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Joy Global Design Engineer Interview Questions and Answers

Updated 9 Jan 2025

Joy Global Design Engineer Interview Experiences

1 interview found

Design Engineer Interview Questions & Answers

user image prasad kothawade

posted on 9 Jan 2025

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Recruitment Consulltant and was interviewed before Jan 2024. There was 1 interview round.

Round 1 - Technical 

(3 Questions)

  • Q1. What is the ISO standard number for welding?
  • Ans. 

    ISO standard number for welding is ISO 9606.

    • ISO 9606 specifies the qualification testing of welders for fusion welding.

    • It covers arc welding, gas welding, resistance welding, and brazing processes.

    • The standard ensures that welders have the necessary skills and knowledge to produce quality welds.

  • Answered by AI
  • Q2. What are the different types of welding symbols?
  • Ans. 

    Different types of welding symbols include fillet weld symbols, groove weld symbols, plug and slot weld symbols, and spot weld symbols.

    • Fillet weld symbols are used to represent a weld that is placed in the corner of two pieces of metal.

    • Groove weld symbols indicate a weld that fills a groove between two pieces of metal.

    • Plug and slot weld symbols represent welds that fill a hole or slot in one of the pieces being joined.

    • ...

  • Answered by AI
  • Q3. What is the minimum thickness required for the bending of materials?
  • Ans. 

    The minimum thickness required for bending materials depends on the material type, bending method, and equipment used.

    • Minimum thickness is influenced by material type - softer materials can be bent at thinner thicknesses compared to harder materials.

    • Bending method plays a role - air bending requires thicker materials compared to bottoming or coining.

    • Equipment used also affects minimum thickness - higher tonnage machine...

  • Answered by AI

Interview questions from similar companies

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - HR 

(1 Question)

  • Q1. Introduce yourself
Round 2 - Technical 

(1 Question)

  • Q1. Talk about your assignment

I applied via Recruitment Consulltant and was interviewed in May 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
Round 3 - Technical 

(1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
Round 4 - HR 

(1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - HR 

(1 Question)

  • Q1. Introduce yourself
Round 2 - Technical 

(1 Question)

  • Q1. Talk about your assignment

I applied via Recruitment Consulltant and was interviewed in May 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
Round 3 - Technical 

(1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
Round 4 - HR 

(1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR

Joy Global Interview FAQs

How many rounds are there in Joy Global Design Engineer interview?
Joy Global interview process usually has 1 rounds. The most common rounds in the Joy Global interview process are Technical.
What are the top questions asked in Joy Global Design Engineer interview?

Some of the top questions asked at the Joy Global Design Engineer interview -

  1. What is the minimum thickness required for the bending of materia...read more
  2. What is the ISO standard number for weldi...read more
  3. What are the different types of welding symbo...read more

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Joy Global Design Engineer Interview Process

based on 1 interview

Interview experience

4
  
Good
View more

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