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TSMC Quality Engineer Interview Questions and Answers

Updated 19 Mar 2024

TSMC Quality Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via Company Website and was interviewed before Mar 2023. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. What you know on semiconductor process
  • Ans. 

    Semiconductor process involves the manufacturing of electronic devices using materials like silicon.

    • Semiconductor process involves the fabrication of electronic components on a semiconductor material like silicon.

    • It includes processes like photolithography, etching, deposition, and doping.

    • Examples of semiconductor devices include transistors, diodes, and integrated circuits.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Know your science well.

Interview questions from similar companies

Interview Questionnaire 

2 Questions

  • Q1. What's the function of wire harness.
  • Ans. 

    A wire harness is a collection of wires, cables, and connectors that transmit electrical signals and power between different components in a system.

    • Wire harnesses provide a neat and organized way to route and protect wires in a system.

    • They ensure proper connectivity and prevent wire damage or short circuits.

    • Wire harnesses simplify troubleshooting and maintenance by allowing easy identification and replacement of faulty...

  • Answered by AI
  • Q2. What is the function of sputtering.
  • Ans. 

    Sputtering is a process used in manufacturing to deposit thin films of material onto a surface.

    • Sputtering is a physical vapor deposition technique.

    • It involves bombarding a target material with high-energy ions or atoms.

    • This bombardment dislodges atoms from the target material, which then deposit onto a substrate.

    • Sputtering is commonly used in the production of semiconductor devices, solar cells, and thin film coatings.

    • ...

  • Answered by AI

I applied via Company Website and was interviewed before Jun 2020. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Semiconductor physics Basic concepts and previous work profile experience

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare resume according to job profile and answer all basic questions related semiconductor device physics and digital design

Interview Questionnaire 

1 Question

  • Q1. Stge concepts, vSAN, RAID, basic testing, OS concepts, NVMe, SATA, SAS

I applied via Approached by Company and was interviewed before Feb 2021. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. PLC, VFD, sensors, robot knowledge, Any language like C++, Python is additional advantage, mobile industry knowledge could also provide advantage
Round 2 - Technical 

(1 Question)

  • Q1. About yourself followed by one more technical round basically asking technical part from previous company
Round 3 - HR 

(3 Questions)

  • Q1. What are your salary expectations?
  • Q2. Share details of your previous job.
  • Q3. Tell me about yourself.

Interview Preparation Tips

Interview preparation tips for other job seekers - As a maintenance engineer if you are from mobile industry you will definitely get priority, other than this they require PLC and robotic knowlegde acquired professional for the testing equipment which are generally using drivers, motors, plc and programming part

I applied via Naukri.com and was interviewed in Mar 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Where to use TIG and mig
  • Ans. 

    TIG welding is used for precision welding of thin materials while MIG welding is used for thicker materials and faster welding.

    • TIG welding is ideal for welding aluminum, stainless steel, and other non-ferrous metals

    • MIG welding is commonly used for welding steel, iron, and other ferrous metals

    • TIG welding produces high-quality welds with minimal distortion and no spatter

    • MIG welding is faster and more efficient for thicke...

  • Answered by AI
Round 3 - HR 

(2 Questions)

  • Q1. Salary expectation, notice period of present company
  • Q2. Do you relocate to existing plant here
  • Ans. 

    Yes, I am willing to relocate to the existing plant.

    • I am open to relocating for the right opportunity.

    • I understand the importance of being present at the plant for effective quality control.

    • I have previous experience relocating for work.

    • I am flexible and adaptable to new environments.

  • Answered by AI

Interview Preparation Tips

Topics to prepare for Applied Materials Quality Engineer interview:
  • Technical
Interview preparation tips for other job seekers - Keep on searching daily and improve your skills on daily basis. Consume certificates for value addition
Interview experience
1
Bad
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I was interviewed before Feb 2024.

Round 1 - Technical 

(2 Questions)

  • Q1. NX tool test given
  • Q2. Technical round with interviewers
Interview experience
3
Average
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Jul 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

It was a online round with apti and coding mcqs and 2 coding questions which were very easy

Round 2 - One-on-one 

(2 Questions)

  • Q1. Difference between interface and class in java
  • Ans. 

    In Java, a class is a blueprint for creating objects, while an interface is a reference type similar to a class that can contain only constants, method signatures, default methods, static methods, and nested types.

    • Classes can have constructors, fields, methods, and can be instantiated to create objects.

    • Interfaces cannot be instantiated and can only contain method signatures and constants.

    • A class can implement multiple ...

  • Answered by AI
  • Q2. All the questions in the interview were based on the resume.
Round 3 - HR 

(1 Question)

  • Q1. General and general awareness questions example what are ur goals etc.

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Company Website and was interviewed before Jan 2023. There were 2 interview rounds.

Round 1 - Coding Test 

Simple Python Coding questions.

Round 2 - One-on-one 

(1 Question)

  • Q1. Logical questions on Memory allocation.

Interview Preparation Tips

Interview preparation tips for other job seekers - Look at problems asked to solve with a open mind, it will really help answering the questions.
Interview experience
3
Average
Difficulty level
Hard
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Questions about Thermal basics. JD also about melting point temperatures
Round 3 - HR 

(1 Question)

  • Q1. Salary negotiations and joining date details

TSMC Interview FAQs

How many rounds are there in TSMC Quality Engineer interview?
TSMC interview process usually has 1 rounds. The most common rounds in the TSMC interview process are Technical.

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TSMC Quality Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
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