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Carrier Embedded Firmware Engineer Interview Questions and Answers

Updated 7 Mar 2022

Carrier Embedded Firmware Engineer Interview Experiences

1 interview found

I applied via Naukri.com and was interviewed in Feb 2022. There were 2 interview rounds.

Round 1 - Group Discussion 

Basics of c, c++, python languages
Any one os environment

Round 2 - Technical 

(2 Questions)

  • Q1. Not yet done.,...,......
  • Q2. .. Not yet done.........

Interview Preparation Tips

Interview preparation tips for other job seekers - Know basics on what you are working on currently.. So that was enough to crack.. Any interview

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
No response

I applied via campus placement at Shri Ramdeo Baba Kamla Nehru Engineering College, Nagpur and was interviewed in Nov 2023. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. Based on 8051 Microcontroller
  • Q2. Tell me about yourself

Interview Preparation Tips

Interview preparation tips for other job seekers - They ask questions based on what you studied in your graduation
And they have their own Microcontroller NXP 8051
Questions revolves around this only
Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Mar 2024. There was 1 interview round.

Round 1 - Aptitude Test 

Simple 20 questions basic questions and c questions in 40 minutes 40 questions

Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Projects related questions
  • Q2. C program for array swapping
  • Ans. 

    A C program to swap elements in an array of strings

    • Use a temporary variable to swap elements in the array

    • Iterate through the array and swap elements at each index

  • Answered by AI

Skills evaluated in this interview

Interview experience
3
Average
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via campus placement at Walchand College of Engineering, Sangli and was interviewed in Sep 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

There were mostly embedded c programming questions, like what will be the output of the given code, what is the error that will occur if this program runs, etc. Lasted about 30 minutes.

Round 2 - Technical 

(1 Question)

  • Q1. Questions were on communications protocols like I2C, UART, SPI, etc. Working and block diagram of project, operating modes of a transistor.

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident .
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Naukri.com and was interviewed before Jun 2023. There were 2 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. Asked about my previous work experience
  • Q2. About my last project in detailed
Round 2 - HR 

(2 Questions)

  • Q1. About my personal information and related to carrier goal
  • Q2. About the expectation of compensation

Firmware Developer Interview Questions & Answers

Philips user image asish kumar mondal

posted on 15 Aug 2024

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Naukri.com and was interviewed in Feb 2024. There were 3 interview rounds.

Round 1 - Technical 

(3 Questions)

  • Q1. Difference between structure and union
  • Ans. 

    Structure is a collection of different data types under one name, while union is a single memory location that can hold different data types at different times.

    • Structure allows each member to have its own memory location, while union shares a single memory location for all members.

    • In a structure, all members can be accessed simultaneously, while in a union, only one member can be accessed at a time.

    • Example: struct Pers...

  • Answered by AI
  • Q2. What is structure padding and how to pack a structure
  • Ans. 

    Structure padding is adding empty bytes to align data in memory. Packing a structure removes padding to save memory.

    • Structure padding ensures that data members are aligned to memory boundaries for efficient access

    • Padding bytes are added between data members to ensure alignment

    • Packing a structure removes padding to save memory but may impact performance

    • Example: struct example { char a; int b; } - sizeof(struct example)

  • Answered by AI
  • Q3. How to check stack overflow
  • Ans. 

    To check for stack overflow, monitor stack usage and set a limit to trigger an alert if exceeded.

    • Monitor stack usage by tracking the stack pointer and comparing it to the stack size.

    • Set a limit for stack usage and trigger an alert if the limit is exceeded.

    • Use tools like stack analyzers or profilers to detect stack overflow.

    • Implement stack canaries or guard zones to detect stack corruption.

  • Answered by AI
Round 2 - Technical 

(2 Questions)

  • Q1. Difference between semafore and mutex
  • Ans. 

    A semaphore is a signaling mechanism while a mutex is a locking mechanism used to control access to shared resources in multithreaded environments.

    • Semaphore is used to control access to a pool of resources, while mutex is used to control access to a single resource.

    • Semaphores can be used to allow multiple threads to access a shared resource simultaneously, while mutex allows only one thread to access the resource at a ...

  • Answered by AI
  • Q2. How to set the priority of a task
  • Ans. 

    Task priority can be set using priority levels or scheduling algorithms in firmware development.

    • Use priority levels to assign importance to tasks

    • Higher priority tasks are executed before lower priority tasks

    • Implement scheduling algorithms like preemptive scheduling or round-robin scheduling to manage task priorities

  • Answered by AI
Round 3 - HR 

(1 Question)

  • Q1. Why you want to join philips

Skills evaluated in this interview

Interview experience
3
Average
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via campus placement at National Institute of Technology (NIT), Raipur and was interviewed in Aug 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

There were aptitude questions and c language output questions and embedded system questions

Round 2 - Technical 

(1 Question)

  • Q1. Linked list and bit manipulation and one puzzle
Round 3 - Technical 

(1 Question)

  • Q1. Bits manipulation and 3 mental ability or you can say aptitude questions
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. Basic about project
  • Q2. C coding question
Interview experience
3
Average
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Related embedded systems and manual testing

Interview Preparation Tips

Interview preparation tips for other job seekers - Experienced bad culture in company.... So much politics played by manager and team members...

Carrier Interview FAQs

How many rounds are there in Carrier Embedded Firmware Engineer interview?
Carrier interview process usually has 2 rounds. The most common rounds in the Carrier interview process are Group Discussion and Technical.
How to prepare for Carrier Embedded Firmware Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Carrier. The most common topics and skills that interviewers at Carrier expect are Embedded C, C++, Hardware Design, RTOS and SPI.

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