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TE Connectivity Product Development Engineer Interview Questions and Answers

Updated 4 Oct 2024

TE Connectivity Product Development Engineer Interview Experiences

3 interviews found

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Aptitude Test 

Technical Aptitute and quantitative aptitude

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed before Mar 2023. There were 3 interview rounds.

Round 1 - HR 

(1 Question)

  • Q1. Just Self introduction and basic stuffs.
Round 2 - Technical 

(1 Question)

  • Q1. Mostly based on GD&T basics and other basic technical stuffs.
Round 3 - Technical 

(1 Question)

  • Q1. Basic technical things.

Interview Preparation Tips

Topics to prepare for TE Connectivity Product Development Engineer interview:
  • GD&T
  • CREO
  • DFMEA
  • Injection Moulding
Interview preparation tips for other job seekers - Learn about GD&T
Injection moulding
Plastics
Creo
DFMEA

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Q4. Advantages of async and threading and their scope.
Q5. 1)What is stack? 2)Overflowing condition for stack 3)What is bina ... read more

I applied via Naukri.com and was interviewed in Sep 2021. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. It is related to my experience. What are the stages in Product development. Defects of injection molding how to overcome those defects. Questions related to creo.
Round 2 - Technical 

(1 Question)

  • Q1. They asked about gd&t basics. No of symbols in gd&t. Related to my experience.
Round 3 - HR 

(7 Questions)

  • Q1. What are your salary expectations?
  • Q2. What is your family background?
  • Q3. Share details of your previous job.
  • Q4. Why are you looking for a change?
  • Q5. Where do you see yourself in 5 years?
  • Q6. What are your strengths and weaknesses?
  • Q7. Tell me about yourself.

Interview Preparation Tips

Interview preparation tips for other job seekers - Overall it is good experience.

Product Development Engineer Jobs at TE Connectivity

View all

Interview questions from similar companies

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Not Selected

I applied via LinkedIn and was interviewed in Aug 2024. There was 1 interview round.

Round 1 - Coding Test 

2 coding questions one was greedy and 2nd one was of dp.

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via LinkedIn and was interviewed in Jun 2024. There were 2 interview rounds.

Round 1 - Coding Test 

Java theory questions and system questions with 2 DSA question

Round 2 - Assignment 

System design question with api designs

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Naukri.com and was interviewed before Oct 2022. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Coding and testing questions
Round 3 - Technical 

(1 Question)

  • Q1. Technology related
Round 4 - HR 

(1 Question)

  • Q1. Salary discussion

I applied via Recruitment Consulltant and was interviewed before Aug 2021. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. What is aspect ratio?
  • Ans. 

    Aspect ratio is the ratio of an object's width to its height.

    • Aspect ratio is commonly used in design and engineering to maintain proportionality.

    • It is often expressed as a ratio, such as 16:9 for a widescreen TV.

    • Aspect ratio can affect the visual perception and usability of a product.

    • It is important to consider aspect ratio when designing graphics or layouts for different devices or mediums.

  • Answered by AI
  • Q2. How do you decide stackup?
  • Ans. 

    Stackup is decided based on the number of layers, signal integrity requirements, and manufacturing constraints.

    • Consider the number of layers required for the design

    • Evaluate signal integrity requirements and impedance control

    • Take into account manufacturing constraints such as minimum trace width and spacing

    • Balance cost and performance

    • Use simulation tools to optimize the stackup

    • Consult with PCB fabricators for their reco

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Need to improve skills on Highspeed concepts
Round 1 - Technical 

(1 Question)

  • Q1. Basic questions about your working in last company

Interview Preparation Tips

Interview preparation tips for other job seekers - Know about basics very well...Prepare very well
Interview experience
3
Average
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Walk-in and was interviewed in Dec 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

Mostly 1 round will be easy

Round 2 - One-on-one 

(1 Question)

  • Q1. Basics about digital electronic
Round 3 - HR 

(1 Question)

  • Q1. They want to know you are willing to join or not

Interview Preparation Tips

Topics to prepare for Foxconn Production Engineer interview:
  • Electronics
Interview preparation tips for other job seekers - In manufacturing department is suits for mens
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Referral and was interviewed in May 2024. There were 3 interview rounds.

Round 1 - HR 

(2 Questions)

  • Q1. How much experience in mobile manufacturing?
  • Ans. 

    I have 3 years of experience in mobile manufacturing.

    • Worked for 3 years in a mobile manufacturing company

    • Experience in designing and developing new mobile products

    • Knowledge of manufacturing processes and quality control in mobile industry

  • Answered by AI
  • Q2. Which company you are working?
Round 2 - Technical 

(2 Questions)

  • Q1. Tell me about job responsibilities?
  • Q2. Do you know about NPI ?
  • Ans. 

    NPI stands for New Product Introduction, the process of bringing a new product to market.

    • NPI involves concept development, design, testing, manufacturing, and launch of a new product.

    • It includes market research, competitive analysis, and customer feedback to ensure product success.

    • NPI aims to minimize time to market, reduce costs, and maximize product quality.

    • Examples of NPI include the launch of a new smartphone model...

  • Answered by AI
Round 3 - HR 

(1 Question)

  • Q1. Share me all documents and PF details.
  • Ans. 

    Documents and PF details can be shared upon request.

    • Documents such as project plans, design specifications, test reports, etc. can be provided.

    • PF details including contribution amounts, investment options, and withdrawal procedures can be shared.

    • It is important to ensure confidentiality and compliance with data protection regulations when sharing such information.

  • Answered by AI

TE Connectivity Interview FAQs

How many rounds are there in TE Connectivity Product Development Engineer interview?
TE Connectivity interview process usually has 2-3 rounds. The most common rounds in the TE Connectivity interview process are Technical, HR and Aptitude Test.
How to prepare for TE Connectivity Product Development Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at TE Connectivity. The most common topics and skills that interviewers at TE Connectivity expect are Product Development, Product Design, New Product Development, Plastic Product Design and Sheet Metal.
What are the top questions asked in TE Connectivity Product Development Engineer interview?

Some of the top questions asked at the TE Connectivity Product Development Engineer interview -

  1. It is related to my experience. What are the stages in Product development. D...read more
  2. They asked about gd&t basics. No of symbols in gd&t. Related to my experien...read more
  3. Mostly based on GD&T basics and other basic technical stuf...read more

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TE Connectivity Product Development Engineer Interview Process

based on 2 interviews

Interview experience

4
  
Good
View more
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TE Connectivity Product Development Engineer Salary
based on 138 salaries
₹4 L/yr - ₹15.1 L/yr
16% more than the average Product Development Engineer Salary in India
View more details

TE Connectivity Product Development Engineer Reviews and Ratings

based on 24 reviews

4.0/5

Rating in categories

3.8

Skill development

3.8

Work-life balance

3.4

Salary

4.0

Job security

4.1

Company culture

3.4

Promotions

3.6

Work satisfaction

Explore 24 Reviews and Ratings
Manager II R&D / Product Development Engineering - Signal Integrity

Bangalore / Bengaluru

10-14 Yrs

Not Disclosed

Manager I - R&D / Product Development Engineering

Bangalore / Bengaluru

15-19 Yrs

Not Disclosed

R&D / Product Development Engineer

Bangalore / Bengaluru

4-7 Yrs

₹ 6.5-9.4 LPA

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