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I am excited to join WD because of their reputation for innovation and commitment to excellence.
I have been following WD's advancements in the field and am impressed by their cutting-edge technology.
I am eager to work with a team that is dedicated to pushing the boundaries of what is possible.
I believe that WD's values align with my own, and I am excited to contribute to their mission.
I am confident that WD will provid...
I applied via Smartr and was interviewed in Jul 2021. There were 5 interview rounds.
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I applied via Naukri.com and was interviewed before Mar 2023. There were 3 interview rounds.
PCIe Gen5 spec is the fifth generation of the Peripheral Component Interconnect Express standard for high-speed data transfer in computers.
PCIe Gen5 doubles the data transfer rate compared to PCIe Gen4, reaching up to 32 GT/s per lane.
It offers increased bandwidth and efficiency for high-performance computing and data center applications.
PCIe Gen5 is backward compatible with previous generations of PCIe, allowing for s...
Flow for hardware design involves the process of planning, designing, implementing, and testing hardware components.
Identifying requirements and constraints
Creating a high-level design
Developing detailed designs
Prototyping and testing
Iterating based on feedback
Finalizing design for production
Interview is simple and easy... directly went to the in depth questions
A wire harness is a collection of wires, cables, and connectors that transmit electrical signals and power between different components in a system.
Wire harnesses provide a neat and organized way to route and protect wires in a system.
They ensure proper connectivity and prevent wire damage or short circuits.
Wire harnesses simplify troubleshooting and maintenance by allowing easy identification and replacement of faulty...
Sputtering is a process used in manufacturing to deposit thin films of material onto a surface.
Sputtering is a physical vapor deposition technique.
It involves bombarding a target material with high-energy ions or atoms.
This bombardment dislodges atoms from the target material, which then deposit onto a substrate.
Sputtering is commonly used in the production of semiconductor devices, solar cells, and thin film coatings.
...
I applied via Approached by Company and was interviewed before Feb 2021. There were 3 interview rounds.
I applied via LinkedIn and was interviewed before Dec 2020. There were 3 interview rounds.
Some of the top questions asked at the Western Digital Staff Engineer interview for experienced candidates -
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