Technosoft Engineering Projects Limited Interview Questions, Process, and Tips

Basic aptitude written test

Q1. Basic mechanical questions like calculate force, Velocity
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Q2. Define mechanical properties
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Mechanical properties refer to the behavior of materials under applied forces, including strength, stiffness, toughness, and ductility.
• Mechanical properties include strength, stiffness, toughness, ductility, hardness, and fatigue resistance.

• Strength refers to the ability of a material to withstand an applied force without failure.

• Stiffness is the resistance of a material to deformation under load.

• Toughness is the abili...read more
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Q1. All questions asked about professional experience
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Q2. Basic questions related to product
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Q1. Questions regarding Why do you leaving previous job
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Q2. What is strength weakness etc
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Q1. Tell me about yourself
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I am a passionate content writer with a background in journalism and a love for storytelling.
• Experienced in creating engaging and informative content for various platforms

• Skilled in conducting research and interviews to gather information

• Proficient in SEO techniques to optimize content for search engines

• Strong attention to detail and ability to meet deadlines

• Examples: Wrote articles for a news website, managed social m
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Q2. Overall experience
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I have 3 years of experience in content writing for various industries, including technology, healthcare, and finance.
• Experience writing SEO-friendly content

• Ability to research and write on a wide range of topics

• Strong editing and proofreading skills

• Familiarity with content management systems like WordPress

• Experience creating engaging social media posts
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Its was based on mechanical and solidworks aptitude test

Cad test & technical

Q1. Explain PCB Design flow.
Ans. 
PCB Design flow involves schematic capture, component placement, routing, design verification, and manufacturing preparation.
• Schematic capture: Creating a visual representation of the circuit using software like Altium Designer or Eagle.

• Component placement: Placing components on the board to optimize signal integrity and minimize interference.

• Routing: Creating traces to connect components while considering factors like...read more
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Q2. Why ESD diodes are placed close to connector?
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ESD diodes are placed close to connector to protect the circuit from electrostatic discharge events.
• ESD diodes help to divert any electrostatic discharge away from the sensitive components connected to the connector.

• Placing ESD diodes close to the connector ensures that any ESD events are intercepted before reaching the rest of the circuit.

• ESD diodes provide a path of least resistance for the discharge to follow, prote...read more
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Q3. Crystal Placement & Routing to achieve required Frequency.
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Proper crystal placement and routing are crucial for achieving the required frequency in PCB design.
• Place the crystal as close as possible to the microcontroller to minimize trace length and interference.

• Route the crystal traces away from noisy components and high-speed signals to reduce interference.

• Use ground planes and proper decoupling capacitors to ensure a stable and clean signal.

• Avoid crossing crystal traces wit...read more
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Q4. EMI & EMC. Problems & Solutions.
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Q5. Kind of DRC errors faced.
Ans. 
Common DRC errors include clearance violations, trace width violations, and unconnected nets.
• Clearance violations occur when components are too close together

• Trace width violations happen when traces are too narrow

• Unconnected nets occur when a net is not properly connected to a component

• Other common DRC errors include overlapping objects and incorrect pad sizes
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Q6. Layer stack-up. Have you worked on Multilayer pcb & upto How many layer?
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Q7. What is High-speed frequency? Worked on high speed design?
Ans. 
High-speed frequency refers to signals that operate at a fast rate, typically in the GHz range, requiring careful design considerations.
• High-speed frequency signals operate in the GHz range

• Design considerations include impedance matching, signal integrity, and controlled impedance routing

• Examples of high-speed designs include DDR memory interfaces and high-speed serial communication interfaces
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Q1. How many layers worked on? How do you decide to go for multilayer?
Ans. 
I have worked on 4-10 layers. The decision to go for multilayer depends on complexity, signal integrity, and space constraints.
• Consider complexity of the design - more layers may be needed for complex circuits

• Evaluate signal integrity requirements - high speed signals may require multilayer PCBs

• Take into account space constraints - multilayer PCBs can help reduce size of the board

• Cost considerations - multilayer PCBs a...read more
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Q2. Whats going on currently in electronics world market?
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The electronics world market is currently experiencing advancements in IoT, AI, 5G technology, and sustainability.
• Rapid growth of Internet of Things (IoT) devices connecting everyday objects to the internet

• Advancements in Artificial Intelligence (AI) leading to smarter devices and automation

• Rollout of 5G technology enabling faster and more reliable wireless communication

• Focus on sustainability with eco-friendly materia...read more
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Q3. What is your current organization pcb design process?
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Q4. Kind of board worked on.
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Qualitative and quantitative questions

Q1. Based on Experience and technical knowledge.
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Q2. Any project that has been done by you. What was your role in that project.
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Q3. Manufacturing process and guidelines
Ans. 
Manufacturing process and guidelines are essential for ensuring quality and efficiency in production.
• Understanding the specific requirements of the product being manufactured

• Selecting the appropriate materials and tools for the manufacturing process

• Following established guidelines and standards to ensure consistency and quality

• Regularly monitoring and evaluating the manufacturing process for improvements

• Training and ed...read more
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Q1. Basic questions. Reason for leaving previous job.
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