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Hi-Tech Investment Castings Design Engineer Interview Questions and Answers

Updated 10 Dec 2023

Hi-Tech Investment Castings Design Engineer Interview Experiences

1 interview found

Design Engineer Interview Questions & Answers

user image Jay Makwana

posted on 30 Apr 2023

Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Field Related 50 Marks M.C.Q Questions.

Round 3 - Technical 

(1 Question)

  • Q1. Mechanical Design Related Questions.

Interview questions from similar companies

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - HR 

(1 Question)

  • Q1. Introduce yourself
Round 2 - Technical 

(1 Question)

  • Q1. Talk about your assignment
Interview experience
2
Poor
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
No response

I applied via Referral and was interviewed in Jan 2024. There were 2 interview rounds.

Round 1 - Tool test 

(2 Questions)

  • Q1. Tool test on catia v5
  • Ans. A tool test will be conducted on catia v5 either a part or surface design
  • Answered Anonymously
  • Q2. Model the given part from the 2d drawings
Round 2 - Technical 

(1 Question)

  • Q1. Fundamental questions regarding plastic design, gd&t, catia v5 and engineering drawing.

Interview Preparation Tips

Topics to prepare for Seoyon E-hwa Automotive Design Engineer interview:
  • Automotive plastic design using v5
  • Gd&t
  • Catia v5
Interview preparation tips for other job seekers - Commitment of 3 years been expected, in the selection process.

I applied via Recruitment Consulltant and was interviewed in May 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
Round 3 - Technical 

(1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
Round 4 - HR 

(1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - HR 

(1 Question)

  • Q1. Introduce yourself
Round 2 - Technical 

(1 Question)

  • Q1. Talk about your assignment
Interview experience
2
Poor
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
No response

I applied via Referral and was interviewed in Jan 2024. There were 2 interview rounds.

Round 1 - Tool test 

(2 Questions)

  • Q1. Tool test on catia v5
  • Ans. A tool test will be conducted on catia v5 either a part or surface design
  • Answered Anonymously
  • Q2. Model the given part from the 2d drawings
Round 2 - Technical 

(1 Question)

  • Q1. Fundamental questions regarding plastic design, gd&t, catia v5 and engineering drawing.

Interview Preparation Tips

Topics to prepare for Seoyon E-hwa Automotive Design Engineer interview:
  • Automotive plastic design using v5
  • Gd&t
  • Catia v5
Interview preparation tips for other job seekers - Commitment of 3 years been expected, in the selection process.
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Gd & t and basic questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Good

I applied via Recruitment Consulltant and was interviewed in May 2021. There were 4 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Technical 

(1 Question)

  • Q1. Product knowledge such as DIS, Circuit Integration, Process of Complete Design Cycle.
Round 3 - Technical 

(1 Question)

  • Q1. Same sort of questions with some problems to be solved based on power supply sections, current and voltage calculation etc.
Round 4 - HR 

(1 Question)

  • Q1. Relocation, Salary Negotiation

Interview Preparation Tips

Interview preparation tips for other job seekers - Be technically sound and keep upgrading with the technology. Don't forget your basics and keep on learning. This will be enough to crack any interview.

Interview Preparation Tips

Round: Test
Experience: Ist round was writtn round, no neg marking (easy but be accurate),
total questions-90 (divided into 3 section) ,time alloted-90 min.
3 sections r as follows:-
sec A - 30 ques, technical(subjects including EDC,AIC,DLD,basic BEE)
sec B- 15 GK+15 quant(RS agrwal is more than enough )
sec C- 30 ques, bacis C and C++ (very easy)
they will judge u section wise
Tips: Most IMPORTANT part of placement is WRITTEN round, we were around 60-70 students in total and out of which only 7 were selected for further rounds
i suggest u all to prepare very well for this round and try to b very accurate,
solve RS agrawal or arun sharma(level 1 and solved question only) for quantitative aptitude, and for C questions solve from online site INDIABIX , you will find all questions are come from here only
Duration: 90 minutes
Total Questions: 90

Round: Technical Interview
Experience: Next is PI technical and questions asked to me :-
1)Tell me about urself(do include brief intro about your internship if u have done any otherwise no problem)
2)About my internship

suddenly he started asked question from C-
3)what is BIT FIELD?, MACROS? ,PREPROCESSOR? ,EXTERN?
4)Diff btw char array and int array?

then he switched to embedded system-
5)What are INTERRUPT?, EEPROM? , BAUD RATE?
6)About my Projects(i suggest u to all tell project related to embedded only)
7)FAV subject and question from it (do prepare atleast 2 subjects very well)
8)What is electronics, Telecommunication?
9)diff btw ETNT AND ECE?

then he asked some HR questions too:-
10)what is your STRENGTH AND WEAKNESS(support your answer with example)
11)where do u see urslf 5 yr from now?
12) hobby?
13) low pointer?
then he asked me to ask question:
i have asked 2 question:
14)who is your biggest competitor?
15)what is the hierarchy of this job post?
Tips: 1ST TECHNICAL
They will focus on 2 things only :
1)C(most imp) : even it is a core elex company but they will not going to take you if you dont know C,
must learn dis topics viz ARRAY, POINTER, STRUCTURE, 4 storage class,from yashwant kanetkar and solve question from INDIABIX

2) PROJECTS: Projects on EMBEDDED SYSTEMS only, as many projects as u have greater is the chance of your selection and try to explain it in detail as much as u can.

Round: HR Interview
Experience: its just a formality round if they called you for this round that means u r selected ,they just wanted to know if u r really interested for this job? and u willing to join there company or not..

Skill Tips: 2 kind of people can crack interviews in core companies,1 having good POINTERS , projects,good technical knowledgesecond having low pointer but MANY PROJECTS+GOOD TECHNICAL KNOWLEDGE +CONFIDENCENo doubt i lie on second criteria. After 6th sem my CPI was 7.61 only , therefore i already knew that its gonna be tuff for me to be selected in core company but i have done 10+ projects in EMBEDDED SYSTEMS and INTERNSHIP too, so i found it not a big deal for me,always remember CONFIDENCE is the key..best of luck \m/
College Name: NIT RAIPUR

Hi-Tech Investment Castings Interview FAQs

How many rounds are there in Hi-Tech Investment Castings Design Engineer interview?
Hi-Tech Investment Castings interview process usually has 3 rounds. The most common rounds in the Hi-Tech Investment Castings interview process are Technical, Resume Shortlist and Aptitude Test.

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Hi-Tech Investment Castings Design Engineer Interview Process

based on 1 interview

Interview experience

4
  
Good
View more

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₹2.1 L/yr - ₹3.8 L/yr
41% less than the average Design Engineer Salary in India
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