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I applied via Recruitment Consulltant and was interviewed in Aug 2023. There was 1 interview round.
The engine is a machine that converts fuel into mechanical energy to power vehicles, machines, or equipment.
Converts fuel into mechanical energy
Powers vehicles, machines, or equipment
Can be internal combustion engine or electric motor
A wire bonding machine is a tool used in semiconductor manufacturing to connect wires to semiconductor devices.
Wire bonding machines use heat, pressure, and ultrasonic energy to bond wires to semiconductor devices.
There are different types of wire bonding machines, such as ball bonding and wedge bonding machines.
Wire bonding is a crucial step in the production of integrated circuits and other semiconductor devices.
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I was interviewed in Jul 2017.
I applied via Campus Placement and was interviewed before May 2020. There was 1 interview round.
posted on 8 Jun 2017
I was interviewed before Jun 2016.
posted on 4 May 2022
I applied via Recruitment Consulltant and was interviewed in Nov 2021. There were 3 interview rounds.
posted on 7 Jan 2025
I applied via Referral and was interviewed in Nov 2021. There were 3 interview rounds.
posted on 13 Sep 2024
I applied via Campus Placement and was interviewed in Mar 2024. There were 3 interview rounds.
To apply my knowledge and skills in production engineering to contribute to the success of the organization.
To utilize my technical expertise in optimizing production processes and improving efficiency.
To work collaboratively with cross-functional teams to troubleshoot issues and implement solutions.
To ensure quality control measures are in place to meet production goals and standards.
To continuously learn and adapt to...
I am a dedicated and experienced Production Engineer with a strong background in manufacturing processes and quality control.
Bachelor's degree in Mechanical Engineering
5+ years of experience in production engineering
Proficient in CAD software and manufacturing processes
Led a team to improve production efficiency by 20% at my previous job
Yes, I am comfortable with location and willing to relocate if necessary.
I am open to relocating for the right opportunity
I have experience working in different locations
I am flexible and adaptable to new environments
posted on 7 Aug 2024
I applied via Walk-in and was interviewed before Aug 2023. There was 1 interview round.
I applied via Company Website and was interviewed in Nov 2022. There were 2 interview rounds.
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