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TE Connectivity Research and Development Product Development Engineer Interview Questions and Answers

Updated 5 Dec 2024

TE Connectivity Research and Development Product Development Engineer Interview Experiences

3 interviews found

Research and Development Product Development Engineer Interview Questions & Answers

user image Anonymous

posted on 23 Dec 2022

I applied via Company Website and was interviewed in Nov 2022. There were 5 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Case Study 

Practical question. Problem solving

Round 3 - Technical 

(1 Question)

  • Q1. Approach,method, alternative solution improvement and soo on.
    • Add your answer
Round 4 - One-on-one 

(2 Questions)

  • Q1. Manager round question bike like
    • Add your answer
  • Q2. Problem solving skills, be practical. Stand on your skills.
    • Add your answer
Round 5 - One-on-one 

(1 Question)

  • Q1. Attitude, be as you, keep it simply. Do ground work. Know about company and job.
    • Add your answer

Interview Preparation Tips

Interview preparation tips for other job seekers - Do the best, tell what you know. Don't fake anything.

Research and Development Product Development Engineer Interview Questions & Answers

user image Anonymous

posted on 5 Dec 2024

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed before Dec 2023. There was 1 interview round.

Round 1 - Technical 

(3 Questions)

  • Q1. Different stages for the development of new product
    • Add your answer
  • Q2. Material selection
    • Add your answer
  • Q3. Manufacturing process basic knowledge. Mainly molding !
    • Add your answer

Research and Development Product Development Engineer Interview Questions Asked at Other Companies

asked in TE Connectivity
Q1. Create 3d part in Creo
View answer (1)
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Research and Development Product Development Engineer Interview Questions & Answers

user image Anonymous

posted on 31 Jan 2024

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed before Jan 2023. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. Question will be mainly based on what is mentioned in the Resume, few questions related to technical as well
    • Add your answer
Round 2 - Tool test 

(1 Question)

  • Q1. Create 3d part in Creo
  • Ans. 

    Creating a 3D part in Creo

    • Open Creo software

    • Select the 'Part' option

    • Use sketching tools to create 2D profiles

    • Extrude or revolve the profiles to create 3D geometry

    • Apply necessary features like fillets, chamfers, etc.

    • Add dimensions and constraints to ensure design accuracy

    • Validate the design using analysis tools

    • Save the part in desired file format

    • Answered by AI
    Add your answer
Round 3 - HR 

(2 Questions)

  • Q1. Tell me abt ur self
    • Add your answer
  • Q2. What is ur salary expectations
    • Add your answer

Skills evaluated in this interview

Top trending discussions

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Interview Tips & Stories
2w (edited)
frozencricket
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·
works at
Cognizant
Office Letter from PWC
Hi Everyone, I am a ServiceNow Developer with 2.5 years of Experience.I got selected in PWC for ServiceNow Developer Associate Role. It's been 20 days and I have not received the Offer letter yet. When can I expect and should I do anything? Also CTC in my current organisation is 6.75 LPA and PWC offered 10.5 LPA . Should I have asked for more ? Please pour your thoughts . Thank you
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Interview questions from similar companies

Application Development Analyst Interview Questions & Answers

Secure Meters user image Suzi Yt

posted on 23 Mar 2024

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - HR 

(3 Questions)

  • Q1. How can we make lst stay for a longer time period
  • Ans. 

    To make lst stay for a longer time period, consider optimizing memory usage, implementing caching mechanisms, and reducing unnecessary data retrieval.

    • Optimize memory usage by minimizing unnecessary data stored in memory

    • Implement caching mechanisms to store frequently accessed data for quicker retrieval

    • Reduce unnecessary data retrieval by optimizing database queries and only fetching required information

    • Answered by AI
    Add your answer
  • Q2. How are you today
    • Add your answer
  • Q3. How many family members are there in ur family
    • Add your answer

Skills evaluated in this interview

Business Development Manager Interview Questions & Answers

Wistron user image Anonymous

posted on 17 Feb 2022

Round 1 - Group Discussion 

Group discussion

Round 2 - Case Study 

Case study

Round 3 - Assignment 

Assignment

Round 4 - HR 

(2 Questions)

  • Q1. What are your salary expectations?
    • Add your answer
  • Q2. Coding test
    • Add your answer
More about working at TE Connectivity

TE Connectivity Interview FAQs

How many rounds are there in TE Connectivity Research and Development Product Development Engineer interview?
TE Connectivity interview process usually has 3 rounds. The most common rounds in the TE Connectivity interview process are Technical, One-on-one Round and Resume Shortlist.
How to prepare for TE Connectivity Research and Development Product Development Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at TE Connectivity. The most common topics and skills that interviewers at TE Connectivity expect are New Product Development, CAD, Product Design, Sheet Metal and 3D Modeling.
What are the top questions asked in TE Connectivity Research and Development Product Development Engineer interview?

Some of the top questions asked at the TE Connectivity Research and Development Product Development Engineer interview -

  1. Create 3d part in C...read more
  2. Question will be mainly based on what is mentioned in the Resume, few questions...read more
  3. Approach,method, alternative solution improvement and soo ...read more

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TE Connectivity Research and Development Product Development Engineer Interview Process

based on 3 interviews

Interview experience

4
  
Good
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TE Connectivity Research and Development Product Development Engineer Salary
based on 83 salaries
₹5 L/yr - ₹14 L/yr
14% more than the average Research and Development Product Development Engineer Salary in India
View more details

TE Connectivity Research and Development Product Development Engineer Reviews and Ratings

based on 8 reviews

3.7/5

Rating in categories

4.1

Skill development

2.9

Work-life balance

2.9

Salary

3.5

Job security

3.6

Company culture

2.2

Promotions

3.3

Work satisfaction

Explore 8 Reviews and Ratings
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