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Leica Microsystems Project Specialist Interview Questions and Answers

Updated 13 Nov 2020

Leica Microsystems Project Specialist Interview Experiences

1 interview found

I applied via Recruitment Consultant and was interviewed in May 2020. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Based upon previous job responsibilities

Interview Preparation Tips

Interview preparation tips for other job seekers - The interview process was lengthy of 4 rounds 1 round each week. After clearing all the rounds that my documents got submitted finally, and was hoping for joining soon, but then I didn't hear anything from them. After taking 5-6 follow-ups from the recruiter I was told that this position went on HOLD. And I have read many feedbacks on the interview process of this firm, most of them posted that mostly the position goes on hold. It's disappointing for candidates so dear hiring managers please plan your process. Practice professionalism.

Interview questions from similar companies

I applied via Recruitment Consulltant and was interviewed before Feb 2021. There were 2 interview rounds.

Round 1 - Technical 

(2 Questions)

  • Q1. Ultrasonic cutting, terms - urs fat sat pc oq pq
  • Q2. What is ultrasonic cutting
  • Ans. 

    Ultrasonic cutting is a process that uses high-frequency vibrations to cut through materials.

    • Uses ultrasonic vibrations to cut through materials

    • Commonly used in industries such as food, textiles, and plastics

    • Produces clean and precise cuts without creating debris or dust

    • Can be used to cut through materials that are difficult to cut with traditional methods

    • Examples include cutting cake, fabric, and carbon fiber

  • Answered by AI
Round 2 - Aptitude Test 

Psychometric test online

Interview Preparation Tips

Interview preparation tips for other job seekers - Be confident and share more about being a sme

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