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HiTech Mobiles Mobile Repair Engineer Interview Questions, Process, and Tips

Updated 5 Jun 2023

HiTech Mobiles Mobile Repair Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in May 2023. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(7 Questions)

  • Q1. How are reparing in folder
  • Ans. 

    Repairing in folder involves fixing issues related to software or hardware in mobile devices.

    • Identifying the issue by troubleshooting the device

    • Repairing or replacing faulty components

    • Testing the device after repair to ensure functionality

    • Providing customer with information on the repair process

    • Documenting the repair for future reference

  • Answered by AI
  • Q2. Mobile water damage are in mobile
  • Ans. Water damage in mobile are check work as mobile repair
  • Answered Anonymously
  • Q3. Why are mobile repair in folder
  • Ans. 

    Mobile repair in folder helps organize and categorize repair tasks efficiently.

    • Organizes repair tasks based on different issues or models

    • Makes it easier to track progress and prioritize tasks

    • Helps in storing important documents and tools related to specific repairs

  • Answered by AI
  • Q4. Charjing jack is not work
  • Q5. Check In mobile phone as on mobile check charjing patta in multi meter change in jack other wise changing in charjing patta
  • Q6. Change ic in mobile circuit board
  • Ans. 

    To change an IC in a mobile circuit board, you need to desolder the old IC and solder a new one in its place.

    • Use a soldering iron to carefully heat and remove the old IC from the circuit board

    • Clean the area where the old IC was located to ensure good contact for the new IC

    • Apply flux to the pads on the circuit board before soldering the new IC in place

    • Use a steady hand and proper technique to solder the new IC onto the ...

  • Answered by AI
  • Q7. Mobile stop on logo in ic up and down
  • Ans. 

    This issue is likely caused by a software problem, such as a corrupted operating system or a failed update.

    • Try restarting the phone by holding down the power button for a few seconds.

    • If that doesn't work, try booting into recovery mode and performing a factory reset.

    • If the issue persists, it may require flashing the firmware or replacing the IC chip.

    • Check for any recent software updates that may have caused the issue.

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Mobile reparing in 6 months in experience

Interview questions from similar companies

I applied via Campus Placement and was interviewed before Aug 2020. There were 4 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. It was mostly puzzles.
  • Q2. One algo question invoving recursive function .

Interview Preparation Tips

Interview preparation tips for other job seekers - For freshers - prepare puzzles and basic computer science fundamentals
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed before Feb 2023. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. DSA Questions on array/linkedlist
  • Q2. Spring Boot, Java OOPs,

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare DSA as each round they will focus on
with mix of other technicals like FE/BE developments
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Coding Test 

Senior Engineer from the team which is hiring you and an HR will join and you are given array, string and hashmap leetcode easy question and then some dbms queries to write. Once you solve that, engineer will ask tech related questions from your resume to see your understanding about those tech.

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare your resume. You should know everything about your resume
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-

I applied via Job Portal

Round 1 - Technical 

(2 Questions)

  • Q1. Technical questions on node js
  • Q2. Coding round which had 2 questions
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Approached by Company and was interviewed in Apr 2023. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

45 min of mcq question on java and reasoning and aptitude.

Round 3 - One-on-one 

(1 Question)

  • Q1. All question from java spring boot, microservices and rest api along with some basic design of database.
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via LinkedIn and was interviewed in Sep 2024. There were 3 interview rounds.

Round 1 - Coding Test 

Two coding questions and 8 MCQ's related to databases and springboot technologies.

Round 2 - Technical 

(1 Question)

  • Q1. Given arrays related problem to solve and some technical questions based on java springboot and mySql
Round 3 - Technical 

(2 Questions)

  • Q1. Discussed about the topics of threads and some other technical questions
  • Q2. Asked to solve the question related to Linked List.

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare the concepts in depth to understand perfectly. Setting the good standards on basics leads to solve most of the problems.
Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

It was wasy.And u can easily clear it by go through some basic topics

Round 3 - HR 

(2 Questions)

  • Q1. Personal stuffs Location allocate Family
  • Q2. Communication check Logical questions Certificates

Interview Preparation Tips

Interview preparation tips for other job seekers - Just go through the basics.Update with current technology
Round 1 - Aptitude Test 

Good

Round 2 - Technical 

(1 Question)

  • Q1. Tell me about urself

Interview Preparation Tips

Interview preparation tips for other job seekers - good luck all the best be confident
Round 1 - Aptitude Test 

App Test

Round 2 - Technical 

(1 Question)

  • Q1. About .NET technologies
Round 3 - HR 

(2 Questions)

  • Q1. Where do you see yourself in 5 years?
  • Q2. Tell me about yourself.

Interview Preparation Tips

Interview preparation tips for other job seekers - be confident and always stay focused

HiTech Mobiles Interview FAQs

How many rounds are there in HiTech Mobiles Mobile Repair Engineer interview?
HiTech Mobiles interview process usually has 2 rounds. The most common rounds in the HiTech Mobiles interview process are Resume Shortlist and Technical.
What are the top questions asked in HiTech Mobiles Mobile Repair Engineer interview?

Some of the top questions asked at the HiTech Mobiles Mobile Repair Engineer interview -

  1. Why are mobile repair in fol...read more
  2. How are reparing in fol...read more
  3. Change ic in mobile circuit bo...read more

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HiTech Mobiles Mobile Repair Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
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