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I applied via Company Website and was interviewed in Jul 2022. There were 2 interview rounds.
SMT process refers to the surface mount technology used in electronic manufacturing.
Involves placing electronic components directly onto the surface of a printed circuit board (PCB)
Uses pick-and-place machines, solder paste, and reflow ovens
Requires precise control of temperature, humidity, and cleanliness
Can be done with either leaded or lead-free solder
Commonly used in the production of smartphones, laptops, and othe
SMT components come in various package types.
Surface mount technology (SMT) components can be classified into various package types.
Some common package types include: chip resistors, capacitors, diodes, transistors, and integrated circuits (ICs).
Package types can be further classified as leaded or leadless, and as through-hole or surface mount.
Examples of leaded packages include: dual in-line package (DIP), small outli...
Maintenance is the process of ensuring that equipment, machinery, or systems are in good working condition.
Regular inspection and repair of equipment
Preventive maintenance to avoid breakdowns
Replacing worn-out parts
Cleaning and lubricating machinery
Ensuring safety standards are met
Keeping records of maintenance activities
Training personnel on proper use and maintenance of equipment
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I applied via Approached by Company and was interviewed before Feb 2021. There were 3 interview rounds.
A wire harness is a collection of wires, cables, and connectors that transmit electrical signals and power between different components in a system.
Wire harnesses provide a neat and organized way to route and protect wires in a system.
They ensure proper connectivity and prevent wire damage or short circuits.
Wire harnesses simplify troubleshooting and maintenance by allowing easy identification and replacement of faulty...
Sputtering is a process used in manufacturing to deposit thin films of material onto a surface.
Sputtering is a physical vapor deposition technique.
It involves bombarding a target material with high-energy ions or atoms.
This bombardment dislodges atoms from the target material, which then deposit onto a substrate.
Sputtering is commonly used in the production of semiconductor devices, solar cells, and thin film coatings.
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I applied via Campus Placement and was interviewed in Nov 2019. There were 3 interview rounds.
I applied via Naukri.com and was interviewed before Dec 2019. There were 5 interview rounds.
I applied via Walk-in and was interviewed before Aug 2020. There was 1 interview round.
I applied via Company Website and was interviewed in Jan 2022. There were 2 interview rounds.
Insulation
Insulate the panel
Use protective covers
Ensure proper grounding
Regular maintenance
UG cable laying process involves trenching, cable pulling, jointing, and testing.
Trenching is done to create a path for the cable and ensure proper depth
Cable pulling involves laying the cable in the trench and securing it with clamps
Jointing is done to connect two cables together using connectors and insulators
Testing is done to ensure the cable is properly installed and functioning
Criteria for UG cable laying include...
I applied via Walk-in and was interviewed before Feb 2022. There were 3 interview rounds.
I applied via Walk-in and was interviewed in May 2022. There were 3 interview rounds.
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Engineer
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| ₹1.6 L/yr - ₹5.8 L/yr |
Quality Engineer
47
salaries
| ₹1.8 L/yr - ₹4.5 L/yr |
Production Engineer
45
salaries
| ₹1.7 L/yr - ₹4 L/yr |
Assistant Manager
40
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| ₹5 L/yr - ₹11 L/yr |
Junior Engineer
33
salaries
| ₹1.5 L/yr - ₹2.8 L/yr |
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