Plating Department Interview Questions and Answers

Titration is a laboratory technique used to determine the concentration of a substance in a solution by reacting it with a known concentration of another substance.

• Titration involves adding a titrant (known concentration) to a solution containing an analyte (unknown concentration) until a reaction is complete.

• The point at which the reaction is complete is indicated by a color change or other observable change, and is u...read more

pH is a measure of the acidity or basicity of a solution, on a scale of 0 to 14.

• pH stands for 'potential of hydrogen'

• A pH of 7 is neutral, below 7 is acidic, and above 7 is basic

• The pH scale is logarithmic, meaning each whole number change represents a tenfold change in acidity or basicity

• pH is important in many fields, including chemistry, biology, and environmental science

Electroplating is a process of coating a metal object with a thin layer of another metal using electrolysis.

• A metal object is submerged in a solution containing ions of the metal to be plated.

• An electric current is passed through the solution, causing the metal ions to be attracted to the object and deposit on its surface.

• Electroplating is used to improve the appearance, durability, and corrosion resistance of metal ob...read more

Ni cr plating process involves electroplating nickel and chromium onto a metal surface.

• The process involves cleaning and preparing the metal surface before plating.

• The metal surface is then immersed in a solution containing nickel and chromium ions.

• An electric current is passed through the solution to deposit the nickel and chromium onto the metal surface.

• The thickness and quality of the plating can be controlled by ad...read more

Copper plating is a process of electroplating a layer of copper onto a metal surface.

• The metal surface is first cleaned and prepared for plating.

• The surface is then placed in an electrolyte solution containing copper ions.

• An electric current is passed through the solution, causing the copper ions to bond to the metal surface.

• The thickness of the copper layer can be controlled by adjusting the duration of the plating pr...read more