Fulham Interview Questions, Process, and Tips

Stencils thickness can be checked using a thickness gauge or calipers.

• Use a thickness gauge to measure the thickness of the stencil material.

• Alternatively, calipers can also be used to measure the thickness of the stencil.

• Ensure the stencil is clean and flat before taking measurements.

• Check for any signs of wear or damage that may affect the stencil thickness.

• Compare the measured thickness to the manufacturer's specifi

Reflow profile is a temperature-time curve used during the soldering process in Surface Mount Technology (SMT) to ensure proper solder joint formation.

• Reflow profile consists of preheat, soak, reflow, and cooling stages.

• Each stage has specific temperature and time parameters to gradually heat and cool the components.

• Example: A typical reflow profile may have a preheat stage at 150°C for 60 seconds, a soak stage at 180°...read more

AOI machine stands for Automated Optical Inspection machine, used in electronics manufacturing to detect defects in printed circuit boards.

• AOI machine is used in electronics manufacturing to inspect printed circuit boards for defects.

• It uses cameras and lighting to capture images of the PCB and analyze them for defects such as missing components, misaligned components, or soldering issues.

• The machine can compare the ca...read more

The solder paste type can vary depending on the specific requirements of the SMT process.

• Solder paste types include leaded and lead-free options.

• Different solder paste types have varying melting points and compositions.

• Examples of solder paste types include Sn63/Pb37 (leaded) and SAC305 (lead-free).

Solder paste problems can include issues such as insufficient solder paste, excessive solder paste, poor stencil design, and contamination.

• Insufficient solder paste can lead to poor solder joints and incomplete connections.

• Excessive solder paste can cause bridging between components and short circuits.

• Poor stencil design can result in uneven solder paste deposition and misalignment of components.

• Contamination in solder...read more