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Tata Electronics
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Elitmus ph test. Quantitative, logical and verbal. Then behavorial test.
I applied via Walk-in and was interviewed in Apr 2022. There were 2 interview rounds.
Networking
I applied via Campus Placement and was interviewed before Feb 2023. There were 2 interview rounds.
First round was aptitude based on common aptitude questions
I applied via Campus Placement and was interviewed in Feb 2022. There were 2 interview rounds.
Aptitude from elitmus test and technical basic
Tata Electronics interview questions for designations
I applied via Campus Placement and was interviewed before Mar 2021. There were 2 interview rounds.
It was conducted on elitmus.
I applied via Campus Placement and was interviewed in Dec 2020. There were 3 interview rounds.
Top trending discussions
posted on 30 Sep 2021
I applied via Referral and was interviewed in Mar 2021. There were 3 interview rounds.
I am a recent graduate with a degree in engineering. I have a strong passion for problem-solving and a desire to learn and grow in the field.
Recent graduate with a degree in engineering
Passionate about problem-solving
Eager to learn and grow in the field
I tend to overthink and sometimes struggle with delegation.
Overthinking can lead to analysis paralysis
Struggle with delegation can lead to taking on too much work
Working on prioritizing tasks and trusting team members can help overcome these weaknesses
posted on 2 Jul 2022
I applied via Campus Placement and was interviewed in Feb 2023. There were 3 interview rounds.
The aptitude was conducted on code cubes and testing platform in virtual environment
A wire harness is a collection of wires, cables, and connectors that transmit electrical signals and power between different components in a system.
Wire harnesses provide a neat and organized way to route and protect wires in a system.
They ensure proper connectivity and prevent wire damage or short circuits.
Wire harnesses simplify troubleshooting and maintenance by allowing easy identification and replacement of faulty...
Sputtering is a process used in manufacturing to deposit thin films of material onto a surface.
Sputtering is a physical vapor deposition technique.
It involves bombarding a target material with high-energy ions or atoms.
This bombardment dislodges atoms from the target material, which then deposit onto a substrate.
Sputtering is commonly used in the production of semiconductor devices, solar cells, and thin film coatings.
...
based on 2 interviews
2 Interview rounds
based on 15 reviews
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