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Mirafra Technologies Physical Design Engineer Interview Questions and Answers

Updated 1 Nov 2022

Mirafra Technologies Physical Design Engineer Interview Experiences

1 interview found

I applied via Referral and was interviewed before Nov 2021. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(2 Questions)

  • Q1. Interview based on EMIR ànalysis 1. Static and Dynamic Ir drop questions
  • Q2. Power and signal EM questions

Interview Preparation Tips

Interview preparation tips for other job seekers - Good to work here and give good training for freshers and lot of clients are there

Physical Design Engineer Jobs at Mirafra Technologies

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Interview questions from similar companies

Interview experience
3
Average
Difficulty level
-
Process Duration
Less than 2 weeks
Result
Not Selected

I was interviewed in Oct 2024.

Round 1 - Technical 

(5 Questions)

  • Q1. Describe the PD flow
  • Ans. 

    The PD flow is the process of designing the physical layout of integrated circuits.

    • Initial floorplanning to determine the placement of blocks and macros

    • Placement and optimization of standard cells

    • Routing of interconnects to connect the various components

    • Physical verification to ensure design rules are met

    • Timing closure to meet performance targets

  • Answered by AI
  • Q2. How to fix setup and hold violation
  • Ans. 

    Setup and hold violations can be fixed by adjusting timing constraints, optimizing clock tree, and redesigning critical paths.

    • Adjust timing constraints to allow more time for signals to propagate

    • Optimize clock tree to reduce clock skew and improve timing

    • Redesign critical paths by adding buffers or restructuring logic

    • Use ECO (Engineering Change Order) to make necessary changes without redoing the entire design

  • Answered by AI
  • Q3. What is you domain experties
  • Ans. 

    My domain expertise is in physical design engineering, specifically in the areas of floorplanning, placement, routing, and timing closure.

    • Floorplanning

    • Placement

    • Routing

    • Timing closure

  • Answered by AI
  • Q4. Why are you looking for job switch
  • Q5. Why does setup and hold ail on same path
  • Ans. 

    Setup and hold time violations can occur on the same path due to different reasons.

    • Timing violations can occur due to variations in process, voltage, and temperature (PVT)

    • Clock skew between different paths can lead to setup and hold violations on the same path

    • Issues with clock tree synthesis or routing can also contribute to setup and hold time violations

    • Improper constraints or incorrect timing analysis setup can resul

  • Answered by AI
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Campus Placement and was interviewed in Aug 2024. There were 3 interview rounds.

Round 1 - Aptitude Test 

Aotitude,core que on all subjects in ece

Round 2 - Technical 

(2 Questions)

  • Q1. INTERNSHIP EXPERIENCE
  • Ans. 

    I completed a 6-month internship at XYZ Company where I gained hands-on experience in physical design tools and methodologies.

    • Worked on floorplanning, placement, and routing of digital designs

    • Utilized tools such as Cadence Innovus and Synopsys ICC

    • Collaborated with cross-functional teams to optimize design performance

  • Answered by AI
  • Q2. ON DSD,VLSI,ANALOG ELECTRONICS
Round 3 - HR 

(2 Questions)

  • Q1. APTITUDE,MATH,VLSI,DSD
  • Q2. VLSI (HARD QUESTION BASED ON INDUSTRY LEVEL LIKE ON CIRCUIT HE GIVES ONE SCENARIO U HAVE TO ANSWER IT)

Interview Preparation Tips

Interview preparation tips for other job seekers - LEARN BASICS WELL
Interview experience
5
Excellent
Difficulty level
-
Process Duration
-
Result
-
Round 1 - One-on-one 

(1 Question)

  • Q1. Is setup and hold uncertainty values are different
  • Ans. 

    Yes, setup and hold uncertainty values are different in physical design engineering.

    • Setup uncertainty is related to the arrival time of the data signal at the input of the flip-flop, while hold uncertainty is related to the removal time of the data signal.

    • Setup time is the minimum amount of time the data input must be stable before the clock edge, while hold time is the minimum amount of time the data input must be sta...

  • Answered by AI
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
No response

I applied via Approached by Company and was interviewed in Apr 2023. There were 2 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Technical 

(8 Questions)

  • Q1. What are the PD inputs and outputs
  • Ans. 

    PD inputs are design specifications and constraints, while outputs are physical layout of the design.

    • Inputs include design specifications, constraints, technology libraries, and floorplan.

    • Outputs include physical layout, placement of components, routing of wires, and design verification.

    • Example: Input - RTL design, clock frequency, power constraints. Output - GDSII layout, timing analysis report.

  • Answered by AI
  • Q2. Describe each stage of PNR flow
  • Ans. 

    PNR flow consists of synthesis, floorplanning, placement, clock tree synthesis, routing, and signoff stages.

    • Synthesis: Convert RTL code to gate-level netlist

    • Floorplanning: Define chip area, core, and I/O locations

    • Placement: Place gates in specific locations to meet timing constraints

    • Clock tree synthesis: Create clock distribution network

    • Routing: Connect gates with wires while considering timing and congestion

    • Signoff: V...

  • Answered by AI
  • Q3. What are the different techniques to minimize congestion?
  • Ans. 

    Techniques to minimize congestion include buffer insertion, wire spreading, and layer assignment.

    • Buffer insertion: Adding buffers to critical paths to improve timing and reduce congestion.

    • Wire spreading: Distributing wires evenly to reduce congestion in specific areas.

    • Layer assignment: Properly assigning different signal layers to reduce congestion on a single layer.

  • Answered by AI
  • Q4. What is the setup and hold time and different techniques to fix the setup and hold time violations?
  • Ans. 

    Setup and hold time are timing constraints in digital circuits. Techniques to fix violations include adjusting clock skew, buffering signals, and optimizing routing.

    • Setup time is the minimum amount of time a data input must be stable before the clock edge for proper operation.

    • Hold time is the minimum amount of time a data input must be stable after the clock edge for proper operation.

    • Techniques to fix setup and hold ti...

  • Answered by AI
  • Q5. What is signal integrity?
  • Ans. 

    Signal integrity refers to the quality of an electrical signal as it travels through a circuit or system.

    • It involves ensuring that the signal remains clear and undistorted from the transmitter to the receiver.

    • Factors affecting signal integrity include impedance matching, noise, crosstalk, and reflections.

    • Signal integrity analysis is crucial in high-speed digital design to prevent data errors and ensure reliable communi...

  • Answered by AI
  • Q6. What is crosstalk and noise and how to fix it?
  • Ans. 

    Crosstalk is unwanted interference between signals on adjacent lines, while noise is random unwanted signals that can degrade performance.

    • Crosstalk occurs when signals on adjacent lines interfere with each other due to coupling effects.

    • Noise is random unwanted signals that can be caused by various sources such as electromagnetic interference or power supply fluctuations.

    • To fix crosstalk, techniques like spacing out lin...

  • Answered by AI
  • Q7. What is clock latency, skew and jitter?
  • Ans. 

    Clock latency is the delay between the clock signal being generated and reaching the destination, skew is the variation in arrival times of the clock signal at different destinations, and jitter is the variation in the period of the clock signal.

    • Clock latency is the delay between the clock signal being generated and reaching the destination.

    • Skew is the variation in arrival times of the clock signal at different destina...

  • Answered by AI
  • Q8. What is useful skew, negative skew and positive skew?
  • Ans. 

    Useful skew, negative skew, and positive skew are terms used in physical design to describe timing constraints.

    • Useful skew refers to intentional delay added to certain paths to meet timing requirements.

    • Negative skew occurs when data arrives later than expected, leading to potential timing violations.

    • Positive skew occurs when data arrives earlier than expected, potentially causing setup time violations.

    • Skew can be adjus...

  • Answered by AI

Interview Preparation Tips

Topics to prepare for DIGICOMM Semiconductor Physical Design Engineer interview:
  • STATIC TIMING ANALYSIS
  • Physical Design
  • FORMAL VERIFICATION
  • Physical Verification
Interview preparation tips for other job seekers - Learn basic concepts, go through company requirement and go through all the topics and Be confident while answering.

Skills evaluated in this interview

Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Recruitment Consulltant and was interviewed in Mar 2023. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Don’t add your photo or details such as gender, age, and address in your resume. These details do not add any value.
View all tips
Round 2 - Technical 

(2 Questions)

  • Q1. What is an ICG? How would you use it in the design?
  • Ans. 

    ICG stands for Inter-Chip Global. It is a network that connects multiple chips in a system.

    • ICG is used to transfer data between different chips in a system

    • It helps in reducing the number of wires required for communication between chips

    • ICG can be used in various design aspects such as clock distribution, power management, and data transfer

    • Example: In a multi-chip system, ICG can be used to transfer clock signals from o

  • Answered by AI
  • Q2. How will MSCTS help at SOC level CTS
  • Ans. 

    MSCTS can help in achieving better clock distribution and reducing skew at SOC level CTS.

    • MSCTS (Multi-Source Clock Tree Synthesis) can optimize the clock tree for better skew and jitter performance.

    • It can also help in reducing power consumption by optimizing the clock network.

    • MSCTS can handle multiple clock sources and ensure proper synchronization.

    • It can also help in meeting timing constraints and reducing clock tree ...

  • Answered by AI
Round 3 - Technical 

(2 Questions)

  • Q1. What was the most difficult challenge faced in the projects you worked?
  • Q2. How will you fix setup and hold time when both are violating at the same time.
  • Ans. 

    Fixing setup and hold time violations simultaneously requires adjusting clock timing and/or data path delays.

    • Identify the critical path causing the violations

    • Adjust the clock timing to meet setup and hold requirements

    • Adjust the data path delays to meet setup and hold requirements

    • Use tools like static timing analysis and delay calculation to determine necessary adjustments

    • Iteratively adjust timing and delays until viola

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - The interview was professional and technical. They asked all basic STA and PD Flow Questions. It is advisable to go through few topics like Low Power and STA before interview.

Skills evaluated in this interview

Interview experience
4
Good
Difficulty level
Easy
Process Duration
2-4 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in Feb 2024. There were 2 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. Basic MOS fundamentals and basic knowledge of high speed VLSI circuit design knowledge and how to optimize circuit for PPA metric.
Round 2 - Technical 

(1 Question)

  • Q1. VLSI fundamentals.

Interview Preparation Tips

Interview preparation tips for other job seekers - Be yourself and do not worry and get tensed. Always speak truth to your interviewers if they sensed something wrong they will make you shit your pants if your reply is not satisfactory and may even blacklist you.
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
4-6 weeks
Result
Selected Selected

I applied via Referral and was interviewed before Apr 2023. There were 3 interview rounds.

Round 1 - One-on-one 

(1 Question)

  • Q1. Asked the working experience and the related skills to the new job
Round 2 - Technical 

(1 Question)

  • Q1. Coding questions in Verilog, Systemverilog, random constraints such as how to write a onehot in different ways
Round 3 - HR 

(1 Question)

  • Q1. Asked the expectation of the base salary and overall compensation

Interview Preparation Tips

Topics to prepare for Micron Technology Verification Engineer interview:
  • SystemVerilog coding
Interview experience
4
Good
Difficulty level
Moderate
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Approached by Company and was interviewed before Apr 2023. There was 1 interview round.

Round 1 - Technical 

(2 Questions)

  • Q1. How to integrate and differentiate signals through software embedded c for 8 bit , 16 bit architecture
  • Ans. 

    Integrating and differentiating signals through software embedded C for 8-bit and 16-bit architecture involves utilizing appropriate data types and algorithms.

    • Use fixed-point arithmetic for 8-bit architecture to maintain precision

    • Leverage floating-point arithmetic for 16-bit architecture for higher precision

    • Implement algorithms like finite difference method for differentiation

    • Utilize digital signal processing technique...

  • Answered by AI
  • Q2. How to implement digital filter through software
  • Ans. 

    Digital filters can be implemented through software by using algorithms such as Finite Impulse Response (FIR) or Infinite Impulse Response (IIR).

    • Choose the appropriate filter type based on the desired frequency response and computational complexity

    • Implement the filter algorithm in the firmware code using programming languages like C or assembly

    • Optimize the filter design for efficient memory usage and processing speed

    • Te...

  • Answered by AI

Skills evaluated in this interview

Round 1 - Technical 

(1 Question)

  • Q1. About SV and UVM mainly and some questions from projects
Round 2 - Technical 

(2 Questions)

  • Q1. Mainly questions from Projects and coding
  • Q2. Write code for Hend shake in UVM
  • Ans. 

    Code for Handshake in UVM

    • Create a sequence item for handshake

    • Use a sequence to drive the handshake

    • Implement the handshake protocol in the driver and monitor

    • Use analysis ports to check for successful handshake

  • Answered by AI
Round 3 - HR 

(1 Question)

  • Q1. What are your salary expectations?

Interview Preparation Tips

Interview preparation tips for other job seekers - Prepare well all concepts in SV and UVM, coding will check in the second round and

Mirafra Technologies Interview FAQs

How many rounds are there in Mirafra Technologies Physical Design Engineer interview?
Mirafra Technologies interview process usually has 2 rounds. The most common rounds in the Mirafra Technologies interview process are Resume Shortlist and Technical.
How to prepare for Mirafra Technologies Physical Design Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Mirafra Technologies. The most common topics and skills that interviewers at Mirafra Technologies expect are Floor Planning, PNR, Physical Design, ICCU and Synthesis.
What are the top questions asked in Mirafra Technologies Physical Design Engineer interview?

Some of the top questions asked at the Mirafra Technologies Physical Design Engineer interview -

  1. Interview based on EMIR ànalysis 1. Static and Dynamic Ir drop questi...read more
  2. Power and signal EM questi...read more

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Mirafra Technologies Physical Design Engineer Salary
based on 54 salaries
₹5 L/yr - ₹16.1 L/yr
22% more than the average Physical Design Engineer Salary in India
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Mirafra Technologies Physical Design Engineer Reviews and Ratings

based on 6 reviews

3.3/5

Rating in categories

3.4

Skill development

3.3

Work-Life balance

3.4

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3.3

Job Security

3.3

Company culture

3.4

Promotions/Appraisal

3.3

Work Satisfaction

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