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40 minutes 50 questions on C,c++,java,oops
1.5 hours and 3 question of leetcode medium
posted on 4 Jan 2025
I applied via Referral and was interviewed in Nov 2023. There were 3 interview rounds.
I applied via Referral and was interviewed in May 2023. There were 5 interview rounds.
Aptitude test based on OS DBMS CN pseudocodes etc
Was not able to clear first round as it was time bases with first come first coding round.Those people who will subkit righht answers in less time those were asked for coding round
I applied via Referral and was interviewed in Jul 2021. There were 3 interview rounds.
Solder paste is a material used in electronics manufacturing to connect components to printed circuit boards.
Solder paste is a mixture of metal alloy particles and flux.
It is applied to the pads on a printed circuit board before components are placed on top.
When heated, the solder paste melts and creates a bond between the component and the board.
Different types of solder paste are used for different applications, such...
I applied via Company Website and was interviewed in Jan 2022. There were 3 interview rounds.
Exl India
Amazon Sellers Services
Primus Global Technologies
GAMMON INDIA