Filter interviews by
I applied via Referral and was interviewed in Feb 2022. There was 1 interview round.
I applied via Referral and was interviewed in Feb 2022. There was 1 interview round.
I applied via Company Website and was interviewed in Aug 2023. There were 2 interview rounds.
I applied via Approached by Company and was interviewed in Mar 2022. There was 1 interview round.
I applied via Referral and was interviewed in May 2023. There were 5 interview rounds.
I applied via Referral and was interviewed in Jul 2021. There were 3 interview rounds.
Solder paste is a material used in electronics manufacturing to connect components to printed circuit boards.
Solder paste is a mixture of metal alloy particles and flux.
It is applied to the pads on a printed circuit board before components are placed on top.
When heated, the solder paste melts and creates a bond between the component and the board.
Different types of solder paste are used for different applications, such...
posted on 5 Jul 2022
I applied via Indeed and was interviewed in Jun 2022. There were 2 interview rounds.
Team Lead
49
salaries
| ₹3 L/yr - ₹6.2 L/yr |
Assistant Team Leader
36
salaries
| ₹1.8 L/yr - ₹3.8 L/yr |
Team Lead Operations
30
salaries
| ₹4.1 L/yr - ₹6.3 L/yr |
Business Development Associate
26
salaries
| ₹2.2 L/yr - ₹3.5 L/yr |
Assistant Manager
25
salaries
| ₹4.2 L/yr - ₹14.9 L/yr |
Practo
Primus Global Technologies
Amazon Sellers Services
TriGeo Technologies