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I applied via Campus Placement
20 Aptitude questions of 1 mark each
posted on 19 Mar 2025
I appeared for an interview before Mar 2024, where I was asked the following questions.
I applied via Walk-in and was interviewed before Aug 2020. There was 1 interview round.
posted on 26 May 2021
Seam welding is a process of joining two metal sheets by creating a continuous seam along the joint. Bending of pipes is the process of shaping pipes into desired angles or curves. Welding materials are the materials used in welding processes.
Seam welding is commonly used in the automotive and aerospace industries.
Bending of pipes is done using specialized tools like pipe benders.
Welding materials include filler metals...
I applied via Referral and was interviewed in Mar 2021. There were 4 interview rounds.
I applied via Walk-in and was interviewed in Feb 2024. There were 2 interview rounds.
Improving production can be achieved by optimizing processes, increasing efficiency, and reducing waste.
Implement lean manufacturing principles to streamline operations
Invest in automation technology to increase productivity
Regularly analyze production data to identify bottlenecks and areas for improvement
Train employees on best practices and provide opportunities for continuous learning
Collaborate with suppliers to im
I applied via Naukri.com and was interviewed in Feb 2023. There were 4 interview rounds.
Reasoning test, numerical, verbal and inductive
posted on 28 Nov 2023
I applied via Walk-in and was interviewed in Oct 2023. There were 3 interview rounds.
I applied via Naukri.com and was interviewed in Jun 2023. There were 2 interview rounds.
I applied via Recruitment Consulltant and was interviewed in Aug 2023. There was 1 interview round.
The engine is a machine that converts fuel into mechanical energy to power vehicles, machines, or equipment.
Converts fuel into mechanical energy
Powers vehicles, machines, or equipment
Can be internal combustion engine or electric motor
A wire bonding machine is a tool used in semiconductor manufacturing to connect wires to semiconductor devices.
Wire bonding machines use heat, pressure, and ultrasonic energy to bond wires to semiconductor devices.
There are different types of wire bonding machines, such as ball bonding and wedge bonding machines.
Wire bonding is a crucial step in the production of integrated circuits and other semiconductor devices.
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