback sessions.

  • Utilized CAD software for designing prototypes, ensuring precision and functionality.

  • Collaborated with cross-functional teams to integrate software and hardware component...read more

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6d ago

Q. Have you ever worked with wireless modules such as Wi-Fi, Bluetooth Low Energy (BLE), and LoRa, and are you familiar with the in-house and field testing procedures for these modules?

Ans.

I have experience with Wi-Fi, BLE, and LoRa modules, including testing procedures for both in-house and field applications.

  • Worked with Wi-Fi modules for IoT applications, ensuring reliable connectivity in various environments.

  • Implemented Bluetooth Low Energy (BLE) for wearable devices, focusing on low power consumption and efficient data transfer.

  • Conducted field testing for LoRa modules in remote areas, assessing range and signal integrity under different conditions.

  • Familiar ...read more

1d ago

Q. What is your approach to designing heat shrink for a MOSFET, and what methods do you recommend for effective thermal management?

Ans.

Designing heat shrink for MOSFETs involves material selection, thermal interface, and effective heat dissipation strategies.

  • Select appropriate heat shrink material with high thermal conductivity, such as polyolefin or silicone.

  • Incorporate thermal interface materials (TIMs) to enhance heat transfer between the MOSFET and the heat sink.

  • Design the heat shrink to allow for airflow around the MOSFET to facilitate natural convection.

  • Consider using a heat sink or thermal pad in conj...read more

1d ago

Q. What is your experience with schematic capture, circuit design, component selection, and Bill of Materials (BOM) preparation, and what specific role do you play in these activities?

Ans.

I have extensive experience in schematic capture, circuit design, component selection, and BOM preparation in various projects.

  • Utilized Altium Designer for schematic capture and PCB layout in multiple projects, ensuring design integrity and manufacturability.

  • Conducted thorough component selection based on performance, availability, and cost, leading to a 15% reduction in overall project costs.

  • Prepared detailed BOMs that included part numbers, descriptions, and sourcing inform...read more

6d ago

Q. What was your experience in troubleshooting a printed circuit board (PCB), and what is the difference between a PCB and a printed circuit board assembly (PCBA)?

Ans.

I have extensive experience troubleshooting PCBs, understanding their differences from PCBAs.

  • Identified faulty components using a multimeter and oscilloscope.

  • Repaired broken traces with conductive ink or soldering.

  • Differentiated PCB (bare board) from PCBA (with components soldered).

  • Used thermal imaging to detect overheating components on PCBs.

Asked in Nvidia

6d ago

Q. How do you determine the minimum buffer size based on burst rate, input stream rate, output stream rate, and latency rate?

Ans.

The minimum size of buffer depends on burst rate, input/output stream rates, and latency rate.

  • Calculate the maximum amount of data that can be received during the latency period

  • Determine the maximum burst rate and the maximum input/output stream rates

  • Calculate the buffer size using the formula: buffer size = (maximum burst rate * latency period) + maximum input/output stream rates

  • Consider adding extra buffer space for safety margin

4d ago

Q. What type of PCB stack-up is generally preferred for a four-layer PCB?

Ans.

A common four-layer PCB stack-up is signal-ground-signal-power for optimal performance and reduced interference.

  • Layer 1: Signal (Top layer) - Used for routing high-speed signals.

  • Layer 2: Ground - Provides a solid ground reference, reducing noise.

  • Layer 3: Signal - Used for additional signal routing, often for lower-speed signals.

  • Layer 4: Power (Bottom layer) - Distributes power to components efficiently.

3d ago

Q. Can you explain your system, how and why you did this?

Ans.

I designed a system that integrates hardware components to perform specific functions efficiently.

  • Researched and selected appropriate hardware components based on project requirements.

  • Designed circuit layouts and schematics to ensure proper functionality.

  • Implemented testing procedures to validate system performance.

  • Optimized system for cost-effectiveness and efficiency.

  • Regularly updated system to incorporate new technologies and improvements.

2d ago

Q. What are the types of materials used in the manufacturing of printed circuit boards (PCBs)?

Ans.

PCBs are made from various materials, primarily including substrates, conductive layers, and protective coatings.

  • 1. Substrate materials: Commonly used materials include FR-4 (glass-reinforced epoxy), which is the most widely used PCB substrate.

  • 2. Conductive materials: Copper is the primary metal used for traces and pads due to its excellent conductivity.

  • 3. Dielectric materials: These materials, such as polyimide and PTFE, are used for insulation between conductive layers.

  • 4. S...read more

3d ago

Q. What is the basic operation of a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)?

Ans.

A MOSFET controls electrical current using voltage applied to its gate terminal, enabling efficient switching and amplification.

  • MOSFET stands for Metal-Oxide-Semiconductor Field-Effect Transistor.

  • It has three terminals: Gate (G), Drain (D), and Source (S).

  • The voltage at the gate controls the flow of current between the drain and source.

  • Used in digital circuits, power electronics, and amplifiers.

  • Example: MOSFETs are commonly used in computer processors and power supplies.

5d ago

Q. What is the purpose of vias in a printed circuit board (PCB) layout?

Ans.

Vias connect different layers of a PCB, allowing electrical signals to pass between them and facilitating complex circuit designs.

  • Vias provide vertical connectivity between layers, essential for multi-layer PCBs.

  • They help in routing signals efficiently, reducing trace lengths and potential interference.

  • Different types of vias (through-hole, blind, buried) serve specific design needs; for example, blind vias connect outer layers to inner layers.

  • Vias can also be used for therma...read more

6d ago

Q. What is your experience working with protocols such as SPI, I2C, UART, USART, and Ethernet?

Ans.

I have extensive experience with various communication protocols, including SPI, I2C, UART, USART, and Ethernet.

