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HiTech Mobiles Mobile Repair Engineer Interview Questions, Process, and Tips

Updated 5 Jun 2023

HiTech Mobiles Mobile Repair Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in May 2023. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
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Round 2 - Technical 

(7 Questions)

  • Q1. How are reparing in folder
  • Ans. 

    Repairing in folder involves fixing issues related to software or hardware in mobile devices.

    • Identifying the issue by troubleshooting the device

    • Repairing or replacing faulty components

    • Testing the device after repair to ensure functionality

    • Providing customer with information on the repair process

    • Documenting the repair for future reference

  • Answered by AI
  • Q2. Mobile water damage are in mobile
  • Ans. Water damage in mobile are check work as mobile repair
  • Answered Anonymously
  • Q3. Why are mobile repair in folder
  • Ans. 

    Mobile repair in folder helps organize and categorize repair tasks efficiently.

    • Organizes repair tasks based on different issues or models

    • Makes it easier to track progress and prioritize tasks

    • Helps in storing important documents and tools related to specific repairs

  • Answered by AI
  • Q4. Charjing jack is not work
  • Q5. Check In mobile phone as on mobile check charjing patta in multi meter change in jack other wise changing in charjing patta
  • Q6. Change ic in mobile circuit board
  • Ans. 

    To change an IC in a mobile circuit board, you need to desolder the old IC and solder a new one in its place.

    • Use a soldering iron to carefully heat and remove the old IC from the circuit board

    • Clean the area where the old IC was located to ensure good contact for the new IC

    • Apply flux to the pads on the circuit board before soldering the new IC in place

    • Use a steady hand and proper technique to solder the new IC onto the ...

  • Answered by AI
  • Q7. Mobile stop on logo in ic up and down
  • Ans. 

    This issue is likely caused by a software problem, such as a corrupted operating system or a failed update.

    • Try restarting the phone by holding down the power button for a few seconds.

    • If that doesn't work, try booting into recovery mode and performing a factory reset.

    • If the issue persists, it may require flashing the firmware or replacing the IC chip.

    • Check for any recent software updates that may have caused the issue.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Mobile reparing in 6 months in experience

HiTech Mobiles Interview FAQs

How many rounds are there in HiTech Mobiles Mobile Repair Engineer interview?
HiTech Mobiles interview process usually has 2 rounds. The most common rounds in the HiTech Mobiles interview process are Resume Shortlist and Technical.
What are the top questions asked in HiTech Mobiles Mobile Repair Engineer interview?

Some of the top questions asked at the HiTech Mobiles Mobile Repair Engineer interview -

  1. Why are mobile repair in fol...read more
  2. How are reparing in fol...read more
  3. Change ic in mobile circuit bo...read more

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HiTech Mobiles Mobile Repair Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
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