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I applied via Referral and was interviewed before Aug 2023. There were 2 interview rounds.
Collaterals in PDK refer to additional files and documents that provide information and support for the Process Design Kit.
Collateral files may include documentation on process technology, design rules, device models, and simulation parameters
These collaterals help designers understand and utilize the PDK effectively
Examples of collaterals in PDK are process design rules (PDR), technology files, and layout design guide
Soft connect errors in LVS can be resolved by adjusting the connectivity rules and verifying the layout.
Review the connectivity rules to ensure they are correctly defined
Check for any missing or incorrect connections in the layout
Verify the layout against the design to identify and fix any discrepancies
Use debugging tools to pinpoint the source of the soft connect errors
Parasitics of a device refer to unwanted electrical properties that affect its performance.
Parasitics include resistance, capacitance, and inductance in a device.
They can cause signal delays, power losses, and interference.
Examples of parasitics are stray capacitance in a PCB trace or resistance in a wire.
Minimizing parasitics is crucial for optimizing device performance.
A MOS capacitor can be built by creating a metal-oxide-semiconductor structure.
Start by depositing a layer of oxide on a silicon substrate
Then deposit a layer of metal on top of the oxide
Finally, connect the metal layer to a terminal for the capacitor
I applied via Campus Placement and was interviewed before Jul 2022. There were 3 interview rounds.
HDL- Verilog coding, FSM, sequence detector.
verilog code for MUX, Sequence detector, half adder etc.
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Intel interview questions for popular designations
I applied via Company Website and was interviewed before Mar 2023. There was 1 interview round.
Get interview-ready with Top Intel Interview Questions
I applied via Company Website and was interviewed in Nov 2022. There were 3 interview rounds.
VLsi testing was the first interview alongwith concepts of drift velocity and charge carrier mobility.
Kinetic energy, potential energy and mobile carriers energy to future motivating electrons were considered and verified.
C++, Java, Google cloud architect were the jobs alongside with Google cloud shell editor.
I applied via Naukri.com and was interviewed in Jan 2023. There were 2 interview rounds.
I applied via Campus Placement and was interviewed before Aug 2023. There was 1 interview round.
I applied via Approached by Company and was interviewed in May 2022. There were 3 interview rounds.
The duration of Intel interview process can vary, but typically it takes about less than 2 weeks to complete.
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