Upload Button Icon Add office photos

Intel

Compare button icon Compare button icon Compare

Filter interviews by

Clear (1)

Intel Component Design Engineer Interview Questions, Process, and Tips

Updated 23 Aug 2024

Top Intel Component Design Engineer Interview Questions and Answers

  • Q1. NAND, NOR structures and their sizing and how they would vary depending on loads
  • Q2. How to speed up a circuit. Can voltage scaling be helpful
  • Q3. Timing Analysis , what changes are required if circuit violets hold time and set up time constraints.
View all 14 questions

Intel Component Design Engineer Interview Experiences

14 interviews found

Interview experience
3
Average
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Aug 2023. There were 2 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. What are the collaterals in PDK
  • Ans. 

    Collaterals in PDK refer to additional files and documents that provide information and support for the Process Design Kit.

    • Collateral files may include documentation on process technology, design rules, device models, and simulation parameters

    • These collaterals help designers understand and utilize the PDK effectively

    • Examples of collaterals in PDK are process design rules (PDR), technology files, and layout design guide

  • Answered by AI
  • Q2. How do you resolve soft connect errors in LVS
  • Ans. 

    Soft connect errors in LVS can be resolved by adjusting the connectivity rules and verifying the layout.

    • Review the connectivity rules to ensure they are correctly defined

    • Check for any missing or incorrect connections in the layout

    • Verify the layout against the design to identify and fix any discrepancies

    • Use debugging tools to pinpoint the source of the soft connect errors

  • Answered by AI
Round 2 - Technical 

(2 Questions)

  • Q1. Explain parasitics of a device
  • Ans. 

    Parasitics of a device refer to unwanted electrical properties that affect its performance.

    • Parasitics include resistance, capacitance, and inductance in a device.

    • They can cause signal delays, power losses, and interference.

    • Examples of parasitics are stray capacitance in a PCB trace or resistance in a wire.

    • Minimizing parasitics is crucial for optimizing device performance.

  • Answered by AI
  • Q2. How can you build a cap from a mos
  • Ans. 

    A MOS capacitor can be built by creating a metal-oxide-semiconductor structure.

    • Start by depositing a layer of oxide on a silicon substrate

    • Then deposit a layer of metal on top of the oxide

    • Finally, connect the metal layer to a terminal for the capacitor

  • Answered by AI

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all Resume tips
Round 2 - One-on-one 

(1 Question)

  • Q1. State machine design, work experience, setup and hold

Component Design Engineer Interview Questions Asked at Other Companies

Q1. 4) difference between curve mesh and curve through mesh in ug nx ... read more
Q2. what is stress ,strain, behavior of ductile material for tensile ... read more
asked in Intel
Q3. NAND, NOR structures and their sizing and how they would vary dep ... read more
asked in Intel
Q4. How to speed up a circuit. Can voltage scaling be helpful
Q5. Pipe flows ,distribution of stress , what is divergence , vortex ... read more

Interview Questionnaire 

6 Questions

  • Q1. NAND, NOR structures and their sizing and how they would vary depending on loads
  • Ans. 

    NAND and NOR structures are logic gates used in digital circuits. Their sizing varies based on the loads they need to drive.

    • NAND and NOR gates are fundamental building blocks in digital circuit design.

    • The size of NAND and NOR gates is determined by the number of inputs and the loads they need to drive.

    • For NAND gates, the size of the transistors in the pull-up network is increased to handle larger loads.

    • For NOR gates, t...

  • Answered by AI
  • Q2. Timing analysis questions
  • Q3. Design flow for a chip development
  • Ans. 

    The design flow for chip development involves several stages, including specification, architecture, design, verification, and manufacturing.

    • Specification: Define the requirements and functionality of the chip.

    • Architecture: Determine the high-level structure and components of the chip.

    • Design: Create the detailed circuitry and layout of the chip.

    • Verification: Test and validate the chip design for functionality and perfo...

