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Texas Instruments DFT Engineer Interview Questions and Answers

Updated 29 Nov 2022

Texas Instruments DFT Engineer Interview Experiences

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DFT Engineer Interview Questions & Answers

user image Anonymous

posted on 29 Nov 2022

I applied via Referral and was interviewed in May 2022. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Problems I have faced and how it was solved like drc, simulation issues etc.
  • Q2. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generator.
  • Q3. Circuit was drawn and I was asked what inputs will create the scenario for s@ 0 s@1 faults.
  • Q4. Questions on edt, 1 hot masking. Lock-up latches explanation with drawings
  • Q5. Coverage gaps, wrapper cell issues. Issues faced in post silicon
  • Ans. 

    Issues faced in post silicon for DFT Engineer

    • Coverage gaps can occur due to incomplete testing of certain functionalities

    • Wrapper cell issues can arise due to incorrect placement or sizing of the cells

    • Post silicon issues can also include timing violations, power issues, and signal integrity problems

    • Debugging post silicon issues can be challenging and time-consuming

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Basics should be good and know your work thoroughly.

Interview questions from similar companies

Interview experience
3
Average
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Company Website and was interviewed in Apr 2024. There were 2 interview rounds.

Round 1 - One-on-one 

(2 Questions)

  • Q1. First round was with DFT Head. He seemed little arrogant. Asked me basic DFT questions like wrapper architecture, working and how flops will be handled in case of setup and hold.
  • Q2. He also asked me about work I have done
Round 2 - Technical 

(1 Question)

  • Q1. This was 3 hours back to back interview. In first round, All questions were on scan architecture, need of lockup latches, ATPG Basics, compression architecture etc. Second round was more on the challenges ...

Interview Preparation Tips

Interview preparation tips for other job seekers - Go very well prepared even on the topics you have not worked on.
Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Toggle the bits of given input
  • Ans. 

    Toggle the bits of given input

    • Create a mask with all bits set to 1

    • XOR the input with the mask to toggle the bits

    • Repeat the process for each bit position

  • Answered by AI
  • Q2. Clear the set bit
Round 2 - Technical 

(2 Questions)

  • Q1. Print the star pattern
  • Ans. 

    Print a star pattern using loops

    • Use nested loops to print the desired pattern

    • Increment the number of stars in each row to create the pattern

    • Example: for a pattern with 5 rows - * , ** , *** , **** , *****

  • Answered by AI
  • Q2. Microprocessor microcontroller topics are asked

Skills evaluated in this interview

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via campus placement at Netaji Subhas Institute of Technology (NSIT) and was interviewed in Sep 2024. There were 2 interview rounds.

Round 1 - Aptitude Test 

Basic aptitude-10 question,digital moderate -Question,analog moderate -10 question,verilog and system verilog -10 question

Round 2 - One-on-one 

(3 Questions)

  • Q1. Latches and flip flop all characteristics equation and proof of the characteristics equation in flip flop.applications of flip flop
  • Q2. OOPS,INHERITANCE,VERILOG,BLOCKING - NON BLOCKING ASSIGNMENT OPERATOR and all the basic operations of verilog .
  • Q3. Discussion on work experience.

Interview Preparation Tips

Interview preparation tips for other job seekers - Be bonafide with your fundamentals core of digital circuits and design .
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. What is cross talk
  • Ans. 

    Cross talk is the unwanted transfer of signals between different components or traces on a circuit board.

    • Occurs when signals from one trace interfere with signals on another trace

    • Can lead to signal distortion or errors in data transmission

    • Prevented by proper spacing and shielding between traces

    • Example: Cross talk between data lines on a PCB causing errors in communication

  • Answered by AI
  • Q2. How to define generated clocks through edges
  • Ans. 

    Generated clocks through edges are defined by specifying the source clock and the edge on which the generated clock is based.

    • Specify the source clock for the generated clock

    • Define the edge (rising/falling) on which the generated clock is based

    • Use tools like Synopsys Design Compiler to define generated clocks

  • Answered by AI
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Basic question of sv like swapping no.
  • Q2. Question from projects
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. Assertions and coverage
  • Q2. Umv basic principle
  • Ans. 

    UVM (Universal Verification Methodology) basic principle is to provide a standardized methodology for verifying digital designs.

    • UVM is based on SystemVerilog and provides a framework for creating reusable verification environments

    • It promotes the use of object-oriented programming techniques for creating modular and scalable testbenches

    • UVM encourages the use of constrained-random stimulus generation and coverage-driven ...

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare basics
Interview experience
3
Average
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via LinkedIn and was interviewed in Feb 2024. There were 2 interview rounds.

Round 1 - One-on-one 

(4 Questions)

  • Q1. Why do you want to join ASML
  • Ans. 

    ASML is a global leader in lithography technology, and I am excited about the opportunity to work on cutting-edge projects in the semiconductor industry.

    • ASML is a global leader in lithography technology

    • Excited about working on cutting-edge projects in the semiconductor industry

    • Opportunity for professional growth and development

  • Answered by AI
  • Q2. What is your expectations?
  • Ans. 

    I expect a challenging role where I can utilize my skills in embedded software development and contribute to innovative projects.

    • Expect to work on cutting-edge technologies in embedded systems

    • Desire to collaborate with a talented team to solve complex problems

    • Seek opportunities for professional growth and skill development

    • Expect a supportive work environment that values creativity and innovation

  • Answered by AI
  • Q3. Do you have valid visa?
  • Ans. 

    Yes, I have a valid visa.

    • Yes, I have a valid visa that allows me to work in this country.

    • My visa is valid until [expiration date].

    • I have all the necessary documentation to prove my visa status.

  • Answered by AI
  • Q4. How did you hear about ASML?
  • Ans. 

    I heard about ASML through a job search website.

    • Job search website

    • Online job board

    • Referral from a friend who works at ASML

  • Answered by AI
Round 2 - Coding Test 

5-6 programming multiple choice questions on C++ and a problem to be solved with any language

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
-

I applied via Referral and was interviewed in Apr 2024. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. Simple FSM given similar to mux and asked for testcases and assertions.
  • Q2. Coverage to write transitions of states.
  • Ans. 

    Coverage-driven verification techniques are used to ensure all possible state transitions are exercised.

    • Coverage metrics like state, transition, and toggle coverage can be used to track the completeness of state transitions.

    • Writing directed tests to cover specific state transitions can help achieve higher coverage.

    • Random stimulus generation can also be used to explore different state transitions.

    • Functional coverage can...

  • Answered by AI
Interview experience
3
Average
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Jan 2024. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. Basics of analog , digital and vlsi
  • Q2. On face to face interview, they asked me abt my projects , digital, little analog , vlsi ( verilog), microcontrollers and c programming

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well on your basics

Texas Instruments Interview FAQs

How many rounds are there in Texas Instruments DFT Engineer interview?
Texas Instruments interview process usually has 2 rounds. The most common rounds in the Texas Instruments interview process are Resume Shortlist and Technical.
How to prepare for Texas Instruments DFT Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Texas Instruments. The most common topics and skills that interviewers at Texas Instruments expect are DFT, Physical Design, Automotive, JTAG and SOC.
What are the top questions asked in Texas Instruments DFT Engineer interview?

Some of the top questions asked at the Texas Instruments DFT Engineer interview -

  1. Coverage gaps, wrapper cell issues. Issues faced in post sili...read more
  2. Problems I have faced and how it was solved like drc, simulation issues e...read more
  3. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generat...read more

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