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I applied via LinkedIn and was interviewed in May 2022. There were 2 interview rounds.
SoC architecture consists of multiple components like CPU, memory, peripherals, and interconnects. Transactions are done through buses.
SoC architecture includes a CPU, memory, peripherals, and interconnects
Interconnects are used to connect the components and enable communication
Transactions are done through buses like AXI, AHB, or APB
The components can be customized based on the application requirements
I applied via Campus Placement and was interviewed in Aug 2024. There was 1 interview round.
It was a mix of coursework questions and easy to med coding questions but the language was fixed in C
ARM Embedded Technologies interview questions for popular designations
I applied via LinkedIn and was interviewed in Dec 2023. There was 1 interview round.
Basic easy level coding question
I applied via Company Website and was interviewed in Dec 2021. There were 3 interview rounds.
I applied via LinkedIn and was interviewed in Aug 2020. There were 3 interview rounds.
I applied via Campus Placement and was interviewed in Jul 2020. There were 4 interview rounds.
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I applied via Company Website and was interviewed in Jan 2024. There were 2 interview rounds.
I applied via Approached by Company and was interviewed in May 2022. There were 5 interview rounds.
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