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Pactron /HJPC Associate Firmware Engineer Interview Questions and Answers
Updated
24 Jun 2024
1 interview found
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Anonymous
Interview experience
Excellent
Difficulty level
Moderate
Duration
Less than 2 weeks
Result
Selected
I applied via Walk-in and was interviewed before Jun 2023.
3 Interview Rounds
1
Aptitude Test Round
Logical reasoning, coding, embedded related ques
2
Technical Round (2 Questions)
- Q1. Logical Gates, microcontroller processor difference, Basic embedded questions Add Answer
- Q2. Coding, array, shifting, pointers, datatypes, watchdog timer, counters Add Answer
3
HR Round (2 Questions)
- Q1. General hr discussion about salary Add Answer
- Q2. Company ethics and culture Add Answer
Interview Preparation Tips
Interview preparation tips for other job seekers - Very good company for freshers who has good knowledge on embedded systems
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2w (edited)
a consultant
Alternate documents for Employee verification?
My new employer asked for my previous offer letters and salary slips. When I inquired, they said it was for background verification.
However, I feel that providing these documents might affect salary negotiations, and it feels a bit unethical too.
What alternative documents can I provide for employment verification?
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Pactron /HJPC Interview FAQs
How many rounds are there in Pactron /HJPC Associate Firmware Engineer interview?
Pactron /HJPC interview process usually has 3 rounds. The most common rounds in the Pactron /HJPC interview process are Aptitude Test, Technical and HR.
What are the top questions asked in Pactron /HJPC Associate Firmware Engineer interview?
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based on 1 Pactron /HJPC interview
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