  • SPI: Used for high-speed communication between microcontrollers and sensors, e.g., interfacing with an SD card.

  • I2C: Implemented in projects for connecting multiple sensors to a microcontroller, such as temperature and humidity sensors.

  • UART: Utilized for serial communication in embedded systems, e.g., sending data from a microcontroller to a PC.

  • USART: Worked on proje...read more

5d ago

Q. What types of component footprints have you utilized in PCB design during your previous employment?

Ans.

I have utilized various component footprints in PCB design, including through-hole, surface mount, and custom footprints.

  • Through-hole components: Used for connectors and larger components like capacitors and resistors.

  • Surface mount technology (SMT): Designed footprints for ICs, such as QFN and BGA packages.

  • Custom footprints: Created unique footprints for specialized sensors and components in specific applications.

  • Standard footprints: Utilized IPC standards for resistors, capa...read more

5d ago

Q. How do you turn on an LED using PNP and NPN transistors?

Ans.

To turn on an LED using PNP and NPN transistors, connect the LED to the collector of the NPN transistor and the emitter of the PNP transistor.

  • Connect the anode of the LED to the collector of the NPN transistor and the cathode to the emitter of the PNP transistor.

  • Apply a positive voltage to the base of the NPN transistor to turn it on, allowing current to flow through the LED.

  • Apply a negative voltage to the base of the PNP transistor to turn it on, completing the circuit and t...read more

Asked in Nvidia

1d ago

Q. Given a complex diagram, how do you determine the maximum frequency of operation?

Ans.

To determine maximum frequency of operation from a complex diagram

  • Identify the critical path in the diagram

  • Calculate the propagation delay of each component in the path

  • Use the formula fmax = 1 / (2 * propagation delay) to determine maximum frequency

  • Consider any setup or hold time requirements for flip-flops or other components

  • Ensure that the frequency is within the specifications of the components used

Asked in Qualcomm

4d ago

Q. How do you demodulate a QAM signal?

Ans.

Demodulating a QAM signal involves separating the amplitude and phase components to recover the original data.

  • QAM signals combine amplitude and phase modulation

  • Demodulation involves separating the amplitude and phase components

  • Techniques like coherent demodulation and quadrature demodulation are used

  • Coherent demodulation uses a local oscillator to recover the phase component

  • Quadrature demodulation separates the in-phase and quadrature components

6d ago

Q. 1.explain different types DC-DC converter ? 2.operation of fly back converters?

Ans.

DC-DC converters are used to convert DC voltage levels. Flyback converters are a type of DC-DC converter.

  • DC-DC converters are used to convert DC voltage levels

  • Types of DC-DC converters include buck, boost, buck-boost, and flyback converters

  • Flyback converters use a transformer to store energy and transfer it to the output

  • Flyback converters are commonly used in low-power applications

  • Flyback converters can provide isolation between input and output

1d ago

Q. Do you have any experience with Altium, Orcad, Eagle PCB, or other PCB design software?

Ans.

I have extensive experience with Altium and Eagle PCB for designing complex circuit boards in various projects.

  • Proficient in Altium Designer for multi-layer PCB design, including signal integrity analysis.

  • Used Eagle PCB for rapid prototyping and small-scale projects, focusing on user-friendly interface.

  • Experience with Orcad for schematic capture and simulation in high-frequency applications.

  • Worked on a medical device project using Altium, ensuring compliance with industry sta...read more

3d ago

Q. What is your experience in designing hardware from inception to the end of the product life cycle?

Ans.

I have extensive experience in hardware design, overseeing projects from concept to end-of-life management.

  • Led a team in designing a medical device, ensuring compliance with FDA regulations.

  • Developed prototypes using CAD software, followed by rigorous testing phases.

  • Managed the transition from prototype to production, coordinating with manufacturing teams.

  • Conducted lifecycle analysis to optimize product performance and sustainability.

  • Implemented feedback loops for continuous ...read more

Asked in Qualcomm

6d ago

Q. Explain the Nyquist criterion.

Ans.

The Nyquist criterion states that in order to accurately sample a signal, the sampling rate must be at least twice the highest frequency component of the signal.

  • The Nyquist criterion is used in digital signal processing and communication systems.

  • It ensures that the original signal can be accurately reconstructed from its samples.

  • The sampling rate should be at least twice the bandwidth of the signal to avoid aliasing.

  • For example, if a signal has a maximum frequency of 10 kHz, ...read more

3d ago

Q. Are you comfortable working rotational shifts?

Ans.

Yes, I am willing to work rotational shifts as required for the job.

  • I am flexible and adaptable to different work schedules.

  • I understand the importance of meeting project deadlines and will adjust my schedule accordingly.

  • I have previous experience working in rotational shifts at my previous job.

  • I am committed to my work and will ensure that my performance is not affected by the shift changes.

Asked in Qualcomm

6d ago

Q. How is overlap-add implemented?

Ans.

Overlap-add is implemented by dividing the input signal into overlapping segments, applying a window function, and adding the segments together.

  • Overlap-add is a method used in digital signal processing to efficiently convolve long signals with finite impulse response (FIR) filters.

  • The input signal is divided into overlapping segments, typically with a length equal to the filter length.

  • A window function, such as the Hamming window, is applied to each segment to reduce spectral...read more

Asked in Cognizant

1d ago

Q. What was your reason for using NOR flash memory in your project?

Ans.

I chose NOR flash memory for its fast read speeds, random access capabilities, and reliability in embedded systems.

  • Fast read speeds: NOR flash allows for quick data retrieval, essential for applications requiring real-time access.

  • Random access: Unlike NAND flash, NOR flash supports random access, making it suitable for executing code directly from memory.

  • Reliability: NOR flash has a longer lifespan and better endurance, which is crucial for applications in critical systems.

  • Co...read more

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