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Visteon Hardware Design Engineer Interview Questions and Answers
Visteon Hardware Design Engineer Interview Experiences
1 interview found
Selected
I applied via Referral and was interviewed before Jul 2023. There were 2 interview rounds.
(5 Questions)
- Q1. Voltage divider based question
- Q2. Potentiometer based simple simple questions
- Q3. Diode circuits with resistor in series
- Ans.
Diode circuits with resistor in series are commonly used to control current flow and voltage levels in electronic circuits.
When a diode is connected in series with a resistor, the current flowing through the circuit is limited by the resistor.
The voltage drop across the diode remains relatively constant, while the voltage drop across the resistor depends on the current flowing through it.
This type of circuit is often u...
- Q4. Project based question in CV
- Q5. MOSFET region based medium diff. level question
1 hour test with main focus on work hour, and basic stuffs
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Interview Questionnaire
1 Question
- Q1. What is name mangling?
- Ans.
Name mangling is a technique used by compilers to give unique names to functions and variables to avoid naming conflicts.
Name mangling is used in C++ to support function overloading.
It is also used in Python to avoid naming conflicts in modules.
Name mangling can make it difficult to access variables and functions from outside the class in which they are defined.
In C++, name mangling can be seen by using the 'nm' comman
Skills evaluated in this interview
I applied via Naukri.com and was interviewed in Aug 2020. There were 3 interview rounds.
Interview Questionnaire
1 Question
- Q1. Past experience and communication skills
Interview Preparation Tips
I applied via Naukri.com and was interviewed before Jul 2020. There was 1 interview round.
Interview Questionnaire
1 Question
- Q1. Coming to AEM,Interviewer has covered all the topics.
Interview Preparation Tips
I applied via Job Fair and was interviewed before May 2021. There were 2 interview rounds.
(1 Question)
- Q1. What is your job role
Interview Preparation Tips
Interview Preparation Tips
Experience: Very basic Questions on Electronics and some Aptitude Questions stuffed with a few questions on c,c++ and Java . One can go through the Test easily if he/she is good at the basics ( Digital electronics , transistors , 8085 Processor Basics ) .
Round: Technical Interview
Experience: First is to specify your area of Interest . you will be tested completely on that . Since mine is hardware design profile , they asked me questions on very basic electronics like diodes, transistors, Mosfets , Opamps , Integrators, Current Mirrors , Differential Amplifiers . They just test how Confident you are . Interview happened for 45 mins .
Round: HR Interview
Experience: 3 min Interview with the HR . Just be very confident and praise Bosch.
General Tips: Be confident during the Interviews . If aiming for hardware design ( Automobile Electronics ) be thorough with the basics of Analog and Digital Electronics .
Skill Tips: Just be thorough with the Basics and most Important thing is to be very specific and clear about your area of Interest .
Skills:
College Name: NIT Surathkal
Interview Questionnaire
1 Question
- Q1. Questions were based on CV
Interview Preparation Tips
I applied via Walk-in and was interviewed before Feb 2021. There were 2 interview rounds.
(2 Questions)
- Q1. Depends on experience
- Q2. Related to systematic approach
- Ans. Problem solving tools, OEE, FPY, Root cause analysis. 14Q, 5S
Interview Preparation Tips
I applied via Naukri.com and was interviewed before Jul 2020. There were 5 interview rounds.
Interview Questionnaire
2 Questions
- Q1. How can you satisfy your job
- Q2. With hardwork and my experience
Interview Preparation Tips
Senior Engineer Interview Questions & Answers
Samvardhana Motherson Group
Anonymous
posted on 1 Jun 2020
I applied via Naukri.com and was interviewed in May 2020. There were 4 interview rounds.
Interview Questionnaire
3 Questions
- Q1. What are the die casting and machining defects?
- Ans.
Die casting and machining defects are common in manufacturing processes.
Die casting defects include porosity, shrinkage, cold shuts, and flash.
Machining defects include burrs, chatter marks, and tool marks.
Die casting defects can be caused by improper temperature, pressure, or metal flow.
Machining defects can be caused by dull tools, improper speeds and feeds, or poor fixturing.
Defects can lead to part failure, reduced
- Q2. What is the formula of filling and high speed ratio?
- Ans.
Filling and high speed ratio formula is used to calculate the filling time of a container with a specific volume of liquid at a given flow rate.
Filling and high speed ratio formula is V/Q
V is the volume of the container and Q is the flow rate of the liquid
The formula is used to determine the time it takes to fill a container with a specific volume of liquid at a given flow rate
The higher the flow rate, the faster the c
- Q3. Why do u want to join Motherson?
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