Ebm Papst Design Engineer Interview Questions and Answers

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Q1. What ever the new ideas
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Q1. Which type of field in previous working area
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Q2. How many years working experience and working time any improvement
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Q3. Work related question
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Q4. Why choose this type job
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Q1. Tell me about yourself?
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Q2. Why do we hire you?
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Q3. What salary did you expect
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Q1. Tell me about your job profile? Roles Responsibilities.
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Q2. Tell be about manufacturing process which you have been seen in your career
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Q3. What are core tools of AIAG?
Ans. 
Core tools of AIAG include FMEA, PPAP, MSA, SPC, and APQP.
• FMEA (Failure Mode and Effects Analysis) is used to identify and prioritize potential failure modes in a process.

• PPAP (Production Part Approval Process) is used to ensure that suppliers meet customer requirements.

• MSA (Measurement Systems Analysis) is used to assess the quality of measurement systems.

• SPC (Statistical Process Control) is used to monitor and contro...read more
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Q1. What are yours failures?
Ans. 
I have experienced failures in project deadlines, communication, and technical solutions.
• Missed project deadlines due to underestimating tasks

• Miscommunication with team members leading to misunderstandings

• Implemented technical solutions that did not meet requirements
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Q2. What are your achievements?
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Q3. What is heat treatment process
Ans. 
Heat treatment process is a method used to alter the physical and sometimes chemical properties of a material through heating and cooling.
• Involves heating the material to a specific temperature

• Holding it at that temperature for a set amount of time

• Then cooling it at a controlled rate

• Can be used to increase hardness, improve machinability, or enhance other properties

• Common techniques include annealing, quenching, temper
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Yes electrical design engineer releted questions

Q1. Self introductions
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Q2. Field related questions
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Q3. Software related questions
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Q1. Tell me About yourself
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Q2. Where you see yourself in next 3 years
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Q1. Tell me previous jobs profile
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Q2. Tell me your previous responsibilities
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Q3. Tell me your achievements
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Q1. Tell us about your Project
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Q2. Tell the difference between MOSFET and IGBT
Ans. 
MOSFET is faster and more efficient for high frequency applications, while IGBT is better for high voltage and high current applications.
• MOSFET stands for Metal-Oxide-Semiconductor Field-Effect Transistor, while IGBT stands for Insulated Gate Bipolar Transistor.

• MOSFET is faster and more efficient for high frequency applications, while IGBT is better for high voltage and high current applications.

• MOSFET has lower on-sta...read more
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Q3. Tell the principal of Sine wave inverter
Ans. 
A sine wave inverter is a type of power inverter that produces a smooth and consistent AC output waveform similar to that of utility power.
• Sine wave inverters are preferred for sensitive electronics as they provide clean power without distortion.

• They are more efficient and produce less audible noise compared to modified sine wave inverters.

• Examples of devices that benefit from sine wave inverters include laptops, TVs,
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Q4. What is CMOS Latchup
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CMOS latchup is a phenomenon in integrated circuits where parasitic thyristors are inadvertently triggered, causing a short circuit.
• CMOS latchup occurs when a parasitic structure in the CMOS device acts as a thyristor, leading to a low-impedance path between the power supply rails.

• It can result in excessive current flow, potentially damaging the device.

• Preventive measures include layout techniques, guard rings, and pro...read more
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Q5. How to Design an inductor
Ans. 
Designing an inductor involves determining the required inductance value, selecting the core material, calculating the number of turns, and designing the coil structure.
• Determine the required inductance value based on the application requirements.

• Select the appropriate core material based on factors such as frequency, current, and temperature.

• Calculate the number of turns using the formula N = sqrt((L * AL) / (Ae * Nt)...read more
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Group discussion with Plant Head and Manager (L1)

Q1. After Group Discussion direct with HR (L2)
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Q1. Technical knowledge about area
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Q2. English is required as fluent
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Question abou TPM, OEE, six Sigma, lean manufacturing,kaizen,poka yoke etc

Q1. No sales discuss the directly give you ofer with hike of 30-40%
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