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I applied via Walk-in and was interviewed in May 2023. There were 3 interview rounds.
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I applied via Walk-in and was interviewed in Oct 2023. There was 1 interview round.
posted on 20 Dec 2021
To bring more sellers to Amazon, focus on building a strong reputation, offering competitive pricing, and providing excellent customer service.
Offer competitive pricing to attract sellers
Build a strong reputation through positive reviews and testimonials
Provide excellent customer service to retain sellers and attract new ones
Offer incentives such as free shipping or promotional deals to entice sellers to join
Utilize so...
posted on 18 Jan 2025
I applied via Naukri.com and was interviewed in Dec 2024. There were 2 interview rounds.
Please allow me some time to complete the project for the assignment.
First, we will understand all the group members, then we will comprehend the tasks, and after that, we will determine who is best suited for which task and who excels in what areas.
posted on 22 Oct 2022
I applied via LinkedIn
I appeared for an interview in Jan 2025.
The face-to-face interview for the department manager position was challenging but rewarding.
The interview panel consisted of senior managers and HR representatives.
I was asked about my previous experience in managing teams and handling difficult situations.
I had to provide examples of successful projects I had led in the past.
There were situational questions to assess my problem-solving skills and leadership abilities...
I prefer to handle the preparation of custom-related documents, addressing Bill of Entry queries, and completing the checklist for the Bill of Entry.
I have experience in preparing custom-related documents and addressing Bill of Entry queries.
I am detail-oriented and organized, ensuring all necessary information is included in the documents.
I am familiar with completing checklists for the Bill of Entry to ensure accurac...
I applied via Referral and was interviewed in Jul 2021. There were 3 interview rounds.
Solder paste is a material used in electronics manufacturing to connect components to printed circuit boards.
Solder paste is a mixture of metal alloy particles and flux.
It is applied to the pads on a printed circuit board before components are placed on top.
When heated, the solder paste melts and creates a bond between the component and the board.
Different types of solder paste are used for different applications, such...
based on 1 interview
Interview experience
Team Lead
49
salaries
| ₹3 L/yr - ₹6.2 L/yr |
Assistant Team Leader
40
salaries
| ₹1.8 L/yr - ₹4.2 L/yr |
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30
salaries
| ₹4.1 L/yr - ₹6.3 L/yr |
Business Development Associate
26
salaries
| ₹2.2 L/yr - ₹3.5 L/yr |
Assistant Manager
25
salaries
| ₹4.2 L/yr - ₹14.9 L/yr |
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