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Texas Instruments DFT Engineer Interview Questions and Answers

Updated 29 Nov 2022

Texas Instruments DFT Engineer Interview Experiences

1 interview found

DFT Engineer Interview Questions & Answers

user image Anonymous

posted on 29 Nov 2022

I applied via Referral and was interviewed in May 2022. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Problems I have faced and how it was solved like drc, simulation issues etc.
  • Q2. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generator.
  • Q3. Circuit was drawn and I was asked what inputs will create the scenario for s@ 0 s@1 faults.
  • Q4. Questions on edt, 1 hot masking. Lock-up latches explanation with drawings
  • Q5. Coverage gaps, wrapper cell issues. Issues faced in post silicon
  • Ans. 

    Issues faced in post silicon for DFT Engineer

    • Coverage gaps can occur due to incomplete testing of certain functionalities

    • Wrapper cell issues can arise due to incorrect placement or sizing of the cells

    • Post silicon issues can also include timing violations, power issues, and signal integrity problems

    • Debugging post silicon issues can be challenging and time-consuming

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Basics should be good and know your work thoroughly.

Interview questions from similar companies

Interview experience
3
Average
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Company Website and was interviewed in Apr 2024. There were 2 interview rounds.

Round 1 - One-on-one 

(2 Questions)

  • Q1. First round was with DFT Head. He seemed little arrogant. Asked me basic DFT questions like wrapper architecture, working and how flops will be handled in case of setup and hold.
  • Q2. He also asked me about work I have done
Round 2 - Technical 

(1 Question)

  • Q1. This was 3 hours back to back interview. In first round, All questions were on scan architecture, need of lockup latches, ATPG Basics, compression architecture etc. Second round was more on the challenges ...

Interview Preparation Tips

Interview preparation tips for other job seekers - Go very well prepared even on the topics you have not worked on.

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 5 May 2021

I applied via Campus Placement and was interviewed in Apr 2021. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. Vlsi design flow, sta, perl programming, puzzle

Interview Preparation Tips

Interview preparation tips for other job seekers - Interviewer were polite

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 18 Jul 2022

I applied via Campus Placement and was interviewed before Jul 2021. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. SDLC, digital circuit, rtl
Round 2 - Technical 

(1 Question)

  • Q1. Rtl coding verilog system verilog
Round 3 - HR 

(1 Question)

  • Q1. Introduction, hr policy company profile

Interview Preparation Tips

Interview preparation tips for other job seekers - Be strong in technical and know coding any programming language and scripting language. Know the things and concepts put in CV

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 5 May 2018

I applied via Campus Placement

Interview Questionnaire 

2 Questions

  • Q1. Extensive discussion on minor projects. I had one in wireless communication and was asked technical questions based on my description of the project work.
  • Q2. Questions on digital logic design. I was asked to write an FSM for a problem statement. This was followed by some basic questions on data structures and algorithms, like tree traversal etc. (Don't worry if...

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisting of candidates based on UG CGPA from CS, EC, EE and IT branches.

General Tips: Be thorough with your basics. A good command over digital logic and computer architecture is a plus.
Skills: Communication, Problem Solving, Analytical Skills
Duration: <1 week
Interview experience
5
Excellent
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Mar 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

1st round consists of apt, digital , verilog , analog objective as well as descriptive questions in descriptive mostly related to fifo depth , counter and draw wave forms , analog questions were asked

Round 2 - Technical 

(1 Question)

  • Q1. Mostly basics of verilog digital and analog were asked
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Apr 2023. There were 2 interview rounds.

Round 1 - Coding Test 

Three coding questions and MCQ's

Round 2 - Technical 

(3 Questions)

  • Q1. Live coding, mostly questions based on C pointers
  • Q2. Types of Memory Allocations in C
  • Ans. 

    Types of memory allocations in C include static, dynamic, and automatic.

    • Static memory allocation: memory is allocated at compile time and remains constant throughout the program's execution. Example: int x = 5;

    • Dynamic memory allocation: memory is allocated at runtime using functions like malloc() or calloc(). Example: int *ptr = (int*)malloc(sizeof(int));

    • Automatic memory allocation: memory is allocated on the stack and...

  • Answered by AI
  • Q3. Pointers in C - Types of pointers
  • Ans. 

    Pointers in C are variables that store memory addresses. Types include null pointers, void pointers, function pointers, etc.

    • Null pointers: int *ptr = NULL;

    • Void pointers: void *ptr;

    • Function pointers: int (*ptr)(int, int);

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Good programming skills in C language

Skills evaluated in this interview

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(2 Questions)

  • Q1. What do you know about Bill of Materials
  • Ans. 

    Bill of Materials (BOM) is a comprehensive list of raw materials, components, and assemblies required to build a product.

    • BOM is used in manufacturing to ensure all necessary materials are available for production.

    • It includes details such as part numbers, quantities, and descriptions of each item.

    • BOM can be hierarchical, with sub-assemblies listed under main assemblies.

    • It helps in cost estimation, inventory management, ...

  • Answered by AI
  • Q2. Name a time you had conflict with a co worker and how did you resolve it

Interview Questionnaire 

3 Questions

  • Q1. Basic data structures
  • Q2. Exception handling, linked list
  • Q3. Graph colouring

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well for DS. ALGO
Interview experience
1
Bad
Difficulty level
Hard
Process Duration
2-4 weeks
Result
No response

I appeared for an interview before Feb 2023.

Round 1 - Coding Test 

3 coding questions out of which 2 are easy and 1 is medium

Round 2 - Technical 

(1 Question)

  • Q1. 2 Interviewers kept on asking to write codes for each and every question they ask. I was given a tree problem and coded everything from scratch and executed written test cases and again I was asked to solv...

Texas Instruments Interview FAQs

How many rounds are there in Texas Instruments DFT Engineer interview?
Texas Instruments interview process usually has 2 rounds. The most common rounds in the Texas Instruments interview process are Resume Shortlist and Technical.
How to prepare for Texas Instruments DFT Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Texas Instruments. The most common topics and skills that interviewers at Texas Instruments expect are DFT, Physical Design, Automotive, JTAG and SOC.
What are the top questions asked in Texas Instruments DFT Engineer interview?

Some of the top questions asked at the Texas Instruments DFT Engineer interview -

  1. Coverage gaps, wrapper cell issues. Issues faced in post sili...read more
  2. Problems I have faced and how it was solved like drc, simulation issues e...read more
  3. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generat...read more

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