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Wafer Space Design & Verification Engineer Interview Questions and Answers

Updated 6 Jul 2023

Wafer Space Design & Verification Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-

I applied via Campus Placement

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Aptitude Test 

Normal Aptitude questions, We can prepare for it using general aptitude questions available in internet.

Round 3 - Technical 

(1 Question)

  • Q1. Technical Questions (Digital Electronics, Verilog, Computer Architecture)
Round 4 - HR 

(1 Question)

  • Q1. HR Discussion will just our introduction and some normal hr questions

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Company Website and was interviewed before Dec 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

Digital,Verilog, SV based questions with some quants.

Round 2 - Coding Test 

SV & UVM concepts with some examples would be fine.

Round 3 - HR 

(2 Questions)

  • Q1. Self Introduction
  • Q2. Why do you want to join this organisation.
  • Ans. 

    I want to join this organization because of its reputation for innovation and commitment to excellence in design and verification engineering.

    • I am impressed by the company's track record of developing cutting-edge technologies.

    • I believe that working at this organization will provide me with opportunities for professional growth and development.

    • I am excited about the chance to collaborate with a team of talented enginee...

  • Answered by AI
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. Project questions
  • Q2. Sv and uvm basics
Round 2 - One-on-one 

(2 Questions)

  • Q1. Pcie basic questions
  • Q2. SV and UVM basics

I applied via LinkedIn and was interviewed in May 2022. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

This round consists of technical test which was focusing on electronics subjects.

Round 3 - Technical 

(1 Question)

  • Q1. In this round , questions were asked in digital design , verilog and projects.
Round 4 - HR 

(1 Question)

  • Q1. In this round as usual HR questions were asked.

Interview Preparation Tips

Interview preparation tips for other job seekers - Waste company Mirafra Technologies, they said that we will send offer letters to you within 2 or 3 days then they will not send offer letters and let you keep waiting for months.
In HR interview threy will say you " Best of Luck for future endeavors with Mirafra " but they will not send you offer letters. Hahahahahahha
It is not good for freshers, they are playing with freshers
Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(5 Questions)

  • Q1. Write code randc behaviour
  • Ans. 

    randc behavior generates random complex numbers with specified distribution

    • Use randc to generate random complex numbers

    • Specify distribution using arguments like mean, variance, etc.

    • Example: randc(10, 1, 2) generates 10 random complex numbers with mean 1 and variance 2

  • Answered by AI
  • Q2. Functinal coverage
  • Q3. Code coverage related questions
  • Q4. Monitor and scoreboard connections
  • Q5. Project related questions

Skills evaluated in this interview

I applied via Recruitment Consultant and was interviewed before May 2020. There were 3 interview rounds.

Interview Questionnaire 

3 Questions

  • Q1. RRC related questions, CSFB,SRVCC,SIB parameters
  • Q2. LTE configurations, Handovers, and use case scenarios. MAC HARQ processing
  • Q3. Basic C questions, pointers,strings, bit manipulation , linked list

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well on protocol stacks and C basic concepts

Interview Questionnaire 

1 Question

  • Q1. How do you rate yourself in c?

I applied via Referral and was interviewed in Oct 2020. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. Connected sum hacker rank problem
  • Ans. 

    Connected sum problem involves finding the number of connected components in a graph

    • The problem can be solved using DFS or BFS algorithm

    • The input graph can be represented using adjacency list or matrix

    • The output is the number of connected components in the graph

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Always should be logical

Skills evaluated in this interview

I applied via Naukri.com and was interviewed in Feb 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. 5G Call Flow,ENDC Procedure ,RRC layer,Mac layer,Python scripting

Interview Preparation Tips

Interview preparation tips for other job seekers - Focus on basics concept

I applied via Campus Placement and was interviewed in Dec 2016. There were 5 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Communication Concepts
  • Q2. Embedded Concepts

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisted based on CGPA and Profile
Tips: CGPA above 7.5 and Communication/CS based coursework/ability

Round: Test
Experience: C Coding Questions which checked basic knowledge of C
Tips: Brush up your C skills. Questions are easy but may require knowledge of stuff like what is big endian and little endian etc.
Duration: 1 hour 30 minutes
Total Questions: 12

Round: Technical Interview
Experience: My Communication relation concepts were tested. My Major Project was asked in detail.
Tips: If Comm background, prepare ITC, MultiCarrier/Wireless at a good level. If not they will ask C.

Round: Technical Interview
Experience: I was asked basic level embedded concepts.
Tips: Prepare on the following and similar stuff : How to implement a pseudo dynamic memory allocation using flash memory- which data structure to use. How does Inter Process Communication work. How does a multicore processor synchronizes its cores. If Comm background, give the TX and RX chain design (Wireless System Design)

Skills: Communication Systems, Embedded Systems, C Programming
College Name: IIT Madras

Wafer Space Interview FAQs

How many rounds are there in Wafer Space Design & Verification Engineer interview?
Wafer Space interview process usually has 4 rounds. The most common rounds in the Wafer Space interview process are Resume Shortlist, Aptitude Test and Technical.

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Wafer Space Design & Verification Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
View more

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Wafer Space Design & Verification Engineer Salary
based on 6 salaries
₹4 L/yr - ₹14.7 L/yr
12% more than the average Design & Verification Engineer Salary in India
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Wafer Space Design & Verification Engineer Reviews and Ratings

based on 1 review

5.0/5

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4.0

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4.0

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4.0

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4.0

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4.0

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5.0

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5.0

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