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TSMC Process Engineer Interview Questions and Answers
TSMC Process Engineer Interview Experiences
1 interview found
Anonymous
I applied via Company Website and was interviewed in Jul 2024. There was 1 interview round.
(3 Questions)
- Q1. Tell me about yourself
- Ans.
I am a dedicated process engineer with a strong background in chemical engineering and a passion for problem-solving.
Bachelor's degree in Chemical Engineering from XYZ University
3+ years of experience in process engineering at ABC Company
Proficient in using simulation software such as Aspen HYSYS
Implemented cost-saving measures resulting in a 10% reduction in production expenses
Strong analytical skills and attention to
- Q2. Much questions around the stressful work conditions and if you are ok with it
- Q3. Working alone or in a group?
- Ans.
I prefer working in a group as it allows for collaboration, diverse perspectives, and shared responsibilities.
Collaboration with team members can lead to innovative solutions
Diverse perspectives can help in problem-solving and decision-making
Shared responsibilities can lighten the workload and increase efficiency
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Selected
I applied via Company Website and was interviewed before Apr 2022. There were 2 interview rounds.
(2 Questions)
- Q1. Tell me about yourself and then I explained the whole resume.
- Q2. The interviewer did not mention that the job role requires availability of 24x7
Interview Preparation Tips
Vasant Tan
Selected
I applied via Job Fair and was interviewed in Feb 2024. There were 2 interview rounds.
Online test for your logic and reasoning
(1 Question)
- Q1. Discuss about your career ambition
(1 Question)
- Q1. Introduce yourself and why do you want to work here
Kishan Patel
Selected
I applied via LinkedIn and was interviewed before Jan 2023. There were 2 interview rounds.
(2 Questions)
- Q1. Why do you want to work for Intel corporation?
- Q2. Why do you think that you would be a great fit at Intel?
(1 Question)
- Q1. Do you know about the sputtering process?
- Ans.
Yes, the sputtering process is a technique used in manufacturing to deposit thin films on various surfaces.
Sputtering is a physical vapor deposition (PVD) process.
It involves bombarding a target material with high-energy ions to dislodge atoms from the target surface.
These atoms then deposit onto a substrate to form a thin film.
Sputtering is commonly used in semiconductor manufacturing, optical coatings, and thin film ...
Rajesh Rathore
Interview Questionnaire
2 Questions
- Q1. What's the function of wire harness.
- Ans.
A wire harness is a collection of wires, cables, and connectors that transmit electrical signals and power between different components in a system.
Wire harnesses provide a neat and organized way to route and protect wires in a system.
They ensure proper connectivity and prevent wire damage or short circuits.
Wire harnesses simplify troubleshooting and maintenance by allowing easy identification and replacement of faulty...
- Q2. What is the function of sputtering.
- Ans.
Sputtering is a process used in manufacturing to deposit thin films of material onto a surface.
Sputtering is a physical vapor deposition technique.
It involves bombarding a target material with high-energy ions or atoms.
This bombardment dislodges atoms from the target material, which then deposit onto a substrate.
Sputtering is commonly used in the production of semiconductor devices, solar cells, and thin film coatings.
...
Interview Questionnaire
1 Question
- Q1. Stge concepts, vSAN, RAID, basic testing, OS concepts, NVMe, SATA, SAS
I applied via Approached by Company and was interviewed before Feb 2021. There were 3 interview rounds.
(1 Question)
- Q1. PLC, VFD, sensors, robot knowledge, Any language like C++, Python is additional advantage, mobile industry knowledge could also provide advantage
(1 Question)
- Q1. About yourself followed by one more technical round basically asking technical part from previous company
(3 Questions)
- Q1. What are your salary expectations?
- Q2. Share details of your previous job.
- Q3. Tell me about yourself.
Interview Preparation Tips
I applied via Company Website and was interviewed before Jun 2020. There were 3 interview rounds.
Interview Questionnaire
1 Question
- Q1. Semiconductor physics Basic concepts and previous work profile experience
Interview Preparation Tips
Selected
I applied via Referral and was interviewed before Jul 2022. There were 3 interview rounds.
(1 Question)
- Q1. Questions about Thermal basics. JD also about melting point temperatures
(1 Question)
- Q1. Salary negotiations and joining date details
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