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QualComm Enterprises Engineering Intern Interview Questions and Answers

Updated 19 May 2024

QualComm Enterprises Engineering Intern Interview Experiences

1 interview found

Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via campus placement at Indian Institute of Technology (IIT), Roorkee and was interviewed before May 2023. There were 2 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. What is Elmore delay
  • Ans. 

    Elmore delay is a metric used in digital circuit design to estimate the delay of a signal traveling through a network of resistors and capacitors.

    • Elmore delay is used to estimate the time it takes for a signal to propagate through a network of RC elements.

    • It is calculated by summing the products of resistance and capacitance along the path of the signal.

    • Elmore delay is often used in timing analysis of digital circuits ...

  • Answered by AI
  • Q2. Explain different types of flip flops ,.
  • Ans. 

    Flip flops are sequential circuits used in digital electronics to store one bit of information.

    • SR flip flop: basic flip flop with two inputs (S and R) and two outputs (Q and Q').

    • D flip flop: data flip flop with single data input (D) and clock input (CLK).

    • JK flip flop: versatile flip flop with J, K, and clock inputs.

    • T flip flop: toggling flip flop with single input (T) and clock input.

  • Answered by AI
Round 2 - HR 

(1 Question)

  • Q1. Hr round was just a formality, only basic questions like how was interview , etc.

Interview questions from similar companies

Interview experience
4
Good
Difficulty level
Easy
Process Duration
2-4 weeks
Result
Selected Selected

I applied via campus placement at National Institute of Technology (NIT), Calicut and was interviewed in Oct 2023. There were 4 interview rounds.

Round 1 - Aptitude Test 

First was a logical and cognitive reasoning round. The questions were pretty standard and almost 70 percentage got through

Round 2 - Coding Test 

Two simple coding questions

Round 3 - Communication Test 

(1 Question)

  • Q1. Basic English listening and speaking tests
Round 4 - One-on-one 

(2 Questions)

  • Q1. Asked a few technical questions (diff between c and cpp, use of pointers etc)
  • Q2. Then the rest was HR

Interview Preparation Tips

Interview preparation tips for other job seekers - Make a good set if answers to the cliche HR questions. The other rounds are simple
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via campus placement at Velammal Engineering College, Chennai and was interviewed before Sep 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

Time and work, problems on ages, hcf and lcm

Round 2 - HR 

(2 Questions)

  • Q1. What are your prevoius projects
  • Ans. 

    I have worked on projects involving designing a solar-powered car, developing a mobile app for tracking fitness goals, and creating a robotic arm for industrial automation.

    • Designed a solar-powered car for a university competition

    • Developed a mobile app using React Native for tracking fitness goals

    • Created a robotic arm prototype for industrial automation

  • Answered by AI
  • Q2. Questions on oops concepts

Interview Preparation Tips

Interview preparation tips for other job seekers - trust the process and prepare yourself
Interview experience
4
Good
Difficulty level
Easy
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Referral and was interviewed in Mar 2023. There were 2 interview rounds.

Round 1 - Aptitude Test 

Basic General question based on mathematics & physics and basics of OOPS & SDLC

Round 2 - HR 

(2 Questions)

  • Q1. What are ambitions
  • Q2. What are your expectations from the internship
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(2 Questions)

  • Q1. What is the content of BOM
  • Ans. 

    BOM stands for Bill of Materials, which is a comprehensive list of components, parts, and materials needed to manufacture a product.

    • BOM includes detailed information about each component such as part number, description, quantity, and unit of measure.

    • It helps in tracking and managing inventory, ordering materials, and estimating production costs.

    • BOM can be hierarchical, with sub-assemblies listed under main components.

    • ...

  • Answered by AI
  • Q2. How to draft through zuken
  • Ans. 

    Drafting through Zuken involves using their software tools for creating and editing electronic designs.

    • Use Zuken's software tools like CR-8000 or CADSTAR for drafting electronic designs

    • Create schematics, layout designs, and PCB designs using Zuken's software

    • Utilize features like auto-routing, design rule checks, and 3D visualization for efficient drafting

    • Collaborate with team members by sharing and reviewing designs wi

  • Answered by AI
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Naukri.com and was interviewed in Jun 2024. There were 3 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. What is list comprehension?
  • Ans. 

    List comprehension is a concise way to create lists in programming languages like Python.

    • List comprehension is a compact way to generate lists by applying an expression to each item in a sequence.

    • It is commonly used in Python and allows for more readable and efficient code.

    • Example: squares = [x**2 for x in range(10)] will create a list of squares of numbers from 0 to 9.

  • Answered by AI
  • Q2. Difference between list and tuple.
  • Ans. 

    List is mutable, tuple is immutable in Python.

    • List can be modified after creation, tuple cannot.

    • List uses square brackets [], tuple uses parentheses ().

    • List is used for collections of items that may change, tuple for fixed collections.

  • Answered by AI
Round 2 - Coding Test 

Coding related to list comprehension and searching an item.

Round 3 - HR 

(1 Question)

  • Q1. Company Overview and Salary discussion
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via LinkedIn and was interviewed in May 2024. There were 3 interview rounds.

Round 1 - Coding Test 

30min online test. Easy level.

Round 2 - Technical 

(2 Questions)

  • Q1. Technical interview with core concepts
  • Q2. Conceptual , core knowledge.
Round 3 - PdM discussion 

(1 Question)

  • Q1. Managereal round
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Aptitude Test 

Basic question analytical reasoning

Round 2 - Coding Test 

Java questions was easy

Round 3 - Technical 

(1 Question)

  • Q1. Opps concepts and techniques
  • Ans. 

    Object-oriented programming concepts and techniques

    • Encapsulation: Bundling data and methods that operate on the data into a single unit

    • Inheritance: Allowing a class to inherit properties and behavior from another class

    • Polymorphism: Ability for objects of different classes to respond to the same method call

    • Abstraction: Hiding the implementation details and showing only the necessary features of an object

  • Answered by AI
Round 4 - One-on-one 

(1 Question)

  • Q1. Self introduction then coding
Interview experience
4
Good
Difficulty level
-
Process Duration
-
Result
-
Round 1 - Technical 

(1 Question)

  • Q1. Java based questions
Interview experience
3
Average
Difficulty level
Hard
Process Duration
4-6 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in May 2024. There were 2 interview rounds.

Round 1 - Aptitude Test 

Moderate difficulty level questions were asked

Round 2 - Coding Test 

High difficulty level questions were asked

Interview Preparation Tips

Interview preparation tips for other job seekers - Tough process

QualComm Enterprises Interview FAQs

How many rounds are there in QualComm Enterprises Engineering Intern interview?
QualComm Enterprises interview process usually has 2 rounds. The most common rounds in the QualComm Enterprises interview process are Technical and HR.
What are the top questions asked in QualComm Enterprises Engineering Intern interview?

Some of the top questions asked at the QualComm Enterprises Engineering Intern interview -

  1. explain different types of flip flops...read more
  2. What is Elmore de...read more

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QualComm Enterprises Engineering Intern Interview Process

based on 1 interview

Interview experience

4
  
Good
View more

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