  • Answered by AI
  • Q4. Questions on timings. delay in digital circuits
  • Q5. Where energy is consumed in transistors?
  • Ans. 

    Energy is consumed in transistors primarily in the form of heat.

    • Energy is consumed in the form of heat due to resistive losses in the transistor.

    • Switching between on and off states also consumes energy.

    • Leakage current in transistors leads to energy consumption.

    • Energy consumption can vary based on the transistor's size, material, and operating conditions.

  • Answered by AI
  • Q6. Based on given situation

Interview Preparation Tips

Round: Interview
Experience: Questions were like: What is HOLD and SETup time? Which is more important? How to solve the hold and set up time faults? Questions from chip development were from starting of Specs till it comes out of Fibs. Front end and back-end design, design cycle, timing closure.etc. Tech interv.iew concentrated on stuff from Rabaey's digital book. To be specific, they asked about sizing of NMOS & PMOS in CMOS logic, parasitic caps in wires,basics of VLSI design flow, synthesis.

Round: Interview
Experience: They asked normal HR questions and in ethics they gave some cases like the one thatfollows:'Your friend' is working in a rival company and he forgets some important data in your room that can benefit your company. Would you go ahead and use those data?

Skill Tips: """Good CGPA is a must."""
Skills: Tech Fundaeu00b7s, General Knowledge, Proper knowledge of work done in Internships
College Name: IIT Madras

Skills evaluated in this interview

Interview Preparation Tips

Round: Test
Experience: It was outsourced to some online venture.. Test was quite tough.. 
Tips: A good grasp on aptitude questions will help immensely.. There are many common aptitude questions which will be asked in most exams.. study them well.. be good with probability, permutations and combinations.. Should know the basic electronic circuits, KCL, KVL etc thoroughly..

Round: Technical Interview
Experience: Technical Interview went well.. They asked only simple basic questions!
Tips: Study the following courses well- Digital systems, Digital IC Design, Computer architecture..Knowledge on steps of VLSI design flow and latest technologies will give you an extra edge in the interview 

Round: HR Interview
Experience: there were two rounds! Asked some convention HR questions. Also based on resume..
Tips: Be ready with answers to conventional HR questions like "Why do you want to join Intel?" , "Why should we hire you" etc. Make sure that your answers will let them know that you have done a good background study on the company(you SHOULD do that in advance!).. Be ready to explain each and every point in resume. Many time they were looking for non conventional answers.. Good preparation in advance helped me a lot!

General Tips: Be prepared.. In an interview what matters most is preparation not CGPA!
Skills:
College Name: IIT Madras
Motivation: Its the best in the world!

I applied via Campus Placement and was interviewed in Dec 2016. There were 5 interview rounds.

Interview Questionnaire 

7 Questions

  • Q1. Questions on digital systems
  • Q2. 9 coins, one heavy. how many tries?
  • Q3. Represent gates using arithmetic operations
  • Ans. 

    Gates can be represented using arithmetic operations like AND, OR, NOT, XOR, etc.

    • AND gate can be represented using multiplication

    • OR gate can be represented using addition

    • NOT gate can be represented using subtraction

    • XOR gate can be represented using modulo operation

    • Arithmetic operations can be used to design complex logic circuits

  • Answered by AI
  • Q4. BTech Project Based
  • Q5. Why Intel?
  • Ans. 

    Intel is a leader in the semiconductor industry with a strong focus on innovation and cutting-edge technology.

    • Intel has a reputation for being at the forefront of technological advancements

    • Intel invests heavily in research and development to stay ahead of the competition

    • Intel offers a challenging and rewarding work environment for engineers

    • Intel has a global presence and offers opportunities for career growth and devel...

  • Answered by AI
  • Q6. Any other company interested in?
  • Ans. 

    Yes, I am also considering opportunities at Intel and AMD.

    • I have researched both companies and am impressed with their work in the semiconductor industry.

    • I believe my skills and experience would be a good fit for their component design teams.

    • I am open to exploring opportunities at other companies as well.

    • However, Intel and AMD are currently at the top of my list.

  • Answered by AI
  • Q7. My extra-curricular activities

Interview Preparation Tips

Round: Test
Experience: Toooo easy aptitude test, questions straight from Indiabix.com. 91 people were shortlisted to the interviews.
Tips: Just practice a few on Indiabix.com I would say, not even required to prepare.
Duration: 1 hour
Total Questions: 20

Round: Technical Interview
Experience: Once again, very easy. Just very very basic. Maximum, you need Digital IC Design course.
Tips: No tips, keep your calm and think.

Round: Technical + HR Interview
Experience: Completely based on my B.Tech Project. They were a specific product development team looking for candidates for their team.
Tips: Just try to match their needs by relating everything on your resume to them.

Round: HR Interview
Experience: Just random questions about you and your activities.
Tips: Nothing much from my side to offer here. 29 people got the offer. I was the only one who got it and rejected.

Skills: Digital Systems, Puzzle Solving Capability
College Name: IIT Madras

Get interview-ready with Top Intel Interview Questions

I applied via Campus Placement and was interviewed in Dec 2016. There were 4 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Questions based on resume and projects
  • Q2. Questions on Verilog , timing analysis, course project based on Verilog, questions from the courses which I took

Interview Preparation Tips

Round: Test
Experience: Questions were asked from number theory-remainders, permutation and combinations, probability, ratio, compound interest, partnership ,etc .
Tips: Most questions were doable. Practicing aptitude questions will be sufficient.
Duration: 1 hour
Total Questions: 25

Round: Technical Interview
Experience: They asked me to explain my course project and other projects in detail. Then they asked everything
Tips: Prepare whatever you have put in the resume.

Round: Technical Interview
Experience: Firstly, they asked me to explain my DSP Embedded course project in detail. Then they asked series of follow-up questions. Then they gave two i/p waveforms, one o/p waveform and a clock signal, and asked me to write Verilog code for the output signal. Then they asked questions from the courses which I took.

Tips: Prepare Verilog, digital ic design and projects well.

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There was 1 interview round.

Interview Questionnaire 

2 Questions

  • Q1. Timing Analysis , what changes are required if circuit violets hold time and set up time constraints.
  • Ans. 

    Timing analysis changes for violating hold time and set up time constraints.

    • For violating hold time constraint, the circuit needs to be redesigned to increase the delay of the data path.

    • For violating set up time constraint, the circuit needs to be redesigned to decrease the delay of the data path.

    • Hold time violations can be resolved by inserting additional flip-flops or increasing the clock-to-Q delay.

    • Set up time viola...

  • Answered by AI
  • Q2. Explain project.
  • Ans. 

    I designed a component for a new smartphone model.

    • Developed a compact and efficient component for a smartphone

    • Collaborated with a team of engineers to ensure compatibility and functionality

    • Performed extensive testing and analysis to optimize performance

    • Implemented design changes based on feedback and requirements

    • Ensured compliance with industry standards and regulations

  • Answered by AI

Interview Preparation Tips

Round: Technical Interview
Experience: Explain set up and hold time

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. A given black box was given out of which two input signals a clock and one output signal was coming out .. the waveforms of all the signals were displayed. Write a verilog code to synthesize this circuit
  • Ans. 

    Verilog code to synthesize a black box with clock input and one output signal.

    • Identify the functionality of the black box

    • Write the code for the input and output signals

    • Use Verilog modules to synthesize the circuit

  • Answered by AI

Interview Preparation Tips

Round: Technical Interview
Experience: Upon inspection of the inputs and the clock signals i found out that it was a fsm machine and then i had to write state diagram with two inputs and two states along with dont care states also.there were three always blocks in the verilog code.
Tips: dotn give up easily ..even if you don't get keep suggesting,the interviewer will help you in the process

Skills: Verilog Skills, MOS , FINITe state machines, Digital Design
College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There were 3 interview rounds.

Interview Preparation Tips

Round: Resume Shortlist
Experience: Mostly all with cgpa above 7 got shortlisted

Round: Technical Interview
Experience: They asked some basic digital design questions, like flip-flip, latch-latch timing analysis, NAND NOR cmos structure, electromigration, cross-talk, Domino logic, Dynamic logic.
Tips: Study material: Digital IC design, Digital systems.

Round: Technical Interview
Experience: They asked questions from the resume- about the courses, projects and stuff.
Tips: Study about your projects properly you should know what you have done in that project.

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There were 5 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Timing Analysis
  • Q2. Why do you want to join intel What do you know about Intel
  • Ans. 

    I want to join Intel because of its reputation for innovation, cutting-edge technology, and opportunities for growth.

    • Intel is a leading technology company known for its innovation in semiconductor manufacturing

    • Intel is a major player in the computer hardware industry, producing CPUs, GPUs, and other components

    • Intel has a strong focus on research and development, constantly pushing the boundaries of technology

    • Intel offe...

  • Answered by AI

Interview Preparation Tips

College Name: IIT Madras
Contribute & help others!
anonymous
You can choose to be anonymous

Intel Interview FAQs

How many rounds are there in Intel Component Design Engineer interview?
Intel interview process usually has 2 rounds. The most common rounds in the Intel interview process are Technical, Resume Shortlist and One-on-one Round.
How to prepare for Intel Component Design Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Intel. The most common topics and skills that interviewers at Intel expect are Design Engineering, Perl, System Verilog, Python and Circuit Designing.
What are the top questions asked in Intel Component Design Engineer interview?

Some of the top questions asked at the Intel Component Design Engineer interview -

  1. NAND, NOR structures and their sizing and how they would vary depending on lo...read more
  2. How to speed up a circuit. Can voltage scaling be help...read more
  3. Timing Analysis , what changes are required if circuit violets hold time and se...read more

Recently Viewed

INTERVIEWS

Intel

No Interviews

INTERVIEWS

HALODOC

No Interviews

INTERVIEWS

Avanti Fellows

No Interviews

INTERVIEWS

Intel

No Interviews

INTERVIEWS

Kaivalya Education Foundation

No Interviews

INTERVIEWS

Intel

No Interviews

INTERVIEWS

Pratham Education Foundation

No Interviews

INTERVIEWS

HALODOC

No Interviews

DESIGNATION

INTERVIEWS

HALODOC

No Interviews

Tell us how to improve this page.

Intel Component Design Engineer Interview Process

based on 2 interviews

4 Interview rounds

  • Technical Round
  • HR Round
  • Aptitude Test Round
  • Personal Interview1 Round
View more

Interview Questions from Similar Companies

Qualcomm Interview Questions
3.8
 • 274 Interviews
Tata Electronics Interview Questions
4.0
 • 148 Interviews
Texas Instruments Interview Questions
4.1
 • 125 Interviews
Nvidia Interview Questions
3.7
 • 104 Interviews
Synopsys Interview Questions
3.8
 • 89 Interviews
Molex Interview Questions
3.9
 • 53 Interviews
View all
Intel Component Design Engineer Salary
based on 62 salaries
₹12 L/yr - ₹39 L/yr
68% more than the average Component Design Engineer Salary in India
View more details

Intel Component Design Engineer Reviews and Ratings

based on 4 reviews

5.0/5

Rating in categories

3.2

Skill development

5.0

Work-life balance

4.6

Salary

4.8

Job security

4.1

Company culture

3.2

Promotions

3.9

Work satisfaction

Explore 4 Reviews and Ratings
Software Engineer
334 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

SOC Design Engineer
221 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

System Validation Engineer
197 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Software Development Engineer
160 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Design Engineer
159 salaries
unlock blur

₹0 L/yr - ₹0 L/yr

Explore more salaries
Compare Intel with

Qualcomm

3.8
Compare

Nvidia

3.7
Compare

Microsoft Corporation

4.0
Compare

Advanced Micro Devices

3.7
Compare
Did you find this page helpful?
Yes No
write
Share an Interview