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I applied via Naukri.com and was interviewed in Nov 2024. There were 2 interview rounds.
A 10 layer PCB stack typically consists of alternating layers of copper and insulating material.
Start with a layer of copper for signal routing
Alternate with layers of insulating material to prevent short circuits
Include ground and power planes for stability and noise reduction
Consider impedance control for high-speed signals
Top and bottom layers are usually used for components placement and routing
I applied via Naukri.com and was interviewed in Nov 2024. There were 4 interview rounds.
I applied via Company Website
Verbal/math + personality
Topic on a go-to market strategy
I am a fit for this role due to my strong analytical skills, strategic mindset, and ability to work well under pressure.
Strong analytical skills: I have experience analyzing data and identifying trends to make informed decisions.
Strategic mindset: I excel at developing and implementing plans to achieve long-term goals.
Ability to work well under pressure: I have successfully managed multiple projects with tight deadline
I am a highly motivated and detail-oriented individual with a strong passion for strategic operations.
I have a proven track record of successfully managing projects and implementing strategic initiatives.
I possess excellent analytical and problem-solving skills, which are essential for identifying and addressing operational inefficiencies.
My strong communication and interpersonal skills enable me to effectively collabo...
Lenovo interview questions for popular designations
I applied via LinkedIn and was interviewed in Aug 2024. There were 3 interview rounds.
Logical reasoning, each question carries 1 mark
Python ,and other programining lauguage basic questions
I am a highly skilled Assembly Engineer with 5 years of experience in designing and implementing assembly processes.
Bachelor's degree in Mechanical Engineering
Proficient in CAD software such as SolidWorks
Experience in optimizing assembly line layouts for efficiency
Strong problem-solving skills in troubleshooting assembly issues
Certified in Lean Six Sigma for process improvement
My goal is to continuously improve my skills and knowledge in assembly engineering, contribute to the success of the team, and eventually take on leadership roles.
Continuous learning and skill development in assembly engineering techniques
Contributing to the success of the team by meeting project deadlines and quality standards
Working towards taking on leadership roles within the assembly engineering department
I am expecting a company that values innovation, provides opportunities for growth, and fosters a collaborative work environment.
Opportunities for professional growth and development
Support for innovation and creativity
A collaborative and inclusive work environment
Clear communication and feedback channels
Competitive compensation and benefits
I will utilize my expertise in assembly engineering to streamline production processes, improve efficiency, and ensure high-quality products for the company.
Implement lean manufacturing principles to optimize assembly line operations
Identify and troubleshoot any issues in the assembly process to minimize downtime
Collaborate with cross-functional teams to introduce new assembly techniques or technologies
Conduct regular ...
I am expecting a salary that is competitive with industry standards and reflective of my experience and skills.
Research industry standards for Assembly Engineer salaries
Consider your level of experience and skills
Be prepared to negotiate based on job responsibilities and benefits package
Get interview-ready with Top Lenovo Interview Questions
I applied via Recruitment Consulltant and was interviewed in Jun 2024. There was 1 interview round.
I applied via LinkedIn and was interviewed in Aug 2024. There were 2 interview rounds.
40min and with English and apptiutude Questions
Simple discusiion about some random topic
I applied via Indeed and was interviewed in Jun 2024. There were 2 interview rounds.
General awareness Maths
Introduction reason for joing weakness & dtrength
I applied via Campus Placement and was interviewed in Apr 2024. There were 3 interview rounds.
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