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I applied via Recruitment Consultant and was interviewed in Oct 2018. There were 5 interview rounds.
I am a dedicated and experienced engineer with a strong background in project management and problem-solving.
Experienced in project management and problem-solving
Strong background in engineering
Dedicated and detail-oriented
Excellent communication skills
Team player
My future goal is to become a senior engineer and eventually move into a leadership role within the company.
Continue to develop my technical skills and knowledge in my field
Seek opportunities for mentorship and leadership training
Set specific goals for career advancement, such as obtaining certifications or completing advanced education
Work on improving communication and teamwork skills to prepare for leadership roles
I want to join TechnipFMC because of their reputation for innovation and commitment to excellence in engineering.
TechnipFMC is known for their cutting-edge technology and innovative solutions in the engineering industry
I am impressed by TechnipFMC's track record of successful projects and global presence
I believe that working at TechnipFMC will provide me with opportunities for professional growth and development
I am responsible for designing and implementing new features for our software products.
Designing and implementing new features for software products
Collaborating with team members to ensure successful project completion
Testing and debugging code to ensure quality and functionality
Participating in code reviews and providing feedback to peers
Yes, MRB (Manufacturing Record Book) is a document that contains detailed information about the manufacturing process.
MRB is a comprehensive record of all activities related to manufacturing, including design, production, testing, and quality control.
It serves as a reference for future production runs and helps ensure consistency and quality.
MRB typically includes information such as engineering drawings, specification...
Yes, QAP/ITP stands for Quality Assurance Plan/Inspection and Test Plan.
QAP/ITP is a document that outlines the quality assurance and inspection procedures for a project or product.
It includes details about the tests to be conducted, acceptance criteria, and responsibilities of different stakeholders.
QAP/ITP ensures that the project or product meets the required quality standards and specifications.
For example, in cons...
Radiography testing (RT) and ultrasonic testing (UT) are both non-destructive testing methods used to detect flaws in materials.
Radiography testing uses X-rays or gamma rays to create an image of the internal structure of an object, while ultrasonic testing uses high-frequency sound waves.
RT is typically used for thicker materials and can detect both surface and subsurface defects, while UT is more commonly used for th...
No, RT cannot replace UT examination.
RT (Radiographic Testing) and UT (Ultrasonic Testing) are two different non-destructive testing methods used in engineering.
RT uses X-rays or gamma rays to inspect the internal structure of an object, while UT uses sound waves to detect flaws or measure thickness.
Each method has its own advantages and limitations, and they are often used in combination to ensure comprehensive inspec...
WPS stands for Welding Procedure Specification and PQR stands for Procedure Qualification Record.
WPS is a document that provides detailed instructions on how to perform a specific welding procedure.
It includes information on welding parameters, materials, pre-weld and post-weld treatments, etc.
PQR is a record that documents the actual results of a welding procedure qualification test.
It includes details of the test, su...
Essential variables are crucial for the functioning of a system, while non-essential variables are not necessary but may provide additional information.
Essential variables are required for the system to operate correctly.
Non-essential variables are not necessary for the system's basic functionality.
Essential variables are typically directly related to the core purpose of the system.
Non-essential variables may provide s...
I applied via Campus Placement and was interviewed in Nov 2024. There were 3 interview rounds.
Topic : How AI influences engineering life
I am a recent graduate with a degree in Mechanical Engineering and a passion for problem-solving and innovation.
Recent graduate with a degree in Mechanical Engineering
Passionate about problem-solving and innovation
Experience with CAD software such as SolidWorks
Completed internships at engineering firms
I applied via Approached by Company and was interviewed in Jun 2024. There were 3 interview rounds.
I am a detail-oriented and experienced buyer with a strong background in negotiating contracts and sourcing quality products.
I have X years of experience in procurement and purchasing roles.
I am skilled in vendor management and building strong relationships with suppliers.
I have a proven track record of cost savings through strategic sourcing initiatives.
I am proficient in analyzing market trends and identifying opport...
I was responsible for managing vendor relationships, negotiating contracts, and analyzing market trends.
Managed vendor relationships
Negotiated contracts
Analyzed market trends
In 5 years, I see myself as a senior buyer leading a team, implementing cost-saving strategies, and contributing to company growth.
Leading a team of buyers and procurement specialists
Implementing cost-saving strategies through negotiations and vendor management
Contributing to company growth by identifying new suppliers and optimizing supply chain processes
I am a detail-oriented and experienced buyer with a strong background in negotiating contracts and sourcing products.
Over 5 years of experience in purchasing and procurement
Skilled in vendor management and cost analysis
Successfully negotiated contracts resulting in cost savings
Proficient in sourcing products globally
Responsible for sourcing, negotiating, and purchasing goods for the organization.
Sourcing suppliers for raw materials and finished goods
Negotiating prices and contracts with vendors
Managing inventory levels to ensure timely delivery
Collaborating with internal departments to determine purchasing needs
Related to my Procurement profile a case was given where three situation were mentioned and how I'll handle it by my own.
Assignment test interview
TechnipFMC interview questions for popular designations
I applied via Referral and was interviewed in Apr 2024. There was 1 interview round.
Get interview-ready with Top TechnipFMC Interview Questions
I applied via Recruitment Consulltant and was interviewed in Sep 2024. There were 2 interview rounds.
I applied via Recruitment Consulltant and was interviewed in Nov 2023. There were 2 interview rounds.
I applied via Approached by Company and was interviewed in Apr 2024. There were 2 interview rounds.
I rejected the offer last time because the salary was below my expectations and the benefits package was not competitive.
Salary was below expectations
Benefits package was not competitive
I am moving to Hyderabad for better career opportunities and to be closer to family.
Better career opportunities in the engineering field
Proximity to family members who live in Hyderabad
Desire to experience a new city and culture
I was interviewed before Mar 2024.
A stress-strain diagram shows the relationship between stress and strain in a material.
The diagram typically shows stress on the y-axis and strain on the x-axis.
It helps engineers understand how a material will deform under different loads.
The diagram can include elastic deformation, plastic deformation, and fracture points.
Materials like steel have different stress-strain curves compared to materials like rubber.
Meshing is the process of dividing a complex geometry into smaller, simpler elements for analysis in CAE.
Meshing is essential for finite element analysis (FEA) and computational fluid dynamics (CFD).
It involves creating a mesh of nodes and elements that represent the geometry.
The quality of the mesh affects the accuracy and efficiency of the analysis.
Types of meshing include structured, unstructured, and hybrid.
Mesh re...
I applied via Campus Placement and was interviewed in Sep 2023. There were 2 interview rounds.
Aptitude test mainly focused on mechanics and logical and reasoning
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The duration of TechnipFMC interview process can vary, but typically it takes about less than 2 weeks to complete.
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