Technosoft Engineering Projects Limited PCB Designer Interview Questions, Process, and Tips

PCB Design flow involves schematic capture, component placement, routing, design verification, and manufacturing preparation.

• Schematic capture: Creating a visual representation of the circuit using software like Altium Designer or Eagle.

• Component placement: Placing components on the board to optimize signal integrity and minimize interference.

• Routing: Creating traces to connect components while considering factors like...read more

ESD diodes are placed close to connector to protect the circuit from electrostatic discharge events.

• ESD diodes help to divert any electrostatic discharge away from the sensitive components connected to the connector.

• Placing ESD diodes close to the connector ensures that any ESD events are intercepted before reaching the rest of the circuit.

• ESD diodes provide a path of least resistance for the discharge to follow, prote...read more

Proper crystal placement and routing are crucial for achieving the required frequency in PCB design.

• Place the crystal as close as possible to the microcontroller to minimize trace length and interference.

• Route the crystal traces away from noisy components and high-speed signals to reduce interference.

• Use ground planes and proper decoupling capacitors to ensure a stable and clean signal.

• Avoid crossing crystal traces wit...read more

Common DRC errors include clearance violations, trace width violations, and unconnected nets.

• Clearance violations occur when components are too close together

• Trace width violations happen when traces are too narrow

• Unconnected nets occur when a net is not properly connected to a component

• Other common DRC errors include overlapping objects and incorrect pad sizes

High-speed frequency refers to signals that operate at a fast rate, typically in the GHz range, requiring careful design considerations.

• High-speed frequency signals operate in the GHz range

• Design considerations include impedance matching, signal integrity, and controlled impedance routing

• Examples of high-speed designs include DDR memory interfaces and high-speed serial communication interfaces

I have worked on 4-10 layers. The decision to go for multilayer depends on complexity, signal integrity, and space constraints.

• Consider complexity of the design - more layers may be needed for complex circuits

• Evaluate signal integrity requirements - high speed signals may require multilayer PCBs

• Take into account space constraints - multilayer PCBs can help reduce size of the board

• Cost considerations - multilayer PCBs a...read more

The electronics world market is currently experiencing advancements in IoT, AI, 5G technology, and sustainability.

• Rapid growth of Internet of Things (IoT) devices connecting everyday objects to the internet

• Advancements in Artificial Intelligence (AI) leading to smarter devices and automation

• Rollout of 5G technology enabling faster and more reliable wireless communication

• Focus on sustainability with eco-friendly materia...read more