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I applied via Recruitment Consultant and was interviewed in Apr 2021. There was 1 interview round.
I would try to understand the reason for their disagreement and address their concerns to find a solution.
Listen to their concerns and objections
Provide additional information or clarification about the product
Offer alternative solutions or products
Try to negotiate or find a compromise
Thank them for their time and leave the door open for future opportunities
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I applied via LinkedIn
I applied via Naukri.com
I applied via Recruitment Consultant and was interviewed before Jan 2021. There were 3 interview rounds.
I applied via Company Website and was interviewed before May 2023. There was 1 interview round.
I applied via Referral and was interviewed in May 2023. There were 5 interview rounds.
I applied via Referral and was interviewed in Jul 2021. There were 3 interview rounds.
Solder paste is a material used in electronics manufacturing to connect components to printed circuit boards.
Solder paste is a mixture of metal alloy particles and flux.
It is applied to the pads on a printed circuit board before components are placed on top.
When heated, the solder paste melts and creates a bond between the component and the board.
Different types of solder paste are used for different applications, such...
posted on 5 Jul 2022
I applied via Indeed and was interviewed in Jun 2022. There were 2 interview rounds.
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