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Pactron /HJPC Associate Firmware Engineer Interview Questions and Answers

Updated 24 Jun 2024

Pactron /HJPC Associate Firmware Engineer Interview Experiences

1 interview found

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Selected Selected

I applied via Walk-in and was interviewed before Jun 2023. There were 3 interview rounds.

Round 1 - Aptitude Test 

Logical reasoning, coding, embedded related ques

Round 2 - Technical 

(2 Questions)

  • Q1. Logical Gates, microcontroller processor difference, Basic embedded questions
  • Q2. Coding, array, shifting, pointers, datatypes, watchdog timer, counters
Round 3 - HR 

(2 Questions)

  • Q1. General hr discussion about salary
  • Q2. Company ethics and culture

Interview Preparation Tips

Interview preparation tips for other job seekers - Very good company for freshers who has good knowledge on embedded systems

Pactron /HJPC Interview FAQs

How many rounds are there in Pactron /HJPC Associate Firmware Engineer interview?
Pactron /HJPC interview process usually has 3 rounds. The most common rounds in the Pactron /HJPC interview process are Technical, HR and Aptitude Test.
What are the top questions asked in Pactron /HJPC Associate Firmware Engineer interview?

Some of the top questions asked at the Pactron /HJPC Associate Firmware Engineer interview -

  1. Logical Gates, microcontroller processor difference, Basic embedded questi...read more
  2. Coding, array, shifting, pointers, datatypes, watchdog timer, count...read more

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Pactron /HJPC Associate Firmware Engineer Interview Process

based on 1 interview

Interview experience

5
  
Excellent
View more

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