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I applied via LinkedIn and was interviewed before Apr 2021. There was 1 interview round.
SMT process is a method of placing electronic components on a printed circuit board using surface mount technology.
Solder paste is applied to the board
Components are placed on the board using pick and place machines
Board is heated to melt the solder paste and create a connection between components and board
Reflow ovens are used to heat the board
Inspection is done to ensure proper placement and soldering
SMT process is f...
I applied via Approached by Company and was interviewed in Dec 2024. There were 2 interview rounds.
posted on 14 Jan 2025
I applied via campus placement at Indraprastha Institute of Information Technology (IIIT), Delhi and was interviewed in Dec 2024. There were 2 interview rounds.
MCQ questions in a time frame of 45 mins.
I applied via LinkedIn and was interviewed in Aug 2024. There were 2 interview rounds.
I am impressed by your company's innovative projects and collaborative work culture.
I admire the cutting-edge technology used in your projects
I am excited about the opportunity to work with a talented team
I value the emphasis on collaboration and continuous learning at your company
Take home, a basic crud application
I applied via Recruitment Consulltant and was interviewed in Aug 2024. There was 1 interview round.
Leetcode Medium quesions
I applied via Walk-in and was interviewed in Aug 2023. There was 1 interview round.
I applied via Campus Placement and was interviewed in Sep 2023. There were 2 interview rounds.
It was easy.The gd topic was based on the current affairs like chatgpt replaces human activities
I applied via Naukri.com and was interviewed in Feb 2021. There were 3 interview rounds.
posted on 16 Apr 2023
I was interviewed before Apr 2022.
based on 2 reviews
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Quality Engineer
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