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METAL FORM Design Engineer Interview Questions and Answers

Updated 8 Mar 2024

1 interview found

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Design Engineer Interview Questions

user image Anonymous

posted on 6 Mar 2024

Interview experience
5
 Excellent
Difficulty level
 Easy
Duration
 More than 8 weeks
Result
Selected  Selected

I applied via Walk-in and was interviewed in Feb 2024.

1 Interview Round

1

One-on-one Round (2 Questions)

  • Q1. How much years experience in npd?
  • Q2. Do you know about document?

Interview questions from similar companies

Interview experience
2
 Poor
Difficulty level
 Moderate
Duration
 2-4 weeks
Result
 No response

I applied via Referral and was interviewed in Jan 2024.

2 Interview Rounds

1

Tool test Round (2 Questions)

  • Q1. Tool test on catia v5
  • Q2. Model the given part from the 2d drawings
2

Technical Round (1 Question)

  • Q1. Fundamental questions regarding plastic design, gd&t, catia v5 and engineering drawing.

Interview Preparation Tips

Topics to prepare for Seoyon E-hwa Automotive Design Engineer interview:
  • Automotive plastic design using v5
  • Gd&t
  • Catia v5
Interview preparation tips for other job seekers - Commitment of 3 years been expected, in the selection process.
Interview experience
3
 Average
Difficulty level
 Easy
Duration
 Less than 2 weeks
Result
 No response

I applied via Approached by Company and was interviewed in Mar 2024.

1 Interview Round

1

Technical Round (1 Question)

  • Q1. Tool test on sheet metal

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well on sheeet metal and go for interviews'

Design Engineer Interview Questions

Marelli user image Anonymous

posted on 27 Feb 2022

I applied via Recruitment Consulltant and was interviewed in May 2021.

4 Interview Rounds

1

Resume Shortlist Round

Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
2

Technical Round (1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
3

Technical Round (1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
4

HR Round (1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Design Engineer Interview Questions

Marelli user image Anonymous

posted on 16 Apr 2015

4 Interview Rounds

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR
Interview experience
2
 Poor
Difficulty level
 Moderate
Duration
 2-4 weeks
Result
 No response

I applied via Referral and was interviewed in Jan 2024.

2 Interview Rounds

1

Tool test Round (2 Questions)

  • Q1. Tool test on catia v5
  • Q2. Model the given part from the 2d drawings
2

Technical Round (1 Question)

  • Q1. Fundamental questions regarding plastic design, gd&t, catia v5 and engineering drawing.

Interview Preparation Tips

Topics to prepare for Seoyon E-hwa Automotive Design Engineer interview:
  • Automotive plastic design using v5
  • Gd&t
  • Catia v5
Interview preparation tips for other job seekers - Commitment of 3 years been expected, in the selection process.
Interview experience
3
 Average
Difficulty level
 Easy
Duration
 Less than 2 weeks
Result
 No response

I applied via Approached by Company and was interviewed in Mar 2024.

1 Interview Round

1

Technical Round (1 Question)

  • Q1. Tool test on sheet metal

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well on sheeet metal and go for interviews'

Design Engineer Interview Questions

Marelli user image Anonymous

posted on 27 Feb 2022

I applied via Recruitment Consulltant and was interviewed in May 2021.

4 Interview Rounds

1

Resume Shortlist Round

Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
2

Technical Round (1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
3

Technical Round (1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
4

HR Round (1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Design Engineer Interview Questions

Marelli user image Anonymous

posted on 16 Apr 2015

4 Interview Rounds

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR

METAL FORM Interview FAQs

How many rounds are there in METAL FORM Design Engineer interview?
METAL FORM interview process usually has 1 rounds. The most common rounds in the METAL FORM interview process are One-on-one Round.

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based on 1 METAL FORM interview
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METAL FORM Design Engineer Salary
based on 6 salaries
₹2.5 L/yr - ₹4.1 L/yr
34% less than the average Design Engineer Salary in India
View more details

METAL FORM Design Engineer Reviews and Ratings

based on 1 review

4.0/5

Rating in categories

3.0

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1.0

Work-Life balance

3.0

Salary & Benefits

4.0

Job Security

4.0

Company culture

2.0

Promotions/Appraisal

3.0

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