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Texas Instruments DFT Engineer Interview Questions and Answers

Updated 29 Nov 2022

Texas Instruments DFT Engineer Interview Experiences

1 interview found

DFT Engineer Interview Questions & Answers

user image Anonymous

posted on 29 Nov 2022

I applied via Referral and was interviewed in May 2022. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Problems I have faced and how it was solved like drc, simulation issues etc.
  • Q2. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generator.
  • Q3. Circuit was drawn and I was asked what inputs will create the scenario for s@ 0 s@1 faults.
  • Q4. Questions on edt, 1 hot masking. Lock-up latches explanation with drawings
  • Q5. Coverage gaps, wrapper cell issues. Issues faced in post silicon
  • Ans. 

    Issues faced in post silicon for DFT Engineer

    • Coverage gaps can occur due to incomplete testing of certain functionalities

    • Wrapper cell issues can arise due to incorrect placement or sizing of the cells

    • Post silicon issues can also include timing violations, power issues, and signal integrity problems

    • Debugging post silicon issues can be challenging and time-consuming

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Basics should be good and know your work thoroughly.

Interview questions from similar companies

Interview experience
5
Excellent
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Mar 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

1st round consists of apt, digital , verilog , analog objective as well as descriptive questions in descriptive mostly related to fifo depth , counter and draw wave forms , analog questions were asked

Round 2 - Technical 

(1 Question)

  • Q1. Mostly basics of verilog digital and analog were asked
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Campus Placement and was interviewed before Apr 2023. There were 2 interview rounds.

Round 1 - Coding Test 

Three coding questions and MCQ's

Round 2 - Technical 

(3 Questions)

  • Q1. Live coding, mostly questions based on C pointers
  • Q2. Types of Memory Allocations in C
  • Ans. 

    Types of memory allocations in C include static, dynamic, and automatic.

    • Static memory allocation: memory is allocated at compile time and remains constant throughout the program's execution. Example: int x = 5;

    • Dynamic memory allocation: memory is allocated at runtime using functions like malloc() or calloc(). Example: int *ptr = (int*)malloc(sizeof(int));

    • Automatic memory allocation: memory is allocated on the stack and...

  • Answered by AI
  • Q3. Pointers in C - Types of pointers
  • Ans. 

    Pointers in C are variables that store memory addresses. Types include null pointers, void pointers, function pointers, etc.

    • Null pointers: int *ptr = NULL;

    • Void pointers: void *ptr;

    • Function pointers: int (*ptr)(int, int);

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Good programming skills in C language

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via Campus Placement and was interviewed in Mar 2024. There was 1 interview round.

Round 1 - Technical 

(1 Question)

  • Q1. This involves telephonic interview with questions based on VLSI-MOSFET and Digital electronics

Interview Preparation Tips

Topics to prepare for STMicroelectronics Intern interview:
  • VHDL
  • System Verilog
  • Digital Electronics

I applied via Campus Placement and was interviewed in Jan 2022. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - One-on-one 

(1 Question)

  • Q1. Questions related to dbms

Interview Preparation Tips

Interview preparation tips for other job seekers - Just be confident and don't be nervous. Trust yourself. You can crack it
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
Selected Selected

I applied via Referral and was interviewed in Apr 2024. There was 1 interview round.

Round 1 - Technical 

(3 Questions)

  • Q1. General Questions from Projects on Resume?
  • Q2. Questions on Python and C?
  • Q3. Reasoning and Puzzle questions
Interview experience
1
Bad
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
No response

I applied via Campus Placement and was interviewed in Dec 2023. There were 2 interview rounds.

Round 1 - MCQ 

(2 Questions)

  • Q1. Sql questions, linux questions
  • Q2. Output based question, aptitude question
Round 2 - Technical 

(2 Questions)

  • Q1. Basic coding concepts
  • Q2. Resume discussion

I applied via Campus Placement and was interviewed in Aug 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Verilog n digital

Interview Preparation Tips

Interview preparation tips for other job seekers - It's quite good. Had asked about microprocessor also
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
Selected Selected

I applied via Campus Placement and was interviewed before Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Written test consist of digital electronics, coding section, verilog and aptitude questions

Round 3 - Technical 

(2 Questions)

  • Q1. In Technical interview, They asked what ever skills you have mentioned in your resume..not more than that.
  • Q2. Flip flop conversion, c coding logic test, RTL etc
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
6-8 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in Jun 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Coding Test 

Basic Verilog coding and digital design questions

Round 3 - HR 

(2 Questions)

  • Q1. Details on education, grades, career interests...etc If we offer you a permanent role after successful internship are you willing to join
  • Q2. What are your grades
  • Ans. 

    I have consistently maintained high grades throughout my academic career.

    • I have consistently achieved top grades in all my courses.

    • I have a GPA of 3.8 on a scale of 4.0.

    • I have received several academic awards and honors for my outstanding performance.

    • I have excelled in subjects like mathematics, computer science, and physics.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Please refresh your digital design concepts. Flip flops, FSMs...etc

Texas Instruments Interview FAQs

How many rounds are there in Texas Instruments DFT Engineer interview?
Texas Instruments interview process usually has 2 rounds. The most common rounds in the Texas Instruments interview process are Resume Shortlist and Technical.
How to prepare for Texas Instruments DFT Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Texas Instruments. The most common topics and skills that interviewers at Texas Instruments expect are DFT, Physical Design, Automotive, JTAG and SOC.
What are the top questions asked in Texas Instruments DFT Engineer interview?

Some of the top questions asked at the Texas Instruments DFT Engineer interview -

  1. Coverage gaps, wrapper cell issues. Issues faced in post sili...read more
  2. Problems I have faced and how it was solved like drc, simulation issues e...read more
  3. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generat...read more

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