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I applied via Naukri.com and was interviewed in Jun 2024. There was 1 interview round.
Resistance is the opposition to the flow of electric current.
Resistance is measured in ohms (Ω).
It is caused by the collisions of electrons with atoms in a conductor.
Higher resistance leads to lower current flow.
Resistance can be affected by factors like material, length, and temperature.
Examples: A light bulb has high resistance, while a wire has low resistance.
A capacitor is an electronic component that stores electrical energy in an electric field.
Capacitors consist of two conductive plates separated by an insulating material
They are used in electronic circuits to store and release energy quickly
Capacitors are commonly used in filtering, timing, and tuning circuits
Examples include electrolytic capacitors, ceramic capacitors, and tantalum capacitors
ESD stands for Electrostatic Discharge.
ESD is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown.
It can damage electronic components and integrated circuits.
ESD protection measures include using antistatic wrist straps, mats, and packaging materials.
Examples of ESD-sensitive devices are computer chips, circuit boards, and hard drives.
I applied via Campus Placement and was interviewed before May 2021. There were 3 interview rounds.
Maths, English Grammer, G.k
I applied via Naukri.com and was interviewed before May 2020. There were 4 interview rounds.
posted on 10 Feb 2024
ICT stands for Information and Communication Technology. It refers to the use of technology to manage and process information.
ICT encompasses a wide range of technologies, including computers, software, networks, and telecommunications.
It plays a crucial role in various sectors, such as education, business, healthcare, and government.
ICT enables efficient communication, data storage and retrieval, automation, and colla...
I appeared for an interview in Sep 2024.
I am seeking new challenges and opportunities for growth that align with my career goals and aspirations.
Desire for professional growth: I want to expand my skill set and take on more responsibilities.
Seeking a better work-life balance: My current role demands long hours, and I am looking for a position that allows for more flexibility.
Interest in a different company culture: I am looking for an environment that foster...
In my previous company, we served various clients in the automotive and electronics sectors, manufacturing high-quality components.
Our primary customers included automotive manufacturers like Ford and General Motors.
We produced electronic components such as circuit boards and sensors.
We also supplied parts to consumer electronics companies, enhancing their product reliability.
Collaboration with R&D teams helped us
Cpk measures process capability, indicating how well a process can produce parts within specification limits.
Cpk is calculated using the formula: Cpk = min(Cpu, Cpl), where Cpu = (USL - mean) / (3 * sigma) and Cpl = (mean - LSL) / (3 * sigma).
USL (Upper Specification Limit) and LSL (Lower Specification Limit) are the maximum and minimum acceptable values for a process.
A Cpk value of 1.33 is generally considered accepta...
I appeared for an interview in Feb 2025.
G Code is a programming language used to control CNC machines for manufacturing processes.
G Code consists of commands that tell the machine how to move, cut, or shape the material.
Each command starts with the letter 'G' followed by a number.
For example, G00 is a rapid move command, G01 is a linear interpolation command.
G Code can also include parameters like feed rate, spindle speed, and tool changes.
M codes are machine codes used in CNC programming to control auxiliary functions like coolant or tool changes.
M codes are used to activate or deactivate specific functions on a CNC machine.
They are typically followed by a number to specify the exact function to be performed.
Examples include M06 for tool changes and M08 for coolant activation.
I applied via Walk-in and was interviewed before Dec 2022. There were 2 interview rounds.
I applied via Campus Placement and was interviewed before Feb 2023. There were 3 interview rounds.
Will be asking questions from English, basic aptitude and physics background
based on 1 interview
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