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I applied via Campus Placement and was interviewed in Dec 2023. There was 1 interview round.
Latch is level triggered, while flip flop is edge triggered. Latch is asynchronous, while flip flop is synchronous.
Latch is level triggered, meaning it changes output based on the input level. Flip flop is edge triggered, meaning it changes output based on the edge of the clock signal.
Latch is asynchronous, meaning it can change output at any time. Flip flop is synchronous, meaning it changes output only at specific ti...
Amplitude modulation is a method used in electronic communication to encode information on a carrier wave by varying the amplitude of the wave.
Amplitude modulation involves varying the amplitude of a high-frequency carrier wave in proportion to the waveform being transmitted.
The modulating signal is the signal that contains the information to be transmitted.
The carrier wave is the high-frequency signal that is modulate...
Basic knowledge of C is mostly enough. But strong understanding is required. Bitwise operations, structures, pointers are very important. Knowledge about communication protocols will be advantage
I applied via Campus Placement and was interviewed before Feb 2023. There were 2 interview rounds.
Electronics and ice engine
I applied via LinkedIn
I applied via Recruitment Consultant and was interviewed in Feb 2021. There were 3 interview rounds.
I applied via Referral and was interviewed before Sep 2020. There were 3 interview rounds.
posted on 19 Jan 2021
I was interviewed in Jul 2020.
I have achieved several milestones throughout my career as a Senior Engineer.
Successfully led a team of engineers to develop and implement a new software system, resulting in a 20% increase in efficiency.
Received recognition for designing and implementing a cost-effective solution that reduced production downtime by 30%.
Contributed to the development of a groundbreaking technology that revolutionized the industry, lead...
posted on 1 Jun 2020
I applied via Naukri.com and was interviewed in May 2020. There were 4 interview rounds.
Die casting and machining defects are common in manufacturing processes.
Die casting defects include porosity, shrinkage, cold shuts, and flash.
Machining defects include burrs, chatter marks, and tool marks.
Die casting defects can be caused by improper temperature, pressure, or metal flow.
Machining defects can be caused by dull tools, improper speeds and feeds, or poor fixturing.
Defects can lead to part failure, reduced
Filling and high speed ratio formula is used to calculate the filling time of a container with a specific volume of liquid at a given flow rate.
Filling and high speed ratio formula is V/Q
V is the volume of the container and Q is the flow rate of the liquid
The formula is used to determine the time it takes to fill a container with a specific volume of liquid at a given flow rate
The higher the flow rate, the faster the c
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