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SignOff Semiconductors Interview Questions and Answers

Updated 13 Feb 2024

SignOff Semiconductors Interview Experiences

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Physical Design Engineer Interview Questions & Answers

user image Pullepu Jaswanth

posted on 13 Feb 2024

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
2-4 weeks
Result
Selected Selected

I applied via LinkedIn and was interviewed before Feb 2023. There were 3 interview rounds.

Round 1 - HR 

(1 Question)

  • Q1. They asked about the basic hr related questions in the form
Round 2 - Technical 

(1 Question)

  • Q1. Basics of digital design, cmos basics
Round 3 - Technical 

(1 Question)

  • Q1. Full pnr flow about different stages
  • Ans. 

    The full PNR flow involves several stages in physical design engineering.

    • The first stage is floorplanning, where the overall chip layout is defined.

    • Next is power planning, which involves distributing power and ground networks.

    • After that comes placement, where the positions of the cells are determined.

    • Following placement is clock tree synthesis, which involves creating a clock distribution network.

    • The next stage is rout...

  • Answered by AI

Physical Design Engineer Interview Questions asked at other Companies

Q1. What are the conditions for an RC circuit to work as an integrator/differentiator Can you derive it with this circuit
View answer (1)

Jobs at SignOff Semiconductors

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Interview questions from similar companies

Software Engineer Interview Questions & Answers

MaxLinear user image Gayathri S ee15m052

posted on 4 Dec 2016

I applied via Campus Placement and was interviewed before Dec 2015. There were 2 interview rounds.

Interview Preparation Tips

Round: Test
Experience: It was a written test with some numerical aptitude questions and coding questions. The test was fairly easy
Duration: 1 hour

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There were 3 interview rounds.

Interview Preparation Tips

Round: Test
Experience: It was a written test with some numerical aptitude questions and coding questions. The test was fairly easy
Tips: Learn about pointers and using function pointers

Round: Technical Interview
Experience: First, I was asked to brief about the projects I have done so far. Then there were some questions about C programming like pointers, const pointers, storage classes, volatile keyword etc. It was followed by some basic questions about computer architecture, microcontroller, FPGA, RTOS

Round: Technical Interview
Experience: In this round I was asked to write algorithm for some simple problems like checking if a given integer (not string) is palindrome or not, checking if a number is a multiple of 3 (using bitwise operations) etc

College Name: IIT Madras

I applied via Campus Placement and was interviewed in Dec 2016. There were 5 interview rounds.

Interview Questionnaire 

2 Questions

  • Q1. Communication Concepts
  • Q2. Embedded Concepts

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisted based on CGPA and Profile
Tips: CGPA above 7.5 and Communication/CS based coursework/ability

Round: Test
Experience: C Coding Questions which checked basic knowledge of C
Tips: Brush up your C skills. Questions are easy but may require knowledge of stuff like what is big endian and little endian etc.
Duration: 1 hour 30 minutes
Total Questions: 12

Round: Technical Interview
Experience: My Communication relation concepts were tested. My Major Project was asked in detail.
Tips: If Comm background, prepare ITC, MultiCarrier/Wireless at a good level. If not they will ask C.

Round: Technical Interview
Experience: I was asked basic level embedded concepts.
Tips: Prepare on the following and similar stuff : How to implement a pseudo dynamic memory allocation using flash memory- which data structure to use. How does Inter Process Communication work. How does a multicore processor synchronizes its cores. If Comm background, give the TX and RX chain design (Wireless System Design)

Skills: Communication Systems, Embedded Systems, C Programming
College Name: IIT Madras

I applied via Referral and was interviewed before Jan 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Your Introduction

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident as you are this is the main thing that you should and tell all the things which you experienced in your last organization
Round 1 - Technical 

(1 Question)

  • Q1. In which face we develop PPAP documents
  • Ans. 

    PPAP documents are developed in the Production Part Approval Process (PPAP) face.

    • PPAP documents are developed during the production part approval process.

    • This is typically the fourth phase of the APQP (Advanced Product Quality Planning) process.

    • PPAP documents include items such as control plans, FMEAs, and measurement system analysis.

    • The purpose of PPAP is to ensure that all parts meet customer requirements and specifi...

  • Answered by AI
Round 2 - Technical 

(1 Question)

  • Q1. What is the shrinkage value of pa66
  • Ans. 

    The shrinkage value of pa66 varies depending on the specific grade and processing conditions.

    • Shrinkage is the reduction in size of a molded part as it cools and solidifies.

    • The shrinkage value of pa66 can range from 1.5% to 3.5%.

    • Factors that affect shrinkage include mold design, processing parameters, and part geometry.

    • It is important to account for shrinkage when designing molds and parts to ensure proper fit and funct

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident while you giving answers and you feel the answer is wrong then directly say it to interviewer that "No idea "

Interview Questionnaire 

1 Question

  • Q1. State machines
Interview experience
5
Excellent
Difficulty level
Hard
Process Duration
4-6 weeks
Result
Selected Selected

I applied via Company Website and was interviewed before Apr 2022. There were 5 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Double-check your resume for any spelling mistakes. The recruiter may consider spelling mistakes as careless behavior or poor communication skills.
View all tips
Round 2 - Coding Test 

Pointer and linked list

Round 3 - Case Study 

Pure technical on kernel programming

Round 4 - Technical 

(3 Questions)

  • Q1. Pure technical questions on background project
  • Q2. Mutex semaphore and spinlock
  • Q3. How you will achieve multi threaded programming
  • Ans. 

    Multi-threaded programming can be achieved by creating multiple threads that run concurrently.

    • Identify the tasks that can be executed in parallel

    • Create threads using threading libraries in the chosen programming language

    • Synchronize the threads to avoid race conditions and deadlocks

    • Use locks, semaphores, and mutexes to manage shared resources

    • Optimize the performance by balancing the workload among threads

  • Answered by AI
Round 5 - HR 

(1 Question)

  • Q1. Why you want to join this company
Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Oct 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Do not use an unprofessional email address such as cool_boy@email.com. It shows a lack of professionalism by the candidate.
View all tips
Round 2 - One-on-one 

(1 Question)

  • Q1. This was more like shortlisting round with manager. Asked about resume and previous work experience. Not much Technical questions.
Round 3 - One-on-one 

(5 Questions)

  • Q1. Python programming questions, Basics
  • Q2. Python oops concepts
  • Q3. What is module in Python
  • Ans. 

    A module in Python is a file containing Python code, which can define functions, classes, and variables.

    • Modules help organize Python code into reusable components

    • Modules can be imported into other Python scripts using the 'import' keyword

    • Examples of modules in Python include math, random, and os

  • Answered by AI
  • Q4. Python memory management
  • Q5. Basic Devops questions

Skills evaluated in this interview

I applied via Referral and was interviewed before Sep 2020. There was 1 interview round.

Interview Questionnaire 

2 Questions

  • Q1. Basic c programming
  • Q2. Previous experience questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Be honest. And prepare well in data structures

SignOff Semiconductors Interview FAQs

How many rounds are there in SignOff Semiconductors interview?
SignOff Semiconductors interview process usually has 3 rounds. The most common rounds in the SignOff Semiconductors interview process are Technical and HR.
How to prepare for SignOff Semiconductors interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at SignOff Semiconductors. The most common topics and skills that interviewers at SignOff Semiconductors expect are Sanction Screening, Perl, Social Work, VLSI and Physical Design.
What are the top questions asked in SignOff Semiconductors interview?

Some of the top questions asked at the SignOff Semiconductors interview -

  1. Full pnr flow about different sta...read more
  2. Basics of digital design, cmos bas...read more

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SignOff Semiconductors Interview Process

based on 1 interview

Interview experience

4
  
Good
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SignOff Semiconductors Reviews and Ratings

based on 30 reviews

4.4/5

Rating in categories

4.5

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4.5

Work-life balance

4.1

Salary

4.7

Job security

4.6

Company culture

4.3

Promotions

4.5

Work satisfaction

Explore 30 Reviews and Ratings
Design and Verification Manager

Bangalore / Bengaluru

10-20 Yrs

Not Disclosed